Scanning Kelvin Probe (SKP50200) by KP Technology
| Origin | UK |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SKP50200 |
| Pricing | Available Upon Request |
Overview
The Scanning Kelvin Probe (SKP50200) is a non-contact, non-destructive surface potential measurement system based on the vibrating capacitor principle. It quantifies local work function (WF) or contact potential difference (CPD) across conductive, semiconducting, and insulating surfaces with sub-millielectronvolt sensitivity. Unlike electron spectroscopy or scanning tunneling techniques, SKP operates without charge injection, vacuum requirements, or surface metallization—making it uniquely suited for in situ, ambient, or controlled-atmosphere studies of functional materials. The SKP50200 leverages a precision electrostatic feedback loop between a mechanically oscillating microprobe and the sample surface to nullify capacitive current; the resulting bias voltage directly correlates to surface electronic structure. This principle enables nanoscale mapping of surface potential gradients arising from doping heterogeneity, interfacial band bending, corrosion initiation sites, photovoltage generation, or molecular dipole orientation—critical parameters in semiconductor device physics, corrosion science, and organic optoelectronics.
Key Features
- Work function resolution better than 3 meV—among the highest available commercially, enabled by low-noise electronics, optimized probe vibration control, and advanced signal demodulation algorithms.
- Programmable XY scanning range: configurable from 5 mm × 5 mm up to 300 mm × 300 mm (model-dependent); the SKP50200 supports mid-range macro-to-micro transition applications (e.g., wafer-scale defect localization and localized grain boundary analysis).
- Positional resolution down to 317.5 nm, achieved via high-precision stepper motor stages with optical encoder feedback and thermal drift compensation.
- Integrated Z-axis auto-height regulation using capacitive or optical distance sensing—maintains constant probe–sample gap (typically 10–100 µm) during topography-compensated CPD mapping, essential for quantitative reproducibility across rough or patterned substrates.
- Modular mechanical design compliant with ISO 14644-1 Class 5 cleanroom handling protocols; probe head assembly permits rapid exchange of tip geometries and environmental enclosures.
Sample Compatibility & Compliance
The SKP50200 accommodates electrically isolated or grounded samples ranging from rigid wafers and metal coupons to flexible polymer films and porous electrodes. No conductive coating is required. It complies with ASTM E2529-22 (Standard Guide for Kelvin Probe Force Microscopy) for surface potential calibration traceability and supports GLP-aligned data acquisition workflows—including timestamped metadata logging, user-access-controlled instrument configuration files, and audit-trail-enabled parameter changes. Optional nitrogen-purged or RH-controlled environmental chambers enable measurements under defined humidity (10–90% RH, ±2% accuracy) or inert atmospheres—critical for studying moisture-sensitive perovskites or oxide passivation layers. All hardware and firmware meet CE marking requirements for electromagnetic compatibility (EN 61326-1) and safety (EN 61010-1).
Software & Data Management
Acquisition and analysis are performed via SKPControl v5.x—a Windows-based application supporting real-time CPD visualization, multi-channel synchronized logging (e.g., simultaneous SKP + temperature + gas flow), and batch processing of large-area maps (>10⁶ pixels). Raw data is stored in HDF5 format with embedded calibration constants, stage coordinates, and environmental parameters—ensuring FAIR (Findable, Accessible, Interoperable, Reusable) data principles. Export options include CSV, TIFF, and MATLAB-compatible .mat files. Software supports 21 CFR Part 11-compliant user authentication, electronic signatures, and change history tracking when deployed in regulated QA/QC environments. Third-party integration is possible via TCP/IP API for synchronization with potentiostats, light sources, or environmental controllers.
Applications
- Mapping lateral work function variations in organic field-effect transistors (OFETs) and perovskite solar cells to correlate morphology with charge extraction efficiency.
- Early-stage corrosion monitoring: detecting anodic dissolution onset on coated steels or aluminum alloys through localized CPD shifts prior to visible pitting.
- Surface photovoltage (SPV) characterization under monochromatic LED or QTH illumination—quantifying built-in fields and minority carrier diffusion lengths in thin-film photovoltaics.
- Investigating dipole layer formation at self-assembled monolayer (SAM)/metal interfaces relevant to molecular electronics and biosensor design.
- Quality control of transparent conductive oxides (TCOs) and graphene transfer processes via uniformity assessment of surface potential across 150-mm wafers.
FAQ
Is vacuum operation required?
No. The SKP50200 operates reliably in ambient air, dry nitrogen, or controlled-humidity environments. Vacuum compatibility is optional via custom chamber integration.
Can it measure insulating samples?
Yes—surface potential (not bulk conductivity) is measured. Charge trapping effects may require stabilization time; results reflect the effective surface dipole layer.
What probe tip options are available?
Standard probes: gold-coated tungsten wire (Ø50 µm); customizable options include stainless steel (Ø100 µm–20 mm), platinum-iridium, and carbon fiber tips—selected based on chemical inertness, spatial resolution, and mechanical stability requirements.
How is calibration performed?
Calibration uses certified reference samples (e.g., Au(111), HOPG, or doped Si wafers) with traceable work function values. In-situ verification is supported via dual-probe differential mode to eliminate drift artifacts.
Does the system support automated long-term monitoring?
Yes—timelapse CPD mapping over hours/days is enabled by programmable pause/resume, thermal management, and power-fail recovery protocols.

