XG5500 Automated X-Ray Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Producer |
| Country of Origin | China |
| Model | XG5500-Automated |
| Pricing | Available Upon Request |
Overview
The XG5500 Automated X-Ray Inspection System is a high-resolution, industrial-grade non-destructive testing (NDT) platform engineered for precision internal defect detection in semiconductor packaging and microelectronic assemblies. Utilizing dual-axis digital radiography with a microfocus X-ray source (typically ≤ 5 µm focal spot size) and a high-dynamic-range flat-panel detector, the system captures real-time transmission images based on differential X-ray attenuation across material densities. Its core application lies in failure analysis and process validation for IC substrates, wire-bonded packages (e.g., QFN, BGA, SOP), and advanced heterogeneous integration modules. Unlike conventional XRD systems used for crystallographic phase identification, the XG5500 operates as an inspection tool grounded in radiographic contrast imaging—not diffraction—and is therefore classified under industrial X-ray imaging systems rather than X-ray diffractometers per ISO 17025 and IEC 62471 standards.
Key Features
- Fully automated stage control with programmable XYθZ motion, enabling batch scanning of up to 200 units/hour (depending on FOV and resolution settings)
- Integrated image enhancement suite including edge sharpening, dynamic range compression, and noise suppression via adaptive median filtering
- Dual-mode acquisition: High-speed preview mode (≥ 30 fps) for rapid positioning and high-resolution inspection mode (≤ 5 µm effective pixel pitch) for defect metrology
- Real-time geometric distortion correction using calibrated reference grids and motorized collimator alignment
- Modular software architecture compliant with SEMI E10 (Definition of Equipment Reliability and Maintainability) and supporting remote diagnostics via secure TLS 1.2 encrypted channels
Sample Compatibility & Compliance
The XG5500 accommodates standard JEDEC trays (TR-88, TR-113), gel-paks, waffle packs, and bare die on custom carriers up to 300 mm × 300 mm. It supports lead-free, copper-wire, aluminum-wire, and gold-wire bonded packages, as well as stacked-die and fan-out wafer-level packages (FOWLP). All radiation shielding meets IEC 61000-6-4 (EMC immunity) and GBZ 188–2014 (Chinese occupational exposure limits), with full compliance documentation available for GLP/GMP audit trails. System calibration adheres to ASTM E2737–21 (Standard Practice for Digital Radiographic System Qualification) and includes traceable NIST-traceable step wedges for density linearity verification.
Software & Data Management
The proprietary Zhengye XRayInsight™ software provides a validated workflow environment with role-based user access control (RBAC), electronic signature support per FDA 21 CFR Part 11, and immutable audit logging of all acquisition parameters, measurement annotations, and pass/fail decisions. Image data is stored in DICOM 3.0-compliant format with embedded EXIF metadata (kV, µA, exposure time, magnification, detector gain). Batch reporting exports PDF/A-2b and CSV files containing coordinate-tagged defect maps, statistical summaries (defect count per unit, positional clustering indices), and SPC-ready metrics compatible with JMP and Minitab. Data retention policies align with ISO 9001:2015 clause 7.5.3.
Applications
- Detection and classification of foreign objects within encapsulated ICs: metallic debris (e.g., solder splatter, tool fragments), residual bond wires, and unattached die fragments
- Wire bond geometry analysis: quantification of wire sweep (lateral displacement), loop height deviation (> ±5 µm tolerance band), flat-top formation, and collapse-induced short-circuit risk assessment
- Void detection in die attach layers and underfill materials using grayscale threshold segmentation and area-percentage void ratio calculation
- Lead frame integrity verification: crack propagation mapping, plating thickness uniformity estimation via dual-energy subtraction (optional upgrade)
- Post-reflow and post-mold inspection for automotive AEC-Q200 qualified components requiring zero-defect sampling plans (AQL=0.01)
FAQ
Is the XG5500 certified for use in ISO 13485 medical device manufacturing environments?
Yes — the system’s software validation package includes IQ/OQ/PQ protocols aligned with Annex A of ISO 13485:2016 and supports configurable alarm thresholds for critical defect classes per MDR Annex I essential requirements.
Can the XG5500 integrate with factory MES or SECS/GEM interfaces?
Yes — it provides native support for SEMI E30 (GEM) and E40 (SECS-II) communication protocols, with optional OPC UA server module for seamless integration into Industry 4.0 architectures.
What is the minimum detectable feature size for voids in epoxy mold compound?
Under standard 90 kV / 120 µA acquisition conditions and 5× geometric magnification, the system achieves ≥ 8 lp/mm limiting resolution, enabling reliable detection of voids ≥ 15 µm in diameter with >95% confidence at 99% reliability per MIL-STD-1916 sampling plans.
Does the system support AI-assisted defect classification?
Yes — optional DeepInspect™ add-on module implements transfer-learned CNN models trained on >2 million annotated IC radiographs; model retraining services are available under NDA with customer-supplied golden samples.
