Yuelian YL-S93 Electronic Tensile Testing Machine for Copper Foil Peel and Tensile Strength Testing

Overview

The Yuelian YL-S93 Electronic Tensile Testing Machine is a precision-engineered universal testing system designed specifically for mechanical characterization of thin metallic foils—particularly copper foil used in printed circuit board (PCB) manufacturing, lithium-ion battery anode substrates, and flexible electronics. It operates on the fundamental principle of uniaxial force application under controlled displacement rate, compliant with standardized tensile and peel test methodologies defined in ASTM D3330 (peel adhesion), GB/T 2792 (peel strength of pressure-sensitive tapes), and GB/T 1040 (tensile properties of plastics). The machine integrates a high-efficiency stepper motor drive, preloaded precision ground ball screw transmission (≥85% mechanical efficiency), and real-time dual-channel acquisition of load and displacement data. Its rigid C-frame architecture ensures minimal deflection during high-resolution force measurement, enabling reliable quantification of yield point, ultimate tensile strength, elongation at break, and 90° or 180° peel resistance—critical parameters for quality assurance in copper foil lamination and electrode coating processes.

Key Features

• High-precision force measurement with ±0.30% FS accuracy and 1/500,000 resolution across the full 10 N–1 kN range
• Adjustable crosshead speed from 0.1 to 500 mm/min, programmable via USB-connected PC or standalone controller
• 450 mm effective test stroke with micro-adjustment knobs for rapid specimen alignment and repeatability
• Modular quick-release fixture interface supporting ASTM-compliant peel jaws, tensile grips, shear fixtures, and ring tack holders
• Dual-mode operation: fully autonomous single-unit testing with built-in display interface or synchronized PC-based control via USB 2.0/RS-232
• Automated test termination logic including overload cutoff, specimen rupture detection, upper/lower limit enforcement, and auto-return-to-initial-position
• Multi-unit force conversion (N, kgf, lbf, g, ton, MPa) and real-time graphical plotting of stress–strain and peel-force–displacement curves

Sample Compatibility & Compliance

The YL-S93 accommodates a broad spectrum of planar and flexible substrates beyond copper foil—including aluminum foil, PET/PET-PI laminates, conductive adhesives, solder masks, and composite battery separators. Standardized test configurations comply with ISO 8510-2 (peel testing of bonded metals), ASTM D903 (peel resistance of adhesive bonds), GB/T 12914-1991 (tensile strength of paper and board), and GB/T 14344-2008 (tensile properties of chemical fibers). All hardware and firmware are engineered to support GLP/GMP-aligned documentation workflows, including user-accessible audit trails, password-protected method libraries, and timestamped raw data export in CSV and XML formats compatible with LIMS integration.

Software & Data Management

The included Yuelian TestSuite v3.2 software provides full test method definition, sequence automation, statistical analysis (mean, SD, CV%, min/max), and customizable report generation per ISO/IEC 17025 requirements. Raw data files retain native 10 kHz sampling fidelity and embed instrument calibration metadata. Software supports FDA 21 CFR Part 11-compliant electronic signatures, role-based user permissions, and encrypted local database storage. Export options include PDF reports with embedded graphs, Excel-compatible datasets, and direct thermal printer output via standard Windows drivers.

Applications

• Quantitative peel strength evaluation of rolled annealed (RA) and electrodeposited (ED) copper foils bonded to FR-4, polyimide, or ceramic substrates
• Tensile modulus and breaking elongation measurement of ultra-thin (<12 µm) copper foils under ISO 6892-1 quasi-static loading
• Interfacial adhesion assessment of copper–dielectric stacks in advanced packaging substrates
• Quality control of copper foil surface treatments (chromate, silane, benzotriazole) via comparative peel energy analysis
• R&D validation of novel alloyed or nanostructured copper foils for high-frequency PCBs and solid-state batteries
• Process qualification of roll-to-roll lamination parameters including temperature, pressure, and dwell time

FAQ

What standards does the YL-S93 directly support for copper foil peel testing?
ASTM D3330 Method B (180° peel), GB/T 2792, and ISO 8510-2—each implemented via preloaded test templates with automatic pass/fail flagging against user-defined thresholds.
Can the system perform constant-load hold tests for creep evaluation?
Yes—via software-defined hold duration and load maintenance mode, supporting up to 999 minutes at constant force with ±0.5% stability over time.
Is third-party calibration certification available?
Calibration certificates traceable to CNAS-accredited laboratories (ISO/IEC 17025) are provided upon request, with optional annual recalibration service contracts.
What is the maximum specimen width accommodated by standard fixtures?
Standard tensile grips accept specimens up to 110 mm wide; custom-width fixtures are available for wider foil rolls or laminated panels.
Does the system meet electromagnetic compatibility (EMC) requirements for lab environments?
Yes—the unit complies with GB/T 18268.1-2010 (IEC 61326-1) for industrial laboratory equipment, including conducted/radiated emission and immunity testing.