Zhengye ASIDAXG5000 Industrial Microfocus X-ray Inspection System

Overview

The Zhengye ASIDAXG5000 is an industrial-grade microfocus X-ray inspection system engineered for non-destructive internal analysis of high-density electronic and mechanical assemblies. Operating on the principle of differential X-ray absorption, the system generates high-contrast transmission images by directing a finely collimated 90 kV X-ray beam through the sample onto a high-resolution flat-panel detector. This enables visualization of sub-5 µm structural features—including voids, solder joint integrity, wire bonding alignment, die attach anomalies, and internal component displacement—without physical disassembly or sample preparation. Designed specifically for production-floor deployment in battery manufacturing, PCB assembly (PCBA), semiconductor packaging, automotive electronics, and advanced interconnect verification, the ASIDAXG5000 delivers repeatable metrology-grade imaging under controlled radiation safety protocols.

Key Features

• Sealed, maintenance-free microfocus X-ray tube (90 kV nominal output) with <5 µm focal spot size, ensuring high spatial resolution and minimal geometric unsharpness.
• Integrated high-voltage generator and X-ray tube architecture for enhanced thermal stability, reduced electromagnetic interference, and long-term operational consistency.
• Precision motion platform utilizing ground-class ball screws and stepper motor actuation, enabling smooth, backlash-free translation and rotation (±70° tilt capability) with positional repeatability ≤ ±2 µm.
• Automatic X-ray tube shutdown after 20 minutes of operator inactivity, plus real-time cumulative tube-on-time logging for predictive maintenance scheduling.
• Hardware-enforced safety interlocks: immediate X-ray emission cessation upon any door or shield access event; compliant with IEC 61000-6-4 (EMC) and IEC 62471 (photobiological safety) requirements.
• Radiation leakage <1 µSv/h at all external surfaces—verified per ISO 13302 and aligned with EU Directive 2013/59/Euratom occupational exposure limits.

Sample Compatibility & Compliance

The ASIDAXG5000 accommodates samples up to 300 mm × 300 mm × 150 mm (W×D×H) with maximum weight capacity of 5 kg. It supports both rigid (e.g., ceramic substrates, metal housings) and semi-flexible assemblies (e.g., flex-rigid PCBs, pouch cells). All system firmware and mechanical design comply with GB/T 18871-2002 (China’s basic standard for radiation protection) and are certified by the State Administration for Market Regulation (SAMR) for Class II radiation equipment registration. The system meets GLP-aligned documentation requirements for audit trails, user access logs, and image metadata embedding (DICOM-SR compatible), supporting traceability in regulated environments including ISO 9001-certified production lines and IATF 16949-compliant automotive supply chains.

Software & Data Management

The proprietary inspection software provides intuitive mouse-driven control of acquisition, manipulation, and analysis workflows. It supports both manual ROI-based measurement (length, angle, gap, area, grayscale thresholding) and automated defect recognition via configurable rule-based algorithms (e.g., missing solder, bridging, tombstoning). All image datasets are stored with embedded EXIF-style metadata—including kV/mA settings, magnification factor, detector gain, timestamp, and operator ID. Reports are exportable in PDF, CSV, and XML formats, with optional integration into MES/SPC platforms via OPC UA or RESTful API. Audit trail functionality satisfies FDA 21 CFR Part 11 requirements for electronic records and signatures when configured with role-based authentication and immutable log archiving.

Applications

• Battery cell and module inspection: electrode alignment, separator wrinkling, tab weld integrity, and electrolyte fill uniformity in Li-ion, solid-state, and pouch configurations.
• PCBA quality assurance: BGA/CSP void detection, solder fillet profiling, component polarity verification, and hidden-layer trace continuity assessment.
• Semiconductor packaging: die bond voiding, wire sweep validation, mold compound delamination, and lid seal integrity screening.
• Automotive ECU and sensor modules: connector pin coplanarity, conformal coating thickness estimation, and hermetic seal verification.
• Failure analysis labs: root cause identification of latent defects prior to accelerated life testing or field return investigation.

FAQ

What is the minimum detectable feature size under optimal conditions?
Under standard 90 kV operation with 1:100 geometric magnification and optimized detector binning, the system resolves features down to 5 µm with ≥3:1 contrast-to-noise ratio (CNR) in copper-on-silicon or solder-on-ceramic configurations.
Does the system support automated pass/fail classification?
Yes—the software includes configurable inspection recipes with tolerance-based thresholds and Boolean logic for binary decision output, exportable as CSV-linked SPC charts.
Is remote diagnostics and software update capability available?
Standard Ethernet connectivity enables secure remote support via TLS-encrypted VNC sessions; firmware updates are delivered as signed .pkg files with SHA-256 checksum verification.
Can the ASIDAXG5000 be integrated into a factory automation line?
It supports hardware trigger input (TTL) and programmable output signals (relay closure), enabling synchronization with conveyor belts, robotic loaders, and PLC-controlled staging systems.
What regulatory documentation is provided with shipment?
Each unit ships with SAMR Class II registration certificate, radiation safety test report (per GBZ 138-2020), CE Declaration of Conformity (for EMC and LVD), and full technical file compliant with ISO 13485 Annex C for medical device–adjacent applications.