Agilent VacIon Plus 500 Composite Ion-Getter Cryo Pump

Overview

The Agilent VacIon Plus 500 Composite Pump is an engineered solution for ultra-high vacuum (UHV) and extreme-high vacuum (XHV) environments where hydrocarbon-free, vibrationless, and magnetically quiet operation is essential. It integrates three complementary pumping technologies—sputter-ion pumping, non-evaporable getter (NEG) absorption via titanium sublimation pumping (TSP), and cryogenic surface condensation via a liquid-nitrogen-cooled cryopanel—within a single, compact ConFlat-integrated housing. This hybrid architecture leverages the strengths of each mechanism: ion pumps provide continuous, high-speed pumping of noble gases (He, Ne, Ar) and reactive species (N₂, O₂, CO); the TSP core delivers rapid, high-capacity sorption of H₂, CO, and residual water vapor upon thermal activation; and the cryogenic baffle enhances condensation efficiency for polar molecules (H₂O, CH₃OH, NH₃) while simultaneously shielding the TSP filament from backstreaming contaminants. The system operates without oil, moving parts, or external cooling loops—making it ideal for applications demanding long-term stability, low outgassing, and electromagnetic compatibility, such as particle detector systems, synchrotron beamlines, surface analysis chambers (XPS, AES, LEED), and quantum computing dilution refrigerator interfaces.

Key Features

• Triple-stage UHV/XHV pumping: integrated sputter-ion pump (500 L/s nominal for N₂), activated TSP core, and 8-inch OD cryogenic baffle with dual-mode cooling (LN₂ or water)
• Configurable ion pump element: selectable triode, diode, or inert-gas-optimized diode cathode assembly for enhanced He/Ar pumping speed and capacity
• Modular ConFlat interface architecture: standard 8-inch CF main inlet flange (non-rotating), plus optional side- or bottom-mounted 8-inch CF port for auxiliary instrumentation or differential pumping stages
• Dedicated 2.75-inch CF flange for TSP cartridge mounting—enabling field-replaceable getter elements without breaking main chamber vacuum
• Cryopanel geometry optimized to maximize effective surface area for Ti sublimation deposition while minimizing uncontrolled titanium film migration onto sensitive optics or detectors
• Integrated 120 VAC / 230 VAC heater for controlled bake-out compatibility up to 150 °C; supports full-system conditioning per ISO 20484 and ASTM E1968 standards
• Multiple feedthrough options available: Fischer, King, DESY, Varian, and SHV 10 kV (Safeconn) vacuum-rated electrical penetrations for HV biasing, temperature monitoring, and TSP activation control

Sample Compatibility & Compliance

The VacIon Plus 500 is compatible with stainless-steel (304L/316L), copper, and aluminum vacuum systems conforming to ASME B31.3 and ISO 14644-1 Class 1–3 cleanroom integration requirements. Its all-metal construction and absence of elastomers ensure compliance with outgassing specifications per ASTM E595 and ECSS-Q-ST-70-02C. The pump meets electromagnetic emission limits defined in CISPR 11 Group 1, Class A and supports audit-ready documentation packages for GLP/GMP-regulated research infrastructure. While not FDA-certified per se, its design aligns with 21 CFR Part 11 data integrity principles when paired with Agilent’s validated vacuum controller firmware (sold separately).

Software & Data Management

Control and monitoring are implemented via RS-232/RS-485 or optional Ethernet (TCP/IP) interface using Agilent’s proprietary Vacuum Control Suite v4.x. The software provides real-time telemetry—including ion pump current/voltage, TSP filament resistance, cryopanel temperature (via Pt100 sensor), and interlock status—with configurable alarm thresholds and automated log export in CSV or HDF5 format. All operational events—including bake-out cycles, TSP activation sequences, and fault recovery—are timestamped and stored with SHA-256 checksum integrity verification. Audit trail functionality satisfies traceability requirements under ISO/IEC 17025 and EU Annex 11 for analytical instrument qualification.

Applications

• Particle physics experiments requiring XHV stability (<10⁻¹¹ mbar) over multi-year operational lifetimes (e.g., dark matter detectors, neutrino observatories)
• Surface science platforms including scanning tunneling microscopy (STM), atomic force microscopy (AFM), and molecular beam epitaxy (MBE) growth chambers
• Nanofabrication tools operating under UHV conditions for graphene transfer, 2D material exfoliation, and quantum dot synthesis
• Space simulation facilities replicating interplanetary vacuum environments for satellite component testing
• Cryogenic quantum devices where magnetic field interference must be minimized—ion pump magnetic fields are actively compensated to <5 µT at 30 cm distance

FAQ

What is the maximum allowable bake-out temperature for the VacIon Plus 500?

The pump housing and internal components are rated for continuous operation at 150 °C; extended bake-out beyond this requires prior consultation with Agilent Technical Support.
Can the TSP core be replaced without venting the main vacuum chamber?

Yes—the 2.75-inch CF TSP port allows hot-swap replacement of getter cartridges while maintaining base pressure in adjacent sections via gate valve isolation.
Is LN₂ cooling mandatory for achieving XHV performance?

No. The cryopanel operates effectively in passive (uncooled) mode for UHV applications; LN₂ cooling is recommended only when accelerating water vapor removal or sustaining XHV during high gas loads.
Does the pump support remote diagnostics via network protocols?

Yes—Ethernet-enabled controllers support Modbus TCP and OPC UA for integration into facility-wide SCADA and CMMS platforms.
Are spare parts and calibration services available globally?

Agilent maintains certified service centers across North America, EMEA, and APAC offering on-site calibration, ion pump rejuvenation, and TSP reactivation per ISO/IEC 17025-accredited procedures.