C-Therm Trident Film Thermal Conductivity Analyzer
| Brand | C-Therm |
|---|---|
| Origin | Canada |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Trident Film |
| Instrument Type | Transient Plane Source (TPS) Method |
| Dimensions (L×W×H) | 40 × 40 × 40 cm |
| Accuracy | Better than 5% |
| Thermal Conductivity Range | 0 – 2000 W/m·K |
| Repeatability | Better than 1% |
| Compliance | ISO 22007-2, ASTM D7984, GB/T 32064 |
Overview
The C-Therm Trident Film Thermal Conductivity Analyzer is an advanced benchtop instrument engineered for high-precision thermal property characterization of thin-film materials. It implements the Flex TPS (Flexible Transient Plane Source) method—a standardized, non-destructive, and contact-based technique grounded in transient heat conduction theory. Unlike conventional steady-state or guarded-hot-plate approaches, the Flex TPS method applies a short-duration, low-energy thermal pulse via a dual-function sensor that simultaneously serves as both heater and temperature probe. The resulting time-resolved temperature response is modeled using Fourier heat conduction solutions under constant-power boundary conditions, enabling direct calculation of thermal conductivity (λ), thermal diffusivity (α), and volumetric heat capacity (ρcp). Designed specifically for films ranging from 20 µm to 1 mm in thickness, the system addresses long-standing metrological gaps in microscale thermal transport analysis—particularly where interfacial phonon scattering, substrate coupling, and dimensional confinement significantly perturb bulk-equivalent behavior.
Key Features
- Flex TPS sensor module optimized for thin-film geometry, with integrated calibration traceability to NIST-traceable reference materials
- Multi-sensor compatibility: supports interchangeable MTPS (Modified TPS), standard TPS, and TLS (Transient Line Source) modules for extended material coverage—from insulating polymers to high-conductivity metals and anisotropic composites
- Built-in environmental compensation for ambient temperature drift and humidity-induced thermal offset
- Automated sample alignment stage with micrometer-level Z-axis control for consistent sensor–film–substrate contact pressure
- Real-time thermal response acquisition at ≥10 kHz sampling rate, enabling robust signal-to-noise ratio even for ultra-thin, low-diffusivity layers
- Rugged aluminum chassis with EMI-shielded electronics enclosure, compliant with IEC 61326-1 for laboratory electromagnetic compatibility
Sample Compatibility & Compliance
The Trident Film analyzer accommodates freestanding films, coated substrates (e.g., SiO2/Si wafers, PET, PI, glass), and laminated multilayers—provided minimum lateral dimensions exceed 25 mm × 25 mm and surface roughness remains below Ra = 0.8 µm. Sample mounting requires no metallization, vacuum pumping, or cryogenic cooling, eliminating artifacts introduced by interfacial thermal resistance or thermal expansion mismatch. All measurements adhere strictly to ISO 22007-2:2015 (Plastics — Determination of thermal conductivity and thermal diffusivity — Part 2: Transient plane heat source (hot disc) method) and ASTM D7984-19 (Standard Test Method for Thermal Conductivity of Thin Solid Materials Using a Modified Transient Plane Source Technique). Data integrity meets GLP and GMP documentation requirements, with full audit trail support for FDA 21 CFR Part 11–compliant environments.
Software & Data Management
Trident Control Suite v4.x provides intuitive workflow-driven operation, including automated test sequencing, real-time curve fitting diagnostics, and uncertainty propagation modeling per GUM (JCGM 100:2008). Raw thermal transients are stored in HDF5 format with embedded metadata (sensor ID, calibration date, operator ID, environmental logs). Export options include CSV, MATLAB .mat, and ASTM E1447-compliant XML for LIMS integration. Software validation packages—including IQ/OQ documentation, password-protected user roles, electronic signatures, and version-controlled firmware updates—are available upon request for regulated laboratories.
Applications
- Thermal interface material (TIM) development for advanced packaging and 3D ICs
- Quality control of dielectric barrier films in flexible OLED and micro-LED displays
- Characterization of thermally conductive adhesives and encapsulants in power electronics
- Validation of phonon-engineered thin films for thermoelectric energy harvesting
- Process monitoring of ALD/CVD-grown transition metal dichalcogenides (TMDs) and hexagonal boron nitride (h-BN)
- Research into size-dependent thermal transport in 2D materials and van der Waals heterostructures
FAQ
What film thicknesses can be measured with the Flex TPS module?
The Flex TPS sensor is validated for films between 20 µm and 1 mm thick. For sub-20 µm layers, optional high-resolution sensor variants with reduced active area and enhanced signal conditioning are available.
Does the system require sample metallization or vacuum conditions?
No. The Flex TPS method operates in ambient air without surface modification or environmental chamber integration, distinguishing it from 3ω or TDTR techniques.
How does the Trident handle substrate effects in supported films?
The software includes a multi-layer analytical model that deconvolutes contributions from film, adhesive interface, and substrate based on known or independently measured substrate properties.
Can the same instrument test bulk solids and liquids?
Yes—by switching to the MTPS or TLS sensor modules, the Trident platform extends measurement capability across solids (0–500 W/m·K), powders, pastes, gels, and low-viscosity liquids (0.1–6 W/m·K), maintaining traceable accuracy per ISO/ASTM standards.
Is calibration performed in-house or by an accredited lab?
Each Flex TPS sensor ships with individual calibration certificates issued by C-Therm’s ISO/IEC 17025-accredited metrology laboratory, including uncertainty budgets and drift verification over 12-month intervals.
