Jianhu JH Series Semiconductor PI Curing Oven with Rapid Vacuum Pumping and Precision Humidity Control
| Brand | Jianhu |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Model | JH Series Semiconductor PI Curing Oven |
| Price Range | USD 900 – 9,000 |
Overview
The Jianhu JH Series Semiconductor PI Curing Oven is an engineered thermal processing system designed specifically for the controlled curing of polyimide (PI) films and adhesives in semiconductor packaging, MEMS fabrication, and advanced microelectronics assembly. Unlike standard convection ovens, this system integrates dual-critical environmental control modalities: rapid vacuum evacuation (down to ≤10 Pa typical base pressure) and active humidity regulation (±0.5% RH accuracy within 20–80% RH operating range). These capabilities enable true inert-atmosphere thermal treatment—eliminating oxidative degradation during high-temperature PI imidization (typically 250–400 °C), suppressing void formation from trapped moisture or solvent volatiles, and ensuring stoichiometric ring closure for optimal dielectric strength, thermal stability (>500 °C Tg), and dimensional fidelity. The oven’s architecture complies with cleanroom-compatible mechanical design principles (SS304 interior, electrostatic-dissipative gaskets, zero-oil vacuum path options), making it suitable for Class 1000–Class 10,000 environments.
Key Features
- Rapid dual-stage vacuum system: Integrated oil-free scroll pump + secondary turbomolecular pump option; achieves ≤5 Pa in <90 seconds (50 L chamber), with programmable multi-step vacuum ramping and hold profiles
- Precision humidity control: Vaisala HUMICAP® sensor feedback loop coupled with Peltier-based dehumidification and steam injection modules; maintains setpoint stability ±0.5% RH over full temperature range (RT to 400 °C)
- Uniform thermal field: 3-zone independent PID-controlled heating (top/bottom/wall); temperature uniformity ±1.5 °C at 350 °C (per ASTM E2207)
- Process traceability: Built-in data logger (1 Hz sampling), timestamped vacuum/temperature/humidity curves, exportable CSV/Excel format
- Safety & compliance: Over-temperature cut-off (dual independent sensors), vacuum interlock on door actuation, CE-marked electrical safety, optional nitrogen purge interface for O2 <10 ppm operation
Sample Compatibility & Compliance
The JH Series accommodates standard semiconductor wafer carriers (FOUPs, SMIF pods), ceramic substrate trays (up to 300 mm × 300 mm), and flex circuit panels. Chamber volume options include 50 L, 120 L, and 240 L configurations. All models meet ISO 14644-1 Class 7 (10,000) particulate requirements when operated with HEPA-filtered purge gas. Process validation documentation supports IQ/OQ protocols per GMP Annex 15 and semiconductor industry guidelines (SEMI S2, SEMI F47). Humidity and vacuum calibration certificates are NIST-traceable; optional 3rd-party certification available per IEC 61000-4 EMC standards.
Software & Data Management
The embedded 7-inch touchscreen HMI runs a deterministic real-time OS with password-protected user levels (Operator, Engineer, Administrator). Recipes store up to 99 multi-step programs (vacuum ramp rate, dwell time, temperature slope, RH setpoint sequence). Audit trail functionality logs all parameter changes, user logins, and alarm events—fully compliant with FDA 21 CFR Part 11 requirements when paired with optional electronic signature module. Data export supports Ethernet TCP/IP, USB 2.0, and RS-485 Modbus RTU for integration into MES platforms (e.g., Siemens Opcenter, Rockwell FactoryTalk).
Applications
- Curing of photosensitive polyimide (PSPI) layers in flip-chip underfill and redistribution layer (RDL) processes
- Thermal imidization of spin-coated PI dielectrics on silicon interposers and 2.5D/3D stacked packages
- Moisture removal and stress relief for flexible printed circuits (FPCs) prior to chip-on-flex bonding
- Pre-bake stabilization of wafer-level packaging (WLP) substrates before bump deposition
- Controlled dehydration of MEMS cavity seals using low-volatility PI adhesives
FAQ
What vacuum level is achievable, and how is it maintained during heating?
Base pressure ≤5 Pa is achieved via dual-pump configuration; active pressure compensation algorithms adjust pumping speed dynamically during thermal expansion to maintain setpoint within ±0.3 Pa tolerance.
Can the oven operate under continuous nitrogen purge instead of vacuum?
Yes—standard N2 inlet port supports flow-regulated purge mode (0–20 L/min); optional mass flow controller enables O2 monitoring down to 1 ppm via integrated zirconia sensor.
Is humidity control active at maximum temperature (400 °C)?
Humidity regulation is disabled above 150 °C per sensor specification limits; however, pre-conditioning at low-T with precise RH ensures residual moisture content <50 ppm before ramping.
Does the system support remote monitoring and alarm notification?
Ethernet-enabled SNMP v3 and email alert (SMTP TLS) support real-time fault reporting (door open, temp excursion, vacuum loss) to centralized SCADA or IT ticketing systems.
What calibration documentation is provided at delivery?
Factory calibration report includes as-found/as-left data for temperature (ITS-90), humidity (NIST-traceable hygrometer), and vacuum (Pirani + capacitance manometer), valid for 12 months.
