LabCompanion TC-180 Temperature Cycling Test Chamber
| Brand | LabCompanion |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Model | TC-180-4 |
| Temperature Range | −70 °C to +150 °C |
| Temperature Uniformity | ±0.5 °C |
| Temperature Deviation | ±2.0 °C |
| Heating Rates | 5–25 °C/min (linear or non-linear) |
| Cooling Rates | 5–25 °C/min (linear or non-linear) |
| Internal Dimensions (W×H×D) | 600 × 600 × 500 mm |
| Compliance | GB/T 5170.2–2008, GB/T 5170.5–2016 (for thermal performance verification) |
Overview
The LabCompanion TC-180 Temperature Cycling Test Chamber is an engineered environmental simulation system designed for accelerated thermal stress testing of electronic components, automotive modules, aerospace hardware, and polymer-based materials. It operates on a forced-air convection principle with dual-stage refrigeration (mechanical compression + optional liquid nitrogen injection), enabling precise, repeatable, and programmable transitions between extreme low- and high-temperature setpoints. Unlike static temperature chambers, the TC-180 supports dynamic thermal profiling—including ramp-hold-soak cycles, stepwise transitions, and custom non-linear temperature trajectories—making it suitable for IEC 60068-2-14 (Test N: Change of Temperature), MIL-STD-810H Method 503.6, and JEDEC JESD22-A104D qualification protocols. Its chamber architecture features insulated stainless-steel inner walls, PID-controlled heating/cooling actuators, and a robust air circulation system that ensures uniform thermal distribution per GB/T 5170.2–2008.
Key Features
- Programmable temperature cycling from −70 °C to +150 °C with ±2.0 °C deviation and ±0.5 °C uniformity across the working volume
- Selectable heating and cooling rates: 5, 10, 15, 20, or 25 °C/min—configurable as linear or user-defined non-linear profiles
- Optional liquid nitrogen (LN₂) auxiliary cooling module enables rapid cooldown up to 30 °C/min within the −55 °C to +125 °C operational envelope
- Stainless-steel interior (600 × 600 × 500 mm W×H×D) with seamless welds and electrostatically grounded surfaces for ESD-sensitive device testing
- Dual independent sensor monitoring: PT100 Class A sensors for chamber control and calibrated reference sensors for traceable validation
- Integrated over-temperature, over-pressure, and refrigerant leak protection with audible/visual alarms and automatic system shutdown
Sample Compatibility & Compliance
The TC-180 accommodates test specimens up to 30 kg in mass and dimensions ≤550 × 550 × 450 mm, supporting standard test fixtures, PCB carriers, and component trays. It meets mechanical and thermal performance verification requirements under GB/T 5170.2–2008 (temperature uniformity and stability) and GB/T 5170.5–2016 (temperature change rate accuracy). While not a humidity-capable model (TC-series denotes dry-thermal-only configuration), its thermal profile fidelity supports compliance with international reliability standards including IEC 60749-25 (integrated circuit thermal cycling), AEC-Q200 stress test schedules, and IPC-9701A thermal cycle life assessment. The chamber’s control firmware and data logs are structured to support GLP/GMP-aligned audit trails when integrated with external validation software.
Software & Data Management
The TC-180 is operated via a 7-inch capacitive touchscreen HMI running embedded Linux with LabCompanion’s TC-OS v3.2 firmware. Users define multi-segment thermal cycles using intuitive drag-and-drop timeline editing, with support for up to 99 programs and 999 segments per program. Real-time data—including chamber setpoint, actual temperature, heating/cooling actuator status, and alarm history—is logged at 1-second intervals to internal flash memory (≥12 months of continuous recording). Export formats include CSV and PDF reports compliant with ISO/IEC 17025 documentation requirements. Optional Ethernet (TCP/IP) and RS485 interfaces enable integration into centralized MES or SCADA systems; data integrity is preserved through timestamped, write-once logging and optional 21 CFR Part 11-compliant user access controls via third-party LIMS platforms.
Applications
- Qualification testing of microcontrollers, power semiconductors, and MEMS devices under repeated thermal expansion/contraction stress
- Failure mode analysis of solder joints, conformal coatings, and adhesive bonds in automotive ECUs
- Material characterization of thermoplastics, elastomers, and composite laminates during cyclic thermal aging
- Process validation of reflow soldering profiles and post-bake thermal conditioning steps
- Reliability screening of battery cells and BMS modules across wide operating temperature envelopes
- Calibration verification of temperature-sensitive sensors and transducers prior to field deployment
FAQ
What is the difference between the TC and TH series?
The TC-series (e.g., TC-180) provides dry thermal cycling only; the TH-series adds humidity control (20–98% RH) and is designated for combined temperature-humidity testing.
Can the TC-180 meet JEDEC JESD22-A104D requirements?
Yes—the chamber’s certified temperature transition rates, uniformity, and programmable soak durations satisfy the thermal cycling conditions specified in JESD22-A104D for packaged semiconductor devices.
Is LN₂ consumption monitored or regulated by the system?
The optional LN₂ subsystem includes a mass-flow controller and pressure-regulated delivery; usage is logged alongside thermal data but requires external dewar level monitoring.
Does the TC-180 support remote operation and monitoring?
Yes—via Ethernet interface using Modbus TCP or LabCompanion’s RESTful API; real-time telemetry and program upload/download are supported without local HMI interaction.
How is temperature uniformity verified and documented?
Per GB/T 5170.2–2008, a 9-point sensor mapping is performed at three load conditions (empty, 50% load, full load); calibration certificates include uncertainty budgets traceable to NIM (China National Institute of Metrology).
