Hengyi HY-0230WRV Horizontal Miniature Film Tensile Tester
| Brand | Hengyi |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic (PRC) |
| Model | HY-0230WRV |
| Instrument Type | Electronic Universal Testing Machine |
| Load Capacity | ≤2000 N |
| Load Cell Accuracy | 0.01% FS |
| Measuring Accuracy | < ±0.5% |
| Test Speed Range | 0.001–300 mm/min |
| Stroke | ≥300 mm |
| Power Supply | AC 220 V, 50/60 Hz |
| Dimensions (W×D×H) | 900 × 350 × 450 mm |
| Weight | ≈95 kg |
Overview
The Hengyi HY-0230WRV Horizontal Miniature Film Tensile Tester is an electromechanical universal testing system engineered for high-precision mechanical characterization of thin, flexible, and low-stiffness materials—particularly polymeric films, adhesive tapes, wire harnesses, electrical connectors, terminal blocks, socket assemblies, LED bases, and miniature electronic components. Designed as a compact horizontal configuration, it eliminates gravitational sag effects common in vertical setups and ensures consistent axial alignment during peel, pull-off, tensile, and 180°/90° peel tests per ASTM D903, ISO 8510-2, and EN 1979. Its core architecture integrates a precision ground ball screw actuator, high-rigidity welded steel frame with powder-coated enclosure, and a digital servo control system synchronized with a 0.01% full-scale load cell—enabling traceable force measurement across the full 2000 N range with < ±0.5% overall system accuracy per ISO 7500-1 Class 0.5.
Key Features
- Horizontal test configuration optimized for film handling, minimizing specimen bending and edge delamination during initiation of peel or tensile loading.
- High-resolution motion control: adjustable test speed from 0.001 to 300 mm/min with closed-loop servo feedback, supporting both quasi-static and dynamic rate-dependent property evaluation.
- Integrated 7-inch TFT-LCD touchscreen interface with real-time graphical display of force-displacement curves, peak load, elongation at break, and modulus calculation (tangent/secant).
- Modular fixture interface compliant with ISO 2041 and ASTM E4 standards, enabling rapid interchange of pneumatic clamps, peel jigs, crimp-pull adapters, and custom-designed grips for micro-components.
- Robust mechanical construction: CNC-machined aluminum alloy load frame, hardened stainless steel guide rails, and vibration-damped base plate ensure long-term repeatability under laboratory or QC floor conditions.
- Comprehensive safety architecture including emergency stop, overload cut-off, software-limited stroke protection, and mechanical end-stop buffers.
Sample Compatibility & Compliance
The HY-0230WRV accommodates specimens ranging from 1 mm wide adhesive strips to 50 mm wide polymer films, with thicknesses from 12 µm up to 2 mm. It supports standardized test geometries defined in ASTM D882 (tensile properties of thin plastic sheeting), ASTM D3330 (peel adhesion of pressure-sensitive tapes), IEC 60512-2 (electrical connector pull strength), and GB/T 2792 (peel strength of adhesive tapes). All force and displacement measurements are calibrated per ISO/IEC 17025 requirements and traceable to national metrology institutes (e.g., NIM, China). The system meets electromagnetic compatibility (EMC) standards per IEC 61326-1 and electrical safety per IEC 61010-1.
Software & Data Management
The instrument operates with Hengyi’s proprietary TestMaster v4.2 software, compatible with Windows 10/11 (64-bit). The software provides GLP-compliant data acquisition—including user authentication, audit trail logging, electronic signatures, and 21 CFR Part 11–ready report generation. Raw data exports in CSV, Excel (.xlsx), and XML formats support integration into LIMS environments. Automated test protocols can be saved and recalled; batch testing with pass/fail criteria and statistical summary (mean, SD, CV%, min/max) is fully supported. Calibration certificates and verification records are digitally archived with time-stamped metadata.
Applications
- Quantitative peel strength assessment of medical device adhesive patches, transdermal films, and sterile packaging seals.
- Tensile modulus and yield point determination for biodegradable PLA/PBAT films used in sustainable packaging.
- Retention force validation of automotive wiring harness terminals and PCB-mounted connectors per USCAR-2.
- Adhesive bond integrity testing of OLED encapsulation layers and flexible printed circuit (FPC) laminates.
- Quality conformance screening of consumer electronics assembly—e.g., USB-C port retention, battery tab weld strength, and flex-circuit solder joint pull resistance.
- R&D-level mechanical mapping of nanocomposite thin films under variable strain rates and environmental conditioning (when paired with optional environmental chamber).
FAQ
What is the maximum sample width this tester can accommodate?
Standard fixtures support widths up to 50 mm; custom wide-span grips (up to 100 mm) are available upon request.
Is the system compatible with third-party data acquisition systems?
Yes—via RS-232, USB CDC, and Ethernet TCP/IP interfaces; SCPI command set and DLL SDK are provided for OEM integration.
Does the instrument meet FDA or EU MDR requirements for medical device testing?
The hardware and software architecture support compliance with ISO 13485 and FDA 21 CFR Part 11 when deployed within a validated laboratory environment and operated under documented SOPs.
Can test results be exported directly to SPC software?
Yes—real-time data streaming to JMP, Minitab, or custom SPC dashboards is enabled through configurable ODBC and OPC UA connectivity options.
What maintenance intervals are recommended for long-term accuracy?
Load cell verification every 6 months; ball screw lubrication and calibration check annually; full system performance verification per ISO 7500-1 every 12 months or after 5,000 test cycles.
