HWX-II Intelligent Thermal Physical Property Tester
| Origin | Hunan, China |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Domestic |
| Model | HWX-II |
| Price | Upon Request |
Overview
The HWX-II Intelligent Thermal Physical Property Tester is a precision benchtop instrument engineered for the accurate determination of thermal conductivity (λ) and thermal diffusivity (α) in solid and quasi-homogeneous materials. It operates on the principle of the constant-power planar heat source method—a transient, steady-state hybrid technique grounded in Fourier’s law of heat conduction and the analytical solution for heat flow from an infinite planar source embedded in a semi-infinite medium. This method assumes uniform, isotropic material properties, negligible heater thermal mass, and initial thermal equilibrium across the specimen—conditions rigorously enforced through hardware design and controlled test protocols. The HWX-II is optimized for R&D laboratories, quality control departments, and materials certification facilities requiring traceable, repeatable thermal characterization under ambient or temperature-stabilized conditions.
Key Features
- Constant-power planar heat source architecture with programmable heating power ≥35 W ±1%, enabling stable thermal excitation and minimized boundary interference.
- Digital temperature measurement system with AD590-based cold-junction compensation for thermocouples, achieving temperature resolution better than 0.2 class accuracy.
- High-precision dual-slope analog-to-digital conversion circuitry ensuring low-noise, high-linearity signal acquisition from thermocouple arrays.
- Integrated microcontroller-based data acquisition and real-time processing unit, supporting automated test execution and on-device parameter visualization.
- Three standardized specimen configurations supported: 200 × 200 × 65 mm, 200 × 200 × 22 mm, and 200 × 200 × 90 mm—designed to satisfy the geometric requirement of width/length ≥8–10× thickness for semi-infinite approximation.
- Automatic room-temperature electronic compensation and real-time thermal drift correction during multi-minute steady-state acquisition cycles.
- Full test cycle completion within 3 minutes under stabilized thermal conditions, delivering λ and α values with ±3% measurement uncertainty and ±2% repeatability (per ASTM C1113 and ISO 22007-2 compliance guidelines).
Sample Compatibility & Compliance
The HWX-II accommodates rigid, non-porous, isotropic solids including polymers, ceramics, composites, insulating foams, and construction materials—provided they meet the fundamental assumptions of the planar heat source model. Specimens must exhibit uniform density, homogeneous phase distribution, and minimal internal thermal resistance gradients. While not intended for liquids, powders, or highly anisotropic layered structures, it supports comparative analysis across batch lots under GLP-aligned documentation workflows. Instrument design aligns with core principles of ISO 22007-2 (Planimetric Method), ASTM C1113 (Standard Test Method for Thermal Conductivity of Refractories), and GB/T 10294 (Chinese national standard for steady-state heat flux meter method). Data integrity is maintained via time-stamped acquisition logs and hardware-enforced calibration traceability.
Software & Data Management
The embedded software suite comprises modular firmware components: system management, real-time data filtering, thermocouple EMF-to-temperature linearization (based on ITS-90 reference tables), interrupt-driven sampling control, clock-synchronized acquisition, and print driver integration. All operational parameters—including applied power, surface temperature rise, time-temperature curves, and derived λ/α values—are displayed dynamically on the front-panel LCD and exportable via RS-232 or USB interface. Raw sensor outputs and processed results are stored with metadata (date, operator ID, specimen ID, ambient T, calibration timestamp), supporting audit-ready records per FDA 21 CFR Part 11 requirements when deployed in regulated environments. No cloud dependency or third-party runtime is required—full functionality resides in the onboard MCU architecture.
Applications
- Thermal insulation validation for building envelope materials (e.g., aerogels, mineral wool, vacuum panels).
- Quality assurance of polymer matrix composites used in aerospace and automotive thermal management systems.
- R&D screening of phase-change materials (PCMs) and thermal interface materials (TIMs) under controlled ambient conditions.
- Educational use in materials science and mechanical engineering labs for teaching Fourier conduction theory and experimental error analysis.
- Pre-certification testing prior to formal ISO/IEC 17025 accredited measurements using guarded hot plate or laser flash apparatus.
FAQ
What thermal properties does the HWX-II measure?
It measures thermal conductivity (W/m·K) and thermal diffusivity (mm²/s) using the constant-power planar heat source method.
Can the HWX-II test liquids or powders?
No—it requires mechanically stable, isotropic solid specimens satisfying the semi-infinite geometry condition; liquid or granular samples are incompatible.
Is calibration traceable to national standards?
Yes—system-level calibration uses NIST-traceable reference materials and adheres to verification procedures outlined in JJG 1040-2008 (Chinese metrological verification regulation for thermal conductivity instruments).
Does the instrument support automated report generation?
Yes—integrated printer control enables direct output of test curves, numerical results, and environmental metadata without external PC software.
What is the minimum measurable thermal conductivity?
The lower detection limit is 0.015 W/m·K, validated for low-conductivity insulators such as expanded polystyrene and silica aerogel monoliths.
