Tongzhou Weipu SCk Dual-Channel Precision Chiller for Semiconductor Dicing and Thinning Equipment

Overview

The Tongzhou Weipu SCk Dual-Channel Precision Chiller is an engineered thermal management solution specifically developed for semiconductor back-end processes—particularly wafer dicing, grinding, and thinning equipment requiring independent, high-stability cooling circuits. It operates on a dual-loop refrigeration architecture: one closed-loop circuit maintains precise temperature control of the machine spindle assembly (typically 18–25 °C), while the second loop cools cutting fluid—delivered via direct-drain configuration to eliminate recirculation-induced particle accumulation and thermal drift. The chiller employs a proprietary PID-based temperature regulation system, achieving ±0.1 °C steady-state stability over extended operational cycles (≥72 h continuous duty). Its design adheres strictly to SEMI S2 (safety) and SEMI S8 (ergonomics and maintainability) standards, ensuring compatibility with Class 100–1000 cleanroom environments and integration readiness with OEM process tools from major suppliers including DISCO, Tokyo Seimitsu, and KLA.

Key Features

• Dual independent refrigeration circuits with isolated flow paths, enabling simultaneous yet decoupled thermal control of spindle bearings and abrasive slurry delivery systems
• Integrated auto-replenishment reservoir with level-sensing float switches and low-conductivity deionized water compatibility (resistivity ≥10 MΩ·cm)
• Direct-drain cutting fluid interface eliminates recirculation pumps, reducing particulate generation and minimizing maintenance intervals
• Modular “one-chiller-multiple-tools” scalability—supports up to four downstream tools via optional manifold kits with individual flow metering and pressure regulation
• Industrial-grade touchscreen HMI with real-time display of inlet/outlet temperatures, flow rates (L/min), compressor status, and alarm history
• Comprehensive safety architecture: dry-run detection, differential pressure monitoring across filters, over-temperature cutoff, and grounded leakage current protection per IEC 61000-6-2/6-4

Sample Compatibility & Compliance

The SCk chiller is validated for use with silicon, SiC, GaN, and compound semiconductor wafers processed on precision dicing saws, double-side grinders, and chemical-mechanical thinning platforms. It supports coolant formulations compliant with SEMI F57 (ultra-pure water specifications) and SEMI F63 (coolant purity for semiconductor applications). All wetted components—including stainless-steel manifolds, EPDM-free fluoropolymer tubing, and ceramic-coated heat exchangers—are certified non-outgassing and compatible with ISO Class 5 cleanroom protocols. Full documentation packages—including Factory Acceptance Test (FAT) reports, traceable calibration certificates (NIST-traceable RTDs), and SEMI-compliance declarations—are provided with each unit to support GMP/GLP audit readiness and FDA 21 CFR Part 11-aligned validation protocols.

Software & Data Management

The SCk incorporates embedded Ethernet (RJ45) and RS485 interfaces supporting Modbus TCP/RTU communication for integration into factory-wide MES and SCADA systems. Logged parameters—including loop-specific temperatures, cumulative runtime, compressor cycle counts, and alarm event timestamps—are stored locally for ≥30 days and exportable via USB or network transfer in CSV format. Optional firmware upgrade enables secure remote diagnostics through TLS 1.2-encrypted connections, with role-based access control (operator/engineer/admin) and full audit trail logging compliant with ISO/IEC 17025 requirements for accredited calibration laboratories.

Applications

• Thermal stabilization of high-RPM dicing spindles during ultra-thin (<50 µm) wafer separation to prevent bearing thermal expansion and blade deflection
• Cooling of diamond-blade slurry in precision dicing saws to suppress localized heating at the kerf interface and reduce micro-crack propagation
• Temperature conditioning of polishing pads and carrier plates in CMP and back-grinding modules to maintain consistent material removal rates
• Supporting multi-tool consolidation strategies in advanced packaging lines (e.g., Fan-Out Wafer-Level Packaging), where centralized chillers reduce footprint and improve utility efficiency
• Enabling stable operation of laser dicing and stealth dicing systems requiring sub-0.2 °C thermal uniformity across optical path components

FAQ

Does the SCk chiller support integration with third-party equipment via analog or digital I/O?
Yes—it provides 4–20 mA analog outputs for primary loop temperature and flow rate, plus discrete dry-contact alarms for critical faults (e.g., low flow, high temp). Digital integration is supported via Modbus TCP/RTU over standard industrial Ethernet or serial interfaces.
What is the maximum allowable coolant conductivity for the cutting fluid loop?
The direct-drain loop accepts deionized water with conductivity ≤1 µS/cm; conductivity monitoring is not built-in but can be added via optional inline sensor module (part no. SCk-COND-01).
Is the SCk suitable for use in nitrogen-purged or vacuum chamber-adjacent environments?
The unit is rated for ambient operation at 15–35 °C and 30–70% RH (non-condensing); it is not rated for inert gas enclosures or vacuum proximity. For such deployments, consult Tongzhou Weipu’s Application Engineering team for custom enclosure or purge interface options.
How frequently must the internal filters be replaced under continuous 24/7 operation?
With DI water feed and upstream 5 µm pre-filtration, the integrated 10 µm particulate filter requires replacement every 6 months; the activated carbon filter (optional, for organic contaminant mitigation) is rated for 12 months.
Can the SCk be validated per IQ/OQ protocols for regulated manufacturing sites?
Yes—Tongzhou Weipu provides vendor-qualified IQ/OQ templates aligned with ASTM E2500 and ISO 13485, including test scripts for temperature mapping, flow verification, and alarm response validation. On-site qualification support is available upon request.