Hefei Kejing Single-Wafer Cassette

Overview

The Hefei Kejing Single-Wafer Cassette is a precision-engineered storage and transport solution for bare silicon, sapphire, GaN, SiC, and quartz wafers in semiconductor R&D, microfabrication, and academic cleanroom laboratories. Unlike stack-based multi-wafer carriers, this cassette accommodates a single wafer per unit—minimizing mechanical contact, eliminating inter-wafer slip or scratching, and enabling full-face optical inspection without removal. Its design follows fundamental principles of static-dissipative handling and particle-controlled containment: the semi-transparent thermoplastic body provides visual verification of wafer presence and orientation while maintaining structural rigidity under repeated thermal cycling (−40 °C to +120 °C). The cassette operates as a passive, non-powered component within broader process workflows—integrated into manual loading stations, automated material handling systems (AMHS), and furnace transfer protocols where precise wafer positioning and contamination control are critical.

Key Features

• Modular one-wafer architecture ensures zero wafer-to-wafer contact during storage, transport, and thermal processing
• Elastomeric retention fingers—molded integrally into the base—apply uniform, low-stress radial compression at three symmetric points, accommodating standard thickness tolerances (275–725 µm for Si)
• Semi-transparent polypropylene (PP) or polycarbonate (PC) construction offers high chemical resistance to IPA, acetone, dilute acids/bases, and compatibility with ISO Class 5 (Class 100) cleanroom wipe validation protocols
• Hinged lid with positive snap-lock mechanism prevents accidental opening during horizontal or vertical handling; lid geometry includes alignment chamfers for repeatable placement on chuck surfaces
• Stackable footprint design allows vertical nesting without lateral offset—reducing footprint in laminar flow cabinets and furnace loading carts
• Autoclavable up to 121 °C (250 °F) for depyrogenation and biological process support in hybrid MEMS-biofabrication labs

Sample Compatibility & Compliance

The cassette supports industry-standard wafer diameters: 50.8 mm (2″), 101.6 mm (4″), and 150 mm (6″), with nominal thickness compatibility spanning 100 µm to 1 mm substrates. Each size variant maintains consistent aspect ratio and finger engagement geometry to preserve uniform clamping force across diameters. All materials comply with USP Class VI biocompatibility testing requirements and pass ASTM D5203-22 for static-dissipative performance (<1 × 10⁹ Ω surface resistivity). Units are manufactured under ISO 9001-certified processes and undergo 100% visual inspection for particulate defects (≥5 µm) under Class 100 white light laminar flow. Documentation includes material traceability certificates and cleanroom assembly logs per ISO 14644-1 Annex B.

Software & Data Management

As a passive mechanical device, the Single-Wafer Cassette does not incorporate embedded electronics or firmware. However, its standardized dimensions and barcode-ready labeling surface (top lid and side wall) integrate seamlessly with laboratory information management systems (LIMS) and manufacturing execution systems (MES) via external RFID tags (e.g., HF 13.56 MHz) or 2D DataMatrix codes. Each cassette can be assigned a unique identifier aligned with SEMI E10 standards for equipment tracking, enabling full audit trails from wafer receipt through annealing, etching, or metrology steps. Optional serialized engraving supports GLP/GMP-compliant recordkeeping where traceability to individual substrate lots is required.

Applications

• Pre- and post-processing storage of wafers undergoing rapid thermal annealing (RTA), oxidation, or CVD in tube or box furnaces
• Transport between lithography, wet bench, and metrology stations in university cleanrooms and pilot-line facilities
• Calibration reference handling in ellipsometry, reflectometry, and profilometry labs requiring unobstructed front-side access
• Low-volume prototyping workflows where batch uniformity is less critical than individual wafer integrity and process flexibility
• Education and training modules in semiconductor device fabrication courses, emphasizing contamination control and handling best practices

FAQ

Is this cassette compatible with standard muffle furnace door openings and internal shelf spacing?
Yes—the maximum height (16 mm for Φ6″) and low-profile lid profile ensure unimpeded insertion into most benchtop and floor-standing muffle furnaces with ≥20 mm vertical clearance between shelves.
Can the elastomeric fingers be replaced if damaged?
No—the retention fingers are molded integrally with the cassette body and are not user-replaceable; however, the thermoplastic material exhibits high fatigue resistance over >5,000 insertion/removal cycles per unit when operated within specified temperature and humidity ranges.
Does the semi-transparent material fluoresce under UV exposure used in photolithography alignment?
No—both PP and PC variants exhibit negligible autofluorescence below 365 nm and have been validated for use in mask aligner load ports without interfering with alignment camera imaging.
Are custom colors or laser-engraved identifiers available for OEM integration?
Yes—Hefei Kejing supports volume orders (≥500 units) with custom colorants compliant with RoHS 3 and REACH SVHC thresholds, as well as permanent serial numbering per SEMI E10 Annex A.