Indium (In) Wire – Hefei Kejing High-Purity Metal Filament
| Brand | Hefei Kejing |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Origin Classification | Domestic |
| Model | In Wire |
| Pricing | Upon Request |
| Diameter Range | 0.01–2 mm |
| Purity | 99.99% (4N) |
| Packaging | Class 1000 Cleanroom Environment, Sealed in Class 100 Cleanroom Bags with Aluminum Foil Lining |
Overview
Indium (In) wire is a high-purity metallic filament engineered for applications requiring exceptional ductility, low melting point (156.6 °C), and reliable solderability in vacuum and inert-atmosphere environments. As a Group 13 post-transition metal, indium exhibits excellent thermal and electrical conductivity, minimal oxide formation under controlled conditions, and strong adhesion to glass, ceramics, and semiconductor substrates. This Hefei Kejing-branded In wire meets the 4N (99.99%) purity specification—verified by trace elemental analysis per ASTM E1479—and is manufactured and packaged under stringent cleanroom protocols to prevent surface contamination, particle generation, or oxidation during storage and handling.
Key Features
- Ultra-high purity: Certified 99.99% (4N) indium, with impurity levels ≤10 ppm total metallic contaminants (e.g., Fe, Cu, Ni, Pb, Zn) as confirmed by GDMS or ICP-MS analysis
- Precise dimensional control: Available in diameters spanning 0.01 mm (10 µm) to 2.0 mm, drawn using diamond-die cold-drawing processes with ±0.5% tolerance on nominal diameter
- Controlled surface integrity: Wire surfaces are passivated in nitrogen-purged environments prior to packaging; no lubricants or drawing residues remain
- Traceable packaging: Each spool or coil is sealed in double-layered aluminum foil within ISO Class 5 (100-level) cleanroom bags, then overpackaged in ISO Class 6 (1000-level) cleanroom-certified shipping containers
- Material certification included: Certificate of Analysis (CoA) documents batch-specific purity, dimensional verification, and cleanroom handling compliance
Sample Compatibility & Compliance
This indium wire is compatible with a broad range of ultra-high vacuum (UHV) and controlled-atmosphere systems, including molecular beam epitaxy (MBE) sources, vacuum feedthroughs, cryogenic sealing applications, and low-temperature bonding fixtures. Its low vapor pressure (<10⁻⁷ Torr at 25 °C) ensures minimal outgassing in vacuum chambers per ASTM E595 standards. The product conforms to general requirements for electronic-grade metals under IPC-J-STD-006 and supports GLP-compliant material traceability when used in R&D labs subject to ISO/IEC 17025 accreditation. While not classified as a medical device or pharmaceutical excipient, it may be employed in GMP-aligned fabrication processes where elemental purity and particulate control are critical (e.g., sensor housing assembly, hermetic seal formation).
Software & Data Management
As a passive metallurgical component, indium wire does not incorporate embedded electronics, firmware, or software interfaces. However, full traceability is maintained through batch-specific digital documentation accessible via Hefei Kejing’s secure customer portal. Each CoA includes QR-coded metadata linking to raw analytical reports, cleanroom log records, and packaging validation summaries. For laboratories operating under FDA 21 CFR Part 11 or EU Annex 11 requirements, audit trails for certificate issuance and revision history are retained for ≥10 years and support electronic signature workflows upon request.
Applications
- Vacuum-compatible thermal interface material (TIM) for cryostat and dilution refrigerator wiring
- Low-temperature bonding wire in superconducting quantum interference device (SQUID) packaging and microwave cavity assembly
- Sealing element for glass-metal or ceramic-metal vacuum feedthroughs in UHV analytical instruments (e.g., XPS, AES, TEM sample holders)
- Source material for thermal evaporation in thin-film deposition systems targeting In-based compound semiconductors (e.g., InSb, InAs, InP)
- Calibration reference in differential scanning calorimetry (DSC) due to its sharp, reproducible melting endotherm at 156.6 °C (±0.1 °C)
- Conductive filler in flexible printed electronics where low-temperature reflow compatibility is required
FAQ
What does “4N purity” mean for indium wire?
It denotes a minimum purity level of 99.99% elemental indium, with total metallic impurities limited to ≤10 ppm. This grade satisfies specifications for semiconductor process tool components and high-reliability vacuum hardware.
Is this indium wire suitable for use in ultra-high vacuum (UHV) systems?
Yes—its low outgassing rate, verified per ASTM E595, and cleanroom-packaged delivery ensure compatibility with UHV environments down to 10⁻¹⁰ Torr when properly baked out.
Can I request custom diameters or spool lengths?
Hefei Kejing supports OEM-order configurations—including non-standard diameters (e.g., 0.015 mm, 0.35 mm), precision-cut lengths, and reel winding specifications—subject to minimum order quantities and lead time confirmation.
How is dimensional accuracy verified and documented?
Each production lot undergoes laser micrometer measurement at three axial positions per meter, with statistical process control (SPC) charts included in the CoA.
Does the packaging meet ISO 14644-1 Class 5 requirements?
The inner cleanroom bag complies with ISO 14644-1 Class 5 (equivalent to Federal Standard 209E Class 100); final outer packaging meets Class 6 (1000) for logistical integrity during transit.
