KEJING A-Z Series Sputtering Targets
| Brand | KEJING |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Origin Classification | Domestic (China) |
| Model | A-Z Series |
| Pricing | Upon Request |
Overview
The KEJING A-Z Series Sputtering Targets are a comprehensive portfolio of high-purity physical vapor deposition (PVD) target materials engineered for thin-film synthesis in research and industrial applications. Designed for use in magnetron sputtering, electron-beam evaporation, and pulsed laser deposition (PLD) systems, this series encompasses over 200 distinct compositions—including elemental metals, binary and ternary alloys, complex oxides, nitrides, carbides, fluorides, and perovskite-structured ceramics. Each target is fabricated under controlled atmospheric and thermal conditions to ensure stoichiometric fidelity, low impurity content (<5 ppm metallic contaminants), and uniform microstructural homogeneity—critical parameters for reproducible film composition, crystallinity, and functional property transfer. The A-Z designation reflects the systematic organization of targets by elemental composition (e.g., Ag-, Ba-, Bi-, Ce-, Co-, Dy-, Er-, Fe-, Ga-, Ho-, In-, La-, Mg-, Mn-, Nd-, Ni-, Pb-, Pr-, Sm-, Sr-, Ta-, Ti-, Y-, Zn-, Zr-based systems), enabling rapid selection for multilayer heterostructure growth, combinatorial library screening, or phase-stability studies.
Key Features
- High-density (>99.5% theoretical density) cold-isostatically pressed (CIP) or hot-isostatically pressed (HIP) targets with minimal porosity and grain-boundary segregation
- Customizable geometries: circular (50–150 mm diameter), rectangular (up to 300 × 100 mm), and bonded configurations (e.g., Cu or Mo backing plates for enhanced thermal management)
- Surface finish options: double-side polished (Ra < 0.2 µm) for reactive sputtering; ground finish (Ra < 1.6 µm) for DC/RF sputtering of conductive materials
- Traceable lot documentation including ICP-MS elemental analysis certificates, XRD phase identification reports, and SEM/EDS cross-sectional homogeneity verification
- Compliance with ISO 9001:2015 manufacturing controls and ASTM F2627-18 (Standard Specification for Sputtering Target Materials)
Sample Compatibility & Compliance
The A-Z Series supports compatibility with standard UHV-compatible sputter chambers (e.g., Kurt J. Lesker, AJA International, PVD Products, Singulus) operating under base pressures ≤5×10⁻⁸ Torr. Targets are qualified for both DC and RF sputtering of conductive and insulating compositions respectively—including high-dielectric-constant oxides (e.g., BaTiO₃, SrTiO₃), high-Tc superconductors (e.g., YBa₂Cu₃O₇, NdBa₂Cu₃O₇), colossal magnetoresistive manganites (e.g., La₀.₇Ca₀.₃MnO₃), and transparent conducting oxides (e.g., ITO, IGZO). All ceramic and alloy targets undergo rigorous outgassing characterization per ASTM E595-22 (outgassing rate <1.0×10⁻⁵ g/(cm²·h) at 125°C) to prevent chamber contamination during long-duration depositions. Traceability aligns with GLP/GMP requirements for regulated R&D environments, and batch records include full elemental certification per ISO/IEC 17025-accredited laboratories.
Software & Data Management
While the targets themselves are passive components, KEJING provides digital material datasheets compliant with ISO 11922-2 metadata standards. Each lot ID links to downloadable technical documentation—including stoichiometric tolerance bands (±0.5 mol%), thermal expansion coefficients (CTE), and recommended sputtering parameters (power density, Ar/O₂ partial pressure ratios, substrate temperature ranges). For integration into automated thin-film workflows, KEJING supports Material Exchange Format (MEF) exports compatible with LabArchives ELN and Thermo Fisher SampleManager LIMS platforms. Audit trails for certificate-of-analysis generation adhere to FDA 21 CFR Part 11 requirements for electronic records and signatures.
Applications
- Functional oxide thin films for resistive switching memory (ReRAM), ferroelectric RAM (FeRAM), and memristor devices
- Heteroepitaxial growth of complex oxide interfaces (e.g., LaAlO₃/SrTiO₃) for emergent 2D electron gas studies
- High-efficiency photovoltaic absorber layers (CIGS, CZTS) and buffer layers (ZnS, CdS)
- Magnetic tunnel junction (MTJ) stacks using CoFeB, NiFe, and rare-earth doped perovskites
- Thermoelectric thin films (Ca₃Co₄O₉, SrTiO₃-based composites) and solid-state electrolytes (Li₃PO₄, LiNbO₃)
- Optical coatings (Y₂O₃, Sc₂O₃, HfO₂) and scintillator films (Ce:YAG, Lu₂O₃:Eu)
FAQ
Are custom stoichiometries available beyond the listed A-Z compositions?
Yes—KEJING offers bespoke target synthesis services with minimum order quantities starting at 50 g for pilot batches and 500 g for production-scale lots. Custom dopant levels, isotopic enrichment (e.g., ¹⁵N, ¹⁸O), and co-sintered multilayer architectures are supported.
What bonding options are offered for thermally sensitive targets?
All ceramic and intermetallic targets ≥75 mm diameter can be bonded to oxygen-free copper (OFHC) or molybdenum backplates using indium-free, high-thermal-conductivity silver epoxy (ASTM B834-compliant) or direct diffusion bonding (DB) upon request.
Do you provide deposition rate calibration data for each target lot?
Deposition rate benchmarks (nm/min at 100 W, 5 mTorr Ar) are provided for representative compositions (e.g., Al₂O₃, SiO₂, TiO₂, ITO) upon request. Rate variability across lot-to-lot is maintained within ±8% under standardized chamber conditions.
Is ISO/IEC 17025 certification available for individual target lots?
Certificates of Analysis (CoA) include full ICP-MS trace element data and XRD phase quantification. ISO/IEC 17025-accredited third-party verification is available as an optional add-on service.
What packaging and shipping protocols ensure target integrity?
Targets are vacuum-sealed in double-layer antistatic aluminum foil with desiccant, then housed in rigid foam-lined cardboard or aluminum transit cases. Hazardous material declarations (e.g., for Pb-, Cd-, or As-containing targets) comply with IATA DGR and UN transport regulations.
