YANRUN AXQ-50Y Intelligent Automatic Cold Mounting Press

Overview

The YANRUN AXQ-50Y Intelligent Automatic Cold Mounting Press is a precision-engineered, floor-standing thermosetting and cold-mounting system designed for reproducible, high-fidelity specimen encapsulation in metallurgical, materials science, and failure analysis laboratories. Unlike conventional hot-mounting presses reliant on elevated temperature and pressure to cure thermosetting resins (e.g., phenolic or diallyl phthalate), the AXQ-50Y integrates dual-mode capability — supporting both heat-assisted compression molding (up to 210 °C) and ambient-temperature vacuum-assisted cold mounting using low-viscosity epoxy or acrylic resins. Its core architecture employs a closed-loop hydraulic actuation system with programmable pressure ramping and dwell profiles, ensuring uniform force distribution across the mold cavity and minimizing edge lift, void formation, or resin-starved zones. The unit is purpose-built for specimens sensitive to thermal degradation, microstructural distortion, or interfacial delamination — including soft metals (e.g., lead alloys, solder joints), polymer composites, PCB cross-sections, brittle ceramics, and geologic thin sections. By standardizing specimen geometry (cylindrical mounts of 25–45 mm diameter), the AXQ-50Y ensures compatibility with downstream automated grinding/polishing systems compliant with ASTM E3, ISO 14487, and EN 10365.

Key Features

• Fully automatic hydraulic pressure control with real-time force feedback and programmable pressure hold (0–15 MPa range, typical operating window: 10–12 MPa)
• PLC-based color touchscreen interface with multi-step recipe storage (≥100 user-defined protocols), password-protected parameter editing, and audit trail logging
• Integrated water-cooled chiller system (40 L reservoir, thermostatically regulated to ±0.5 °C) enabling rapid post-cure cooling and consistent cycle repeatability
• Motor-driven vertical specimen lift mechanism with position memory, eliminating manual handling during mold insertion/removal
• Programmable heating profile (20–210 °C, ±1 °C accuracy) with independent PID control for resin-specific curing kinetics
• Single-chamber, sealed mounting cavity with O-ring sealing and vacuum assist option (vacuum level ≤50 mbar) to eliminate porosity in porous or cracked samples
• Robust steel frame construction with vibration-damped base and CE-compliant safety interlocks (door switch, overpressure cutoff, thermal overload protection)

Sample Compatibility & Compliance

The AXQ-50Y accommodates a broad spectrum of specimen types without compromising structural integrity: metallic alloys (Al, Mg, Cu, Ti, Fe-based), sintered carbides, optical glasses, mineral aggregates, fiber-reinforced polymers, elastomeric seals, and multilayer electronic substrates. Its cold-mounting mode is particularly suited for temperature-sensitive materials — such as low-melting-point solders (Sn-Pb, SAC305), PET/PC laminates, and thermally labile biological-inorganic hybrids — where hot mounting would induce phase segregation, recrystallization, or interdiffusion artifacts. All operational parameters comply with ISO/IEC 17025 requirements for equipment qualification, and the control software supports optional 21 CFR Part 11 compliance packages (electronic signatures, change history, user access levels) for GLP/GMP-regulated environments. Mold dimensions conform to standardized metallographic mount specifications per ASTM E3-22 and ISO 14487 Annex A.

Software & Data Management

The embedded HMI runs a deterministic real-time OS with non-volatile protocol storage and timestamped cycle logs (date/time, mold ID, resin type, pressure curve, temperature ramp, cooling duration). Export options include CSV via USB port for traceability integration into LIMS or QMS platforms. Optional Ethernet connectivity enables remote monitoring, firmware updates, and centralized fleet management across multi-site labs. Audit trails record operator ID, parameter modifications, emergency stops, and calibration events — satisfying documentation requirements under ISO 9001:2015 Clause 7.1.5 and FDA guidance on laboratory equipment validation.

Applications

• Preparation of failure analysis specimens from fractured turbine blades, automotive castings, or semiconductor packaging for SEM/EDS and FIB-SEM cross-sectioning
• Routine QC mounting of incoming raw material coupons (e.g., stainless steel billets, Al extrusions) prior to automated polishing per ASTM E407
• Encapsulation of fragile geological thin sections (e.g., shale, basalt, meteorite fragments) for microhardness testing and cathodoluminescence mapping
• Embedding of multilayer PCBs and flex circuits with controlled resin infiltration to preserve solder joint morphology and interfacial adhesion
• Standardized mounting of polymer blends and nanocomposites for AFM phase imaging and nanoindentation depth profiling
• High-throughput batch mounting in accredited metallurgical testing labs performing ISO 6507-1 Vickers hardness certification

FAQ

Does the AXQ-50Y support vacuum-assisted cold mounting?
Yes — an optional vacuum module can be integrated to evacuate air from porous specimens (e.g., sintered metals, foams, or cracked ceramics) prior to resin injection, reducing void content by >90% compared to atmospheric mounting.
Can custom mold sizes beyond 45 mm be accommodated?
Yes — the press chamber design allows mechanical adaptation for molds up to 60 mm diameter; engineering drawings and load validation are provided upon request.
Is the water chiller system self-contained and maintenance-free?
The 40 L reservoir includes corrosion-inhibited glycol-water coolant, level sensor, and filter cartridge; annual coolant replacement and filter change are recommended per maintenance schedule.
What resin chemistries are validated for use with this system?
Epoxy (e.g., Epofix®, Technovit® 2000), acrylic (e.g., AcrylSet™, MetaFast®), and polyimide-based cold-mount resins have been tested for full-cycle compatibility, including thermal expansion matching and demolding performance.
How is calibration and verification performed?
Temperature sensors are NIST-traceable RTDs; pressure transducers are factory-calibrated annually. A documented IQ/OQ protocol kit is available for GxP lab qualification, including tolerance limits per ISO 17025 Section 6.5.