TPT HB16 Semi-Automatic Thermosonic Wire Bonder

Overview

The TPT HB16 Semi-Automatic Thermosonic Wire Bonder is a precision-engineered benchtop bonding system designed for R&D laboratories, pilot-line production, and low-volume manufacturing environments in semiconductor packaging. It operates on thermosonic bonding principles—combining controlled heat, ultrasonic energy, and precise mechanical force—to form reliable interconnects between die pads and substrate or leadframe bond sites. The HB16 supports multiple bonding configurations—including ball-wedge, wedge-wedge, ribbon, and bump bonding—enabling flexible process development across wire materials (gold, aluminum, copper) and geometries (round wire, flat ribbon, solder bumps). Its modular head architecture allows rapid tooling changeover between bond types with only a die tool (capillary or wedge) swap, eliminating the need for dedicated machines per process variant.

Key Features

• Motorized Z- and Y-axis motion control ensures repeatable bond placement accuracy and consistent force application across all bond cycles.
• 6.5-inch high-resolution capacitive touchscreen interface provides intuitive navigation, real-time parameter monitoring, and direct access to all bonding variables—including ultrasonic power (0–5 W), bond time (0–10 s), temperature setpoint (up to 250 °C ±1 °C), and bond force (5–150 cNm).
• Programmable arc profile editing enables precise control over wire loop geometry, critical for avoiding short circuits and optimizing package height constraints.
• Electronic ball diameter control delivers stable first-ball formation across varying wire diameters (17–75 µm) and materials (Au, Al, Cu), minimizing ball size drift during extended runs.
• Deep-cavity bond head (16 mm clearance) accommodates high-profile packages and stacked-die assemblies without mechanical interference.
• Integrated motorized wire spool (50.8 mm / 2″) and programmable clamp movement support consistent wire feed and tension management.
• Optional pull-test module enables in-situ mechanical verification of bond strength per MIL-STD-883 or JEDEC JESD22-B116 standards.
• USB data export facilitates traceability and post-process analysis; all programs and logs are securely stored onboard (100 recipe capacity).

Sample Compatibility & Compliance

The HB16 accommodates standard semiconductor substrates including silicon die, ceramic QFNs, leadframes (Cu, FeNi), and organic laminate substrates. It supports gold (17–75 µm), aluminum (17–75 µm), and copper (17–50 µm) wires, as well as flat aluminum ribbons up to 25 × 250 µm. Process parameters comply with key industry specifications including ASTM F459 (wire bond pull testing), ISO 9001-aligned documentation workflows, and GLP/GMP-relevant audit trails when paired with external LIMS integration. Thermal calibration is traceable to NIST-certified references, and ultrasonic output stability meets IEC 60601-2-37 requirements for medical-grade microelectronics assembly where applicable.

Software & Data Management

The embedded control firmware provides full parameter logging per bond cycle—including timestamp, operator ID (via login), recipe version, and measured ultrasonic amplitude and bond force deviation. All data is exportable via USB in CSV format for SPC analysis or integration into MES platforms. The system supports user-level access control (admin/operator modes) and maintains an immutable event log compliant with FDA 21 CFR Part 11 requirements when deployed in regulated environments. Firmware updates are delivered via secure signed packages and validated through checksum verification prior to installation.

Applications

• R&D validation of new wire materials (e.g., copper migration studies, palladium-coated Au alternatives)
• Pilot-scale qualification of advanced packaging architectures (e.g., SiP, fan-out wafer-level packaging)
• Failure analysis lab use for re-bonding damaged units or constructing test vehicles
• University cleanroom teaching platforms for microelectronics packaging curriculum
• Small-batch production of high-reliability devices (aerospace, automotive, medical sensors)
• Process window optimization for thermal budget-sensitive substrates (e.g., MEMS, GaN-on-Si)

FAQ

What wire materials and diameters does the HB16 support?
The HB16 bonds gold, aluminum, and copper wires ranging from 17 µm to 75 µm in diameter, plus aluminum ribbons up to 25 × 250 µm.
Is copper wire bonding supported out-of-the-box?
Yes—copper compatibility is enabled by default via optimized ultrasonic waveform tuning, elevated temperature control (up to 250 °C), and oxygen-free chamber options (optional accessory).
Can the HB16 perform both ball and wedge bonding with the same head?
Yes—switching between ball-wedge and wedge-wedge modes requires only capillary or wedge tool replacement; no hardware reconfiguration is needed.
Does the system meet regulatory requirements for medical device manufacturing?
When configured with audit-trail logging, electronic signatures, and calibrated thermal/force sensors, the HB16 supports compliance with ISO 13485 and FDA 21 CFR Part 11 for Class II/III device packaging process validation.
What is the maximum working distance from bond pad to bond head?
The bond arm extends 165 mm from pivot to tip, and the motorized micro-adjustment stage provides ±5 mm fine positioning in X/Y, enabling access to recessed or edge-mounted pads in complex packages.