Assembly & Packaging Equipment
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| Brand | JFP |
|---|---|
| Origin | France |
| Model | S200 Semi-Automatic Scriber and Breaker |
| Power Supply | 100–230 VAC, 1 kW |
| Air Pressure | 80 psi |
| Vacuum System | 100% vacuum, 15 L/min |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm |
| Weight | 70 kg |
| Wafer Handling | 2″ to 8″ |
| Minimum Die Size | 100 µm × 100 µm |
| Maximum Die Size | 150 mm × 150 mm |
| Z-axis Force Range | 5–80 g (adjustable via calibrated weights) |
| Diamond Scribe Tip | Adjustable angle & rotation |
| XY Stage Resolution | 1 µm (display), ±5 µm (positioning accuracy) |
| Y-axis Scribing Speed | 0.1–100 mm/s |
| Optical System | 22″ TFT monitor, ultra-HD color camera, electronic zoom ×10, LED illumination, JFP crosshair reticle |
| Control Interface | 7″ touchscreen, programmable step indexing & vertical spacing, scribe count & die ID logging |
| Brand | JFP |
|---|---|
| Origin | France |
| Equipment Type | Automatic Wire Bonder |
| Model | WB 200-e |
| Bonding Technology | Thermosonic Ball Bonding with 360° Rotational Capillary Actuation |
| Max. Z-Travel | 40 mm |
| Z-Axis Resolution | 0.23 µm |
| XY-Stage Range | 80 × 80 mm |
| XY/Z Resolution | 0.23 µm |
| Ultrasonic Power Range | 0–5 W |
| Frequency | 62 kHz (standard), optional 40/80 kHz |
| Bond Force Range | 10–150 cN |
| Bond Time Range | 0–2000 ms |
| Wire Diameter Support | Au/Al 17–50 µm, Ribbon 40–250 µm (w) × 12–25 µm (t) |
| Heating Stage Temp. Range | 60–250 °C (±1% accuracy) |
| Vision System | 5 MP industrial camera, 8× optical zoom, programmable coaxial & oblique LED illumination |
| Footprint | 640 × 710 × 550 mm |
| Weight | 60 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | WB200e |
| Pricing | Upon Request |
| Brand | LynceeTec |
|---|---|
| Origin | Switzerland |
| Model | DHM R1000 MEMS |
| Measurement Principle | Digital Holographic Interferometry (DHI) |
| Operating Mode | Non-contact, Full-field, Single-shot 4D Imaging (3D topography + time) |
| Vertical Resolution | ≤5 pm |
| In-plane Displacement Resolution | ≤1 nm (sub-pixel algorithm) |
| Maximum Excitation Frequency | 25 MHz |
| Frame Rate | Up to 1.25 MHz (with burst mode) |
| Software | MEMSAnalysis Tool v5.x |
| Compliance | ASTM E2558, ISO/IEC 17025-compatible workflows, FDA 21 CFR Part 11 audit trail support (optional), GLP/GMP-ready metadata logging |
| Brand | Mengqi |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Wafer Size Capacity | 8-inch |
| Grinding Wheel OD | 203 mm |
| Spindle Speed Range | 0–6000 rpm |
| Chuck Rotation Speed | 0–400 rpm |
| Z-Axis Stroke | 130 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional down to 0.01 µm/sec) |
| In-situ Thickness Measurement Resolution | 0.1 µm |
| In-situ Thickness Repeatability | ±0.001 mm |
| Material Compatibility | Si, GaAs, SiC, GaN, Sapphire, and other brittle semiconductor substrates |
| Customization | Fully configurable chuck, coolant delivery, metrology integration, and process recipe management |
| Brand | MONODE |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Instrument |
| Model | MONODE Barcode Reader |
| Price | USD 1,400 (approx.) |
| Brand | Monode |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | BRAVO IV |
| Price | USD 7,200 (FOB USA) |
| Brand | Monode |
|---|---|
| Origin | USA |
| Model | ICE |
| Marking Area | 120 mm × 100 mm |
| Column Height | 400 mm |
| Connectivity | Ethernet & Wi-Fi |
| User Interface | Touchscreen, Multilingual (22 languages) |
| Supported Content | Alphanumeric text, DataMatrix, QR codes, barcodes |
| Data Input | CSV file import |
| Logging | Timestamped marking log with traceability |
| Integration | PLC-compatible I/O, barcode printer interface |
| Compliance | CE, RoHS, FCC Part 15 |
| Brand | Monode |
|---|---|
| Origin | USA |
| Model | Monode Portable Pin Maker |
| Power Source | Rechargeable Lithium-ion Battery (5 Ah) |
| Marking Window | 50 mm × 30 mm |
| Marking Force | Adjustable |
| Marking Speed | Variable (file-driven) |
| Battery Runtime | Up to 3 h continuous / ~8 h intermittent |
| Compliance | HPGL-compatible output |
| Included Accessories | 1 charger + 2 batteries |
| Enclosure | Industrial-grade portable carry case with linear guide rails on X/Y axes |
| Weight & Form Factor | Compact, cordless, handheld design |
| Brand | MONODE |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Vestige Series Revolution |
| Laser Source | Pulsed Fiber (10 W or 20 W), Diode-Pumped, Air-Cooled |
| Compliance | FDA 21 CFR 1040.10, ANSI Z136.1-2000, MIL-STD-130 |
| Label Feed | Motorized Roll-to-Roll (4″ × 1000 ft) |
| Integrated Fume Extraction | HEPA-Filter Replaceable |
| UID Verification | Patented In-Line Validation Engine |
| Maintenance Profile | Low-Cost Scheduled Maintenance |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MR200 |
| Price Range | USD 13,500 – 40,500 (FOB) |
| Maximum Scribing Length | 200 mm |
| Scribing Force Range | 10 g – 130 g |
| Diamond Blade Contact Width | 5 µm – 10 µm |
| Zoom Microscope Magnification | 8× – 40× (continuous, stepless) |
| Optical Resolution at 10× | < 10 µm |
| X/Y Manual Stage Travel | 200 mm × 200 mm |
| Fine Positioning Accuracy | 0.01 mm (X/Y), 0.006° (rotation) |
| Wafer Chuck Diameter | 200 mm (standard), optional 100 mm |
| Vacuum Hold-Down Pressure | < 75 mbar |
| Power Supply | 100–220 V AC, 60 W |
| Dimensions (W×D×H) | 430 mm × 700 mm × 550 mm |
| Weight | ~16 kg |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Model | PlasmaEtch |
| Technology | Microwave-induced plasma etching |
| Patent | US Patent 9,548,227 B2 |
| Compliance | RoHS-compliant process, halogen-free etchant chemistry |
| Application | Semiconductor IC decapsulation for failure analysis (FA), cross-sectioning, and package-level defect inspection |
| Brand | Onto Innovation |
|---|---|
| Model | Dragonfly® G3 |
| Origin | Malaysia |
| Equipment Type | Inline AOI for Front-End & Advanced Packaging |
| Minimum Detectable Line Width/Spacing | 0.7 µm |
| Wafer Size Support | 100 mm – 330 mm |
| Maximum Substrate Area | >6400 mm² |
| 翘曲晶圆 & Taiko Handling | Supported |
| Imaging Modes | Brightfield, Darkfield, Oblique Illumination, IR Transmission |
| 3D Metrology | Truebump® (Multi-Modal 3D Profilometry) |
| Residue Detection | Clearfind® |
| Software Platform | nLINE™ with Real-Time Analysis, Offline Review, and Exploratory Bump-Level Data Analytics |
| Compliance Framework | Supports ASTM F2598 (Wafer Defect Classification), ISO 14644-1 (Cleanroom Integration), and GLP/GMP-aligned Audit Trail Logging |
| Brand | Osiris |
|---|---|
| Origin | Germany |
| Model | AFIXX 30s |
| Maximum Wafer Size | 200 mm |
| Temperature Range | Up to 650 °C (Independent Top/Bottom Plate Control) |
| Bonding Processes Supported | Thermal Compression, Adhesive Bonding, Glass Frit Bonding, Anodic Bonding, Eutectic Bonding, Direct Si–Si Bonding, SOI Bonding |
| Compatibility | Silicon, Compound Semiconductors (GaAs, SiC, GaN), Glass, Quartz, and SOI Wafers |
| System Architecture | Modular Bonding Chamber with In-Situ Alignment & Activation |
| Nanopatterning Capability | Integrated Nanoimprint Functionality |
| Compliance | Designed for GLP/GMP-aligned R&D and low-volume production environments |
| Operating Interface | Windows 10-based GUI with 22" Touchscreen HMI |
| Safety | Transparent Viewport Door for Real-Time Process Monitoring |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | LatticeAx 225 |
| Maximum Scribe Line Speed | 600 mm/min |
| Application Scope | Semiconductor Wafers, MEMS, Optoelectronics, and Thin-Film Devices |
| Positioning Accuracy | ±20 µm |
| Scribe Impression Length | <1 mm |
| Impression Width | ~10 µm |
| Imaging System | USB 2.0 Digital Microscope with Polarizing Filter and Real-Time Capture Software |
| Vacuum Fixation | Pneumatically Actuated Valve-Controlled Pump |
| Sample Compatibility | Si, SiC, GaAs, Sapphire, Glass, Quartz, and Thin-Film Substrates (Ø50–300 mm, Thickness 100–1000 µm) |
| Origin | USA |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Imported |
| Model | PELCO LatticeAx 420 |
| Price Range | USD 0–15,000 |
| Maximum Scribe Speed | 500–600 mm/min |
| Application Scope | Laboratory Use |
| Positioning Accuracy | ±10 µm |
| Indentation Step Resolution | 5 µm |
| Optical Magnification | 0.58–7× (zoom, parfocal, monocular) |
| Camera | Color CCD |
| Diamond Scribing Tip | Polished Single-Point Diamond |
| Focusing Mechanism | Coarse + Fine Focus Stage |
| Footprint | Compact Industrial Platform |
| Brand | PULUODY |
|---|---|
| Origin | Shaanxi, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | PMT-2 |
| Price | USD 72,800 (FOB) |
| Detection Principle | Dual-Laser Narrow-Beam Light Scattering |
| Sensor Generation | 8th-Generation Dual-Laser Optical Sensor |
| Flow Control | Precision Plunger Pump + Electromagnetic Flow Regulation |
| Calibration Standards | ISO 21501-4, USP <788>, EP 2.9.19, ChP 2020 Vol. IV, GB 8368 |
| Measurement Range | 0.1–1.0 µm (standard), customizable 1–100 µm or 4–70 µm(c), down to 0.1 µm(c) |
| Sampling Accuracy | <±1% |
| Counting Accuracy | ±3% typical |
| Coincidence Limit | 1000 particles/mL (2.5% coincidence error) |
| Output Interface | 4–20 mA analog output,超标 alarm relay (customizable) |
| Data Output | iPad-compatible wireless acquisition, touchscreen GUI + optional PC software (V8.3 Integrated Edition) |
| Power Supply | 100–265 VAC, 50–60 Hz |
| Compliance Architecture | Separated analytical testing & metrological calibration modules |
| Regulatory Alignment | Supports FDA 21 CFR Part 11 audit trail configuration (via optional software license), GLP/GMP-compliant reporting templates |
| Brand | PULUODY |
|---|---|
| Model | PMT-2 |
| Sensor Technology | 8th-Generation Dual-Laser Narrow-Beam Detection |
| Detection Range | 0.03–3000 µm (configurable sub-ranges: 1–100 µm, 4–70 µm(c), or 0.1 µm(c)) |
| Accuracy | ±3% typical |
| Sampling Precision | <±1% |
| Coincidence Limit | ≤2.5% at 1000 particles/mL |
| Calibration Standards | JJG 1061, ISO 21501-2, NIST-traceable latex spheres |
| Output | 4–20 mA analog interface with customizable alarm thresholds |
| Data Reporting | Particles per mL & ISO 4406 / NAS 1638 contamination codes |
| Power Input | 100–265 VAC, 50–60 Hz |
| Software | PULUODY V8.3 Analysis & Calibration Suite (PC + integrated touchscreen UI) |
| Compliance | Designed for GLP/GMP-aligned environments |
| Brand | PULUODY |
|---|---|
| Model | PMT-2CCS |
| Detection Threshold | 100 nm |
| Sensor Technology | 8th-Generation Dual-Laser Narrow-Beam Optical Sensor |
| Measurement Range | 0.1–0.5 µm (with customizable ranges: 1–100 µm or 4–70 µm(c), down to 0.1 µm(c)) |
| Sampling Accuracy | < ±1% |
| Counting Accuracy | < ±3% (typical) |
| Coincidence Limit | 1000 particles/mL (2.5% coincidence error) |
| Flow Control | Precision Piston Pump + Electromagnetic Flow Regulation |
| Calibration Standards | JJG 1061, ISO 21501, Polystyrene Latex (PSL) Spheres |
| Output Interface | 4–20 mA Analog Signal |
| Alarm Function | Configurable Particle Exceedance Alert |
| Power Input | 100–265 VAC, 50–60 Hz |
| Compliance | Designed for ISO 14644-1/2, SEMI F57, ASTM D6978, USP <788> & <789>, and GLP/GMP-aligned data integrity workflows |
| Brand | RKD |
|---|---|
| Origin | USA |
| Model | Elite Etch Cu Chemical Decapsulation System |
| Fluid Delivery Precision | Micro-dosed HNO₃ / H₂SO₄ / mixed acid |
| Maximum Acid Flow Rate | 8 mL/min |
| Acid Temperature Control Range | 10–250 °C |
| Minimum Wire Diameter Compatible | 0.8 mil (20.3 µm) Cu |
| Safety Features | Dual-sealed fluid interfaces, real-time leak detection, N₂ pressure interlock, fiber-optic lid sealing verification, cooled waste acid collection (<90 °C) |
| Control Interface | External handheld keypad |
| Compliance | Designed for ISO/IEC 17025 lab environments |
| Brand | RKD |
|---|---|
| Origin | USA |
| Model | RA-880 Laser Decapsulation System |
| Application | Semiconductor Plastic Encapsulant Removal |
| Compliance | Designed for ISO/IEC 17025-aligned failure analysis labs |
| Software Control | Windows-based real-time co-focal imaging & programmable laser scanning platform |
| Laser Type | Q-switched Nd:YAG (1064 nm) with variable pulse width and energy modulation |
| Focus Control | Auto-focus sensor with programmable depth-of-field (DOF) adjustment |
| Imaging | Integrated high-resolution coaxial CCD with 10×–50× optical zoom and real-time overlay of scan path |
| Pattern Definition | Vector-based graphical interface supporting DXF, JPEG, BMP import |
| Energy Management | Closed-loop pulse energy monitoring with ±2% stability |
| Reproducibility | <±3 µm positional repeatability across >1000 cycles |
| Maintenance | Solid-state laser source |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | DSM8/200 Gen2 |
| Measurement Principle | Dual-microscope optical alignment metrology with TIS-compensated image registration |
| Accuracy | ≤ 0.2 µm (after TIS compensation) |
| Configuration Options | Manual loading (DSM8 Gen2) / Robotic handling with custom chuck (DSM200 Gen2) |
| Illumination Options | Visible + optional IR illumination (for through-silicon feature imaging) |
| Software Platform | Cognex PatMax®-powered automated image analysis with recipe-driven operation |
| Compliance Context | Designed for GLP/GMP-aligned semiconductor process development and high-reliability packaging workflows |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Type | Manual Cleaving Instrument |
| Model | Small Sample Cleaver |
| Sample Width Capacity | 3–15 mm |
| Sample Thickness Range | 200–900 µm |
| Cleave Platform Dimensions | ≤2 × 2 mm |
| Indent Length | 0.5 mm |
| Compatibility | Designed for use with PELCO® LatticeAx® (1 mm indent) |
| Mounting | Four magnetic fixation points |
| Portability | Handheld, volume ≈ 100 mm³ |
| Brand | Tops |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | TL-1 EX, TL-1 Plus |
| Laser Source | Pulsed Fiber Laser (Nd:YAG, 1064 nm) |
| Operation Mode | Q-switched Pulsed |
| Laser Pulse Width | Nanosecond Range |
| Beam Delivery | Precision Galvo Scanning System |
| Safety Class | Class 4 Laser Product (IEC 60825-1) |
| Compliance | CE, RoHS, FDA 21 CFR Part 1040.10 |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB10 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter Range | 17–75 µm (gold/aluminum) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Ultrasonic Power Output | 0–5 W |
| Bond Time | 0–10 s |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-Axis Stroke | 17 mm |
| Deep-Cavity Bond Head Clearance | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage Capacity | 100 recipes |
| Temperature Control Range | up to 250 °C (±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB16 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter | 17–75 µm (Au/Al) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-axis Travel | 17 mm |
| Motorized Y-axis Travel | 7 mm |
| Bond Head Depth | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage | 100 recipes |
| Temperature Control | up to 250 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions | 680 × 640 × 490 mm |
| Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |