Hengyi HY-0230-2000N Horizontal Terminal Pull-Off Testing Machine

Overview

The Hengyi HY-0230-2000N Horizontal Terminal Pull-Off Testing Machine is an electromechanical tensile testing system engineered for precise quantification of mechanical interfacial strength in electrical and electronic interconnect components. It operates on the fundamental principle of uniaxial force application—applying controlled, linear tensile load along a horizontal axis to measure the maximum pull-off force required to separate crimped terminals from wires, detach connectors from housings, or delaminate adhesive-bonded assemblies. Unlike vertical configurations, its horizontal layout minimizes gravitational influence on specimen alignment and eliminates sag-induced bending moments during low-force, high-sensitivity tests—critical for evaluating micro-crimp integrity, miniature PCB-mounted sockets, and fine-gauge wire harness terminations. Designed for compliance with standardized mechanical test protocols—including IEC 60512-2-1 (electrical connectors), USCAR-21 (automotive terminal retention), and IPC-TM-650 2.4.1 (solder joint pull strength)—this instrument delivers traceable, repeatable data essential for QC release, design validation, and supplier qualification.

Key Features

• Horizontal load frame architecture optimized for axial alignment and minimal parasitic bending during terminal extraction tests
• High-resolution load cell with 0.01% full-scale accuracy and digital signal conditioning for stable low-load measurement down to 0.1% of 2000 N capacity
• Precision ground ball screw drive system coupled with servo motor control enabling smooth, programmable speed regulation from 0.001 to 300 mm/min
• Integrated 7-inch TFT LCD controller with real-time dynamic display of force–displacement curves, peak load, yield point, and displacement metrics
• Modular mounting base with T-slots and adjustable clamping fixtures compatible with standardized test jigs (e.g., IEC 60512-compliant terminal pull fixtures)
• RS232 and USB interfaces supporting bidirectional communication with Windows-based control software for automated test sequencing and report generation

Sample Compatibility & Compliance

The HY-2030-2000N accommodates a broad range of interconnect geometries: insulated and non-insulated crimp terminals (AWG 30–10), molded automotive connectors (e.g., Delphi Metri-Pack, TE Connectivity Mini-Universal), LED lamp bases, PCB edge connectors, and pressure-sensitive adhesive (PSA) bonded assemblies. Specimen holders are configurable via interchangeable jaw sets—including pneumatic, wedge-action, and custom-machined grips—to prevent slippage and premature failure at clamping points. The system supports method-defined testing per ASTM D903 (peel strength), ISO 8510-2 (adhesive bond strength), and IPC-J-STD-001 (solder joint mechanical integrity). All firmware and calibration routines adhere to GLP/GMP documentation requirements, with audit trails enabled for FDA 21 CFR Part 11-compliant environments when paired with validated software modules.

Software & Data Management

Hengyi’s proprietary TestMaster Pro software provides intuitive test setup, real-time curve overlay, statistical analysis (mean, SD, CV%, min/max), and customizable reporting templates aligned with ISO/IEC 17025 laboratory documentation standards. Raw data exports in CSV and XML formats ensure interoperability with LIMS platforms and statistical process control (SPC) tools such as Minitab or JMP. Calibration certificates include NIST-traceable references, and each load cell is individually characterized across five points (10%, 25%, 50%, 75%, 100% FS) with hysteresis and repeatability verification documented per ISO 376. Firmware updates are delivered via secure HTTPS portal with version-controlled release notes and change logs.

Applications

• Quantifying crimp retention force of automotive wiring harness terminals under thermal cycling preconditioning
• Evaluating peel strength of flexible printed circuit (FPC) connectors subjected to vibration fatigue
• Verifying mechanical robustness of medical device cable assemblies per IEC 60601-1 clause 8.10.2
• Assessing adhesive bond integrity between LED heat sinks and ceramic substrates in high-power lighting modules
• Conducting comparative analysis of solder joint pull strength across reflow profiles in SMT process development
• Supporting root cause analysis of field return failures through correlation of pull-off force degradation with environmental stress exposure

FAQ

What is the minimum resolvable force at full 2000 N capacity?
The system resolves forces to 0.2 N (0.01% of 2000 N), verified by metrological calibration using deadweight standards traceable to NIM (National Institute of Metrology, China).
Can the machine perform cyclic loading or dwell tests?
Yes—TestMaster Pro supports multi-step programs including load-controlled hold, displacement-controlled ramp-hold-ramp, and up to 999-cycle fatigue sequences with user-defined upper/lower limits.
Is third-party calibration certification included with purchase?
A factory calibration certificate with uncertainty budget is provided; optional UKAS-accredited calibration (ISO/IEC 17025) is available upon request prior to shipment.
Does the system meet CE or UL safety directives?
The instrument complies with EN 61000-6-2 (EMC immunity) and EN 61000-6-4 (EMC emission); mechanical safety conforms to EN ISO 12100 and EN 60204-1, with CE marking applied for EU market deployment.
How is data integrity ensured during long-duration tests?
All measurements are timestamped and stored in non-volatile memory with automatic backup to external USB storage; power-fail recovery resumes test execution from last valid data point without loss of curve continuity.