Jianhu PI/BPO/BCB Photoresist Curing Oven Series – Precision Thermal Processing System for Semiconductor and Microelectronics Manufacturing
| Brand | Jianhu |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Integrated OEM & Solution Provider |
| Product Category | Domestic High-Precision Industrial Curing Oven |
| Model Range | JH-CURE-PI/BPO/BCB Series |
| Price Range | USD 1,100 – 110,000 (FOB Shanghai) |
Overview
The Jianhu JH-CURE-PI/BPO/BCB Series is a purpose-engineered thermal processing system designed specifically for the controlled thermal curing of polyimide (PI), benzophenone (BPO), and benzocyclobutene (BCB) photoresists and adhesives in semiconductor packaging, MEMS fabrication, flexible printed circuit (FPC) manufacturing, and advanced microelectronic assembly. Unlike general-purpose industrial ovens, this series implements a dual-zone convection architecture with laminar airflow management, high-stability PID+ fuzzy logic temperature control, and ISO Class 5–7 compatible chamber sealing—enabling precise thermal ramping, dwell stability, and contamination mitigation critical for sub-micron bondline integrity and dielectric reliability. The system operates within a validated temperature range of 50 °C to 300 °C, supporting industry-standard cure profiles per JEDEC J-STD-020, IPC-CC-830B, and SEMI F47, with real-time deviation monitoring traceable to NIST-traceable reference thermocouples.
Key Features
- Precision thermal control: ±0.5 °C maximum deviation from setpoint across full operating range; uniformity ≤ ±1.2 °C within usable chamber volume (per ASTM E2207-22)
- Dual-stage filtration: Pre-filter + HEPA H14 (99.995% @ 0.3 µm) integrated into recirculation path; optional nitrogen purge interface for oxygen-sensitive BCB curing
- Multi-segment programmable controller: Up to 32-step ramp-soak profiles with independent slope rate control (0.1–20 °C/min), user-defined alarm thresholds, and hardware interlock for overtemperature cut-off
- Structural integrity: Stainless steel 316L inner chamber with electropolished finish; double-wall insulated construction (min. 120 mm mineral wool + vacuum panel); door gasket certified to ISO 14644-1 Class 5 leakage specification
- Core component redundancy: Dual independent temperature sensing circuits (Type K thermocouples + RTD backup); solid-state relay output with thermal derating protection
Sample Compatibility & Compliance
The JH-CURE series accommodates standard wafer carriers (FOUPs, SMIF pods), PCB pallets (up to 610 × 610 mm), and custom jig-mounted substrates up to 50 kg load capacity. Chamber geometry supports both batch-mode and sequential loading configurations. All models comply with IEC 61000-6-2 (EMC immunity), IEC 61000-6-4 (EMC emission), and UL 61010-1 safety standards. Full documentation packages—including IQ/OQ protocols, calibration certificates (traceable to CNAS-accredited labs), and material compliance declarations (RoHS 3, REACH SVHC)—are provided as standard. For regulated environments, optional 21 CFR Part 11-compliant audit trail logging and electronic signature modules are available.
Software & Data Management
Jianhu’s proprietary CURE-LOGIC v4.2 software provides local HMI operation via 10.1″ capacitive touchscreen and remote supervisory access via Ethernet/IP or Modbus TCP. The platform records time-stamped temperature, airflow velocity, chamber pressure differential, and door status at configurable intervals (1–60 s). Data exports natively to CSV and .tdms formats; optional integration with MES systems (Siemens Opcenter, Rockwell FactoryTalk) is supported through OPC UA server extension. All firmware updates undergo GLP-aligned validation, and version-controlled change logs are retained for GMP audit readiness.
Applications
- Thermal crosslinking of photosensitive polyimides in COF (chip-on-film) and TAB (tape-automated bonding) processes
- Cure stabilization of BCB dielectric layers for RF-MEMS cavity formation and wafer-level packaging
- Post-application baking of BPO-based negative-tone resists in high-resolution lithography stacks
- Stress-relief annealing of adhesive-bonded sensor assemblies in automotive ADAS modules
- Accelerated aging validation of encapsulant materials under JEDEC HTSL conditions
FAQ
What temperature uniformity specifications apply to the working zone—not just the sensor location?
Uniformity is measured at nine standardized points (per ASTM E2207) within the usable load volume (defined as 80% of chamber width/depth/height); reported value is ±1.2 °C max deviation at steady state.
Is nitrogen purging capability factory-installed or retrofittable?
N₂ interface (ISO-KF 25 flange + mass flow controller) is available as a factory-configured option; retrofit requires chamber modification and recalibration—contact Jianhu Applications Engineering for feasibility assessment.
Does the system support automated recipe transfer from external process control systems?
Yes—via OPC UA client/server mode or direct Modbus TCP register mapping; pre-built templates exist for common MES platforms.
How is calibration maintained during extended production runs?
Built-in auto-calibration routine executes daily at startup using internal reference junctions; annual third-party verification is recommended per ISO/IEC 17025 requirements.
What is the warranty coverage for heating elements and circulation fans?
Heating elements and EC centrifugal fans are covered under the 36-month comprehensive warranty; consumables (filters, gaskets) are excluded but supplied with documented replacement intervals.
