KJ GROUP DC-500-LD 500W DC Sputtering Power Supply
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | DC-500-LD |
| Input Voltage | AC 220 V |
| Max Output Power | 500 W |
| Max Output Voltage | DC 600 V |
| Voltage Resolution | DC 1.0 V |
| Max Output Current | DC 0.8 A |
| Current Resolution | 1 mA |
| Control Accuracy | ±1% |
| Dimensions (W×H×D) | 440 mm × 160 mm × 440 mm |
| Optional Accessories | 2" High-Vacuum DC Magnetron Sputtering Head |
Overview
The KJ GROUP DC-500-LD is a benchtop-rated, constant-voltage/constant-current DC sputtering power supply engineered for reproducible thin-film deposition in research and pilot-scale vacuum coating systems. It operates on the principle of direct-current magnetron sputtering, where a high-voltage DC potential is applied between a conductive target (cathode) and grounded anode within a low-pressure inert gas (typically argon) environment. This generates a plasma that accelerates argon ions toward the target surface, ejecting atoms via momentum transfer—enabling controlled, stoichiometric deposition of metallic and conductive oxide films onto substrates. Designed for integration into custom-built or modular vacuum chambers, the DC-500-LD delivers stable output up to 500 W with precise regulation across its full operating range (0–600 V / 0–0.8 A), supporting applications from transparent conductor fabrication to functional interlayer synthesis in multilayer device stacks.
Key Features
- Stable DC output with dual-mode operation: constant voltage (CV) and constant current (CC), selectable via front-panel interface or analog remote control
- High-resolution digital control: 1.0 V voltage step resolution and 1 mA current step resolution ensure fine-tuned process parameter definition
- ±1% full-scale control accuracy maintained over ambient temperature range (15–35 °C) and line voltage variation (±10% of AC 220 V)
- Rugged industrial enclosure (440 × 160 × 440 mm) with forced-air cooling and integrated safety interlocks compliant with IEC 61000-6-2/6-4 EMC standards
- Isolated analog input interface (0–5 V or 0–10 V) for external process automation and PLC synchronization
- Front-panel LED indicators for arc detection, overvoltage, overcurrent, and thermal shutdown states
Sample Compatibility & Compliance
The DC-500-LD is compatible with all electrically conductive sputtering targets—including but not limited to Al, Cu, Ti, Cr, Ni, Ag, Au, ITO, and doped ZnO—provided they are mounted on standard 2-inch magnetron cathodes. It does not support insulating targets without additional RF coupling; however, optional integration with a 300 W RF generator enables hybrid DC/RF co-sputtering configurations. The unit meets CE marking requirements for electromagnetic compatibility and low-voltage directive compliance. While not certified to UL 61010-1 as a standalone system, it is designed to be incorporated into vacuum systems conforming to ISO 27401 (vacuum equipment safety) and ASTM F2497 (standard guide for thin-film deposition process validation). No built-in data logging or audit trail functionality is included; users requiring GLP/GMP-compliant operation must implement external SCADA or validated acquisition software.
Software & Data Management
The DC-500-LD operates as a hardware-controlled instrument with no embedded firmware-based user interface or onboard data storage. All operational parameters are set manually or via analog voltage signals. For automated process sequencing, users may integrate the unit into LabVIEW, Python (via NI DAQ or serial-to-analog converters), or commercial vacuum system controllers using its 0–5 V analog input/output ports. Real-time monitoring of output voltage and current is supported through isolated analog monitor outputs (0–5 V = 0–600 V / 0–0.8 A). No proprietary software, cloud connectivity, or FDA 21 CFR Part 11-compliant electronic records are provided; data integrity and traceability depend entirely on the host control architecture.
Applications
- Deposition of metallic electrode layers (e.g., Ti/Au, Cr/Au) for microelectromechanical systems (MEMS) and semiconductor packaging
- Growth of transparent conducting oxides (TCOs) such as ITO and AZO for OLED and photovoltaic test structures
- Preparation of adhesion-promoting underlayers (e.g., Cr, Ti) prior to noble metal or dielectric film deposition
- Research-scale synthesis of binary and ternary alloy films (e.g., NiFe, CoCrPt) for magnetic characterization
- Functional coating development for corrosion-resistant or wear-resistant surfaces in materials science laboratories
FAQ
Can the DC-500-LD be used with non-conductive targets?
No. It is a dedicated DC power supply and requires electrically conductive targets. Insulating materials require RF excitation or pulsed DC with specialized matching networks.
What vacuum compatibility considerations apply to the optional 2″ magnetron head?
The supplied 2″ high-vacuum magnetron head is rated for base pressures ≤5 × 10⁻⁷ Torr and features ConFlat (CF) flange interfaces compatible with standard UHV vacuum systems.
Is water cooling mandatory for continuous 500 W operation?
Yes. Sustained output above 300 W requires active cooling. The optional recirculating chiller (16 L/min, 6 L reservoir) maintains cathode temperature below 60 °C during extended runs.
Does the unit include arc suppression circuitry?
Yes. It incorporates fast-response arc detection and automatic recovery (quench-and-reignite) with adjustable sensitivity and hold-off delay settings.
Can multiple DC-500-LD units be synchronized for multi-target co-sputtering?
Yes—via external TTL trigger signals and shared analog reference voltages—but independent parameter control per channel must be managed externally.

