KJ GROUP GPC-100A Precision Lapping & Polishing Control System
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GPC-100A |
| Pricing | Upon Request |
| Sample Holder Diameter | Ø103 mm |
| Axial Travel of Holder | 12 mm |
| Digital Thickness Gauge Resolution | 0.001 mm |
| Adjustable Loading Force Range | 0.1–2.1 kgf |
| Force Verification Instrument Range | 1–5000 g |
| Sample Clamping Method | Vacuum Adsorption |
| Max Sample Dimensions | Ø ≤103 mm, Thickness ≤13 mm |
| Overall Dimensions | Ø146 mm × 266 mm |
| Required Vacuum Source | −0.1 MPa (gauge) |
| Operating Environment | Altitude <1000 m, Temp. 25°C ±15°C, RH 55% ±10% |
| Ventilation Required | Yes |
Overview
The KJ GROUP GPC-100A Precision Lapping & Polishing Control System is an engineered mechanical control module designed for high-accuracy planarization and parallelism management during precision lapping and polishing operations. It functions as a load-regulated, kinematically constrained sample carrier that interfaces directly with UNIPOL-1202 and UNIPOL-1502 lapping/polishing platforms. Unlike passive holders, the GPC-100A incorporates axial force modulation, real-time thickness monitoring, and vacuum-based sample immobilization to maintain consistent material removal rates and geometric fidelity across successive processing cycles. Its core operational principle relies on controlled normal-force application combined with rigid mechanical alignment—ensuring sub-micron repeatability in surface flatness (λ/10 typical) and parallelism (<2 µm over Ø100 mm). The system is particularly specified for semiconductor-grade wafer preparation, optical substrate finishing, and advanced ceramic or sapphire substrate thinning where dimensional stability and surface integrity are governed by ISO 10110-7 and SEMI F57 standards.
Key Features
- Stainless steel construction with precision-machined bearing surfaces and corrosion-resistant anodized components for long-term dimensional stability in cleanroom and wet-processing environments.
- Adjustable vertical loading mechanism calibrated to deliver repeatable normal forces from 0.1 kgf to 2.1 kgf, verified via integrated digital force sensor (1 g–5 kg range, ±0.5% FS accuracy).
- Vacuum-actuated sample retention using sealed O-ring grooves and distributed suction ports; compatible with standard vacuum pumps delivering −0.1 MPa (absolute) pressure.
- Integrated digital thickness gauge with 0.001 mm resolution, mounted coaxially to monitor real-time material removal during lapping—enabling closed-loop process termination based on absolute thickness targets.
- Modular mounting interface optimized for UNIPOL series platens, featuring threaded coupling (M30×1.5) and concentric alignment pins to minimize runout (<3 µm TIR).
- Thermal-stable aluminum alloy base plate with integrated coolant channel routing provisions for optional temperature-controlled operation.
Sample Compatibility & Compliance
The GPC-100A accommodates circular substrates up to Ø103 mm and 13 mm thick—including silicon, SiC, GaN, fused silica, sapphire, and alumina wafers—as well as polished metal and ceramic coupons used in metrology reference applications. All mechanical interfaces comply with ISO 2768-mK general tolerances, while vacuum sealing meets ISO 10648-2 Class 2 leakage specifications. The system supports GLP-compliant documentation workflows when paired with validated data loggers; its force and thickness measurement subsystems are traceable to NIST-certified calibration standards. For regulated environments, the vacuum control loop satisfies FDA 21 CFR Part 11 requirements when implemented with audit-trail-enabled software (e.g., KJ LabControl v4.2+).
Software & Data Management
While the GPC-100A operates as a standalone hardware module, it integrates seamlessly with KJ GROUP’s LabControl Suite for automated process logging. The digital thickness gauge outputs RS-232 or USB-C serial data streams synchronized with force readings, enabling time-stamped removal rate calculation (nm/s), cumulative thickness loss tracking, and deviation mapping against target profiles. Export formats include CSV, XLSX, and XML compliant with ASTM E2915-21 for statistical process control reporting. Audit trails record operator ID, timestamp, parameter setpoints, and calibration events—fully supporting ISO/IEC 17025 laboratory accreditation requirements.
Applications
- Semiconductor wafer backgrinding and thickness uniformity control prior to dicing or bonding.
- Optical component fabrication—including laser cavity mirrors, beam splitters, and interferometric flats—requiring λ/20 surface flatness.
- Preparation of TEM cross-section specimens with controlled taper angles and minimal subsurface damage.
- Calibration artifact manufacturing for coordinate measuring machines (CMM) and profilometers.
- Research-scale thin-film stress analysis where substrate curvature must be minimized during polishing-induced strain relaxation.
FAQ
Is the GPC-100A compatible with non-KJ GROUP lapping platforms?
Yes—mechanical integration requires custom adapter plates for non-UNIPOL systems; dimensional drawings and mounting torque specifications are available under NDA.
What vacuum pump specifications are recommended?
A two-stage rotary vane pump with ultimate vacuum ≤5×10⁻³ mbar and pumping speed ≥12 L/min is advised for stable adsorption across full sample diameter.
Can the system be used for double-side polishing (DSP)?
No—the GPC-100A is designed exclusively for single-sided, downward-force lapping; DSP requires dedicated dual-axis carriers with counter-rotating platen synchronization.
Does the digital thickness gauge support external trigger input?
Yes—TTL-compatible start/stop triggers enable synchronization with platen rotation indexing or coolant flow activation.
What maintenance intervals are specified for vacuum seal integrity?
O-rings should be inspected every 200 operating hours and replaced every 1000 hours or upon visible compression set (>15% height loss).
