KJ GROUP GSL-1100X-SPC-12 Plasma Sputter Coater
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GSL-1100X-SPC-12 |
| Input Voltage | 208–240 V AC, 50/60 Hz |
| Sample Stage Diameter | Φ60 mm, height-adjustable |
| Chamber | Quartz tube, Φ100 mm × 130 mm |
| Gas Inlet | Integrated precision valve for controlled gas introduction (Ar, N₂, O₂, etc.) |
| Target Specifications | 4N purity Au target, Φ57 mm × 0.12 mm |
| Max. Sample Diameter | 40 mm |
| Max. Film Thickness | Up to 300 nm |
| Dimensions (W×D×H) | 480 × 320 × 150 mm |
| Weight | 20 kg |
Overview
The KJ GROUP GSL-1100X-SPC-12 Plasma Sputter Coater is a compact, benchtop DC magnetron sputtering system engineered for reproducible, low-vacuum thin-film deposition of conductive metallic layers onto non-conductive or poorly conductive substrates. Operating on the principle of glow-discharge plasma generation in inert (typically argon) or reactive atmospheres, the instrument enables controlled ion bombardment of high-purity metallic targets—inducing atomic ejection and subsequent condensation as uniform nanoscale films on sample surfaces. Its primary application domain includes SEM sample preparation, where ultra-thin, continuous, and low-resistivity coatings (e.g., Au, Pt, Ag) are essential to prevent charging artifacts during high-resolution electron imaging. The system integrates a quartz vacuum chamber, adjustable sample stage, and programmable current/time control—delivering consistent film morphology and thickness repeatability across routine laboratory workflows.
Key Features
- DC magnetron sputtering architecture with integrated electromagnet for enhanced plasma confinement and target utilization efficiency
- Adjustable DC current (0–50 mA range typical) and precise digital timer (0.1–999 s) for fine-tuned deposition control
- Quartz cylindrical chamber (Φ100 mm × 130 mm) offering optical transparency, chemical inertness, and ease of visual process monitoring
- Height-adjustable Φ60 mm sample stage accommodating substrates up to Φ40 mm—optimized for standard SEM stubs and TEM grids
- Integrated gas inlet with precision needle valve for stable, repeatable flow control of Ar, N₂, O₂, or mixed gases
- CE-certified design compliant with EN 61000-6-3 (EMC) and EN 61000-6-2 (immunity) standards for safe laboratory deployment
- Built-in safety interlocks, overcurrent protection, and vacuum pressure monitoring to ensure operational integrity
Sample Compatibility & Compliance
The GSL-1100X-SPC-12 supports a broad range of substrate materials including silicon wafers, glass slides, polymer films, biological tissues (freeze-dried or critical-point dried), and ceramic fragments. Its low base pressure (<5 × 10⁻² mbar) and stable plasma ignition enable uniform coating on topographically complex or fragile specimens without thermal damage. All internal wetted parts are constructed from inert quartz and stainless steel, ensuring compatibility with cleanroom environments and minimizing contamination risk. While not classified as GMP-grade equipment, the system’s repeatable process parameters (current, time, gas flow) support documentation-driven workflows aligned with GLP principles. It meets fundamental electrical safety and electromagnetic compatibility requirements per EU directives, facilitating integration into ISO/IEC 17025-accredited laboratories conducting routine SEM sample preparation.
Software & Data Management
This model operates via an intuitive front-panel interface with LED display and tactile push-button controls—designed for rapid setup and minimal training overhead. No proprietary software is required; all process parameters (sputtering current, duration, gas type) are manually entered and retained per session. For traceability, users may log settings in external laboratory notebooks or LIMS-compatible spreadsheets. Though lacking automated data export or audit trail functionality, its deterministic operation enables full procedural documentation—supporting FDA 21 CFR Part 11 compliance when paired with institutional electronic record policies. Optional RS-232 or USB-to-serial adapters (not included) allow basic parameter logging via third-party terminal emulators.
Applications
- Preparation of conductive coatings for scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS)
- Deposition of Au, Pt, or Ag electrodes for microelectrode fabrication and biosensor development
- Thin-film seed layers for subsequent electrochemical or physical vapor deposition steps
- Rapid metallization of insulating geological or paleontological samples prior to high-magnification imaging
- Teaching and demonstration of plasma physics fundamentals and thin-film growth mechanisms in materials science curricula
FAQ
What target materials are compatible with the GSL-1100X-SPC-12?
Standard configurations include 4N-purity Au, Pt, and Ag targets (Φ57 mm × thickness options). Custom targets (e.g., Cr, Ti, Ni, ITO) can be installed provided they meet dimensional and conductivity specifications.
Is vacuum pumping hardware included?
Yes—the system ships with a two-stage rotary vane pump capable of achieving ≤5 × 10⁻² mbar base pressure. Oil mist filter and vibration isolation mounts are recommended accessories.
Can reactive sputtering (e.g., TiO₂, SiO₂) be performed?
Yes—by introducing oxygen or nitrogen alongside argon, compound films may be deposited using appropriate metal targets (e.g., Ti, Si), though stoichiometry control requires external mass flow controllers and endpoint monitoring.
How is film thickness estimated without in-situ monitoring?
Thickness is inferred empirically using calibrated time–thickness curves established via profilometry or TEM cross-sectioning for each target–gas–current combination.
What maintenance is required for long-term reliability?
Routine tasks include quarterly cleaning of the quartz chamber interior, periodic inspection of O-rings and target bonding, and annual oil replacement in the vacuum pump.
