KJ GROUP SKZD-2 Precision Dropper Dispenser for Grinding & Polishing Systems
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | SKZD-2 |
| Pricing | Upon Request |
| Voltage/Power | DC 24 V, 60 W |
| Capacity | 1.5 L |
| Flow Rate | 0–35 mL/min |
| Dimensions (W×D×H) | 170 mm × 290 mm × 350 mm |
| Weight | 3 kg |
| Operating Environment | ≤1000 m altitude, 10–40 °C ambient temperature, 45–65 %RH |
| Power Input | AC 110/220 V, 50/60 Hz → DC 24 V adapter included |
| Water Supply | External reservoir required (not included) |
| Air Supply | Not required |
| Workbench Clearance | ≥300 mm × 400 mm × 700 mm |
| Ventilation | Recommended for prolonged operation in enclosed spaces |
Overview
The KJ GROUP SKZD-2 Precision Dropper Dispenser is an engineered fluid delivery module designed specifically for integration with UNIPOL-series grinding and polishing systems used in materials science laboratories and semiconductor wafer processing facilities. It operates on a continuous, gravity-assisted peristaltic-free dispensing principle, utilizing a motor-driven internal agitator to maintain homogeneity of abrasive slurries during extended operation. Unlike passive drip systems, the SKZD-2 actively prevents sedimentation of high-density or low-solubility abrasives—such as alumina (Al₂O₃), silicon carbide (SiC), and cerium oxide (CeO₂)—by sustaining uniform suspension through controlled rotational agitation. This ensures consistent volumetric flow across variable viscosity ranges (1–500 mPa·s), critical for reproducible material removal rates and surface finish control in precision lapping, CMP pre-polish, and metallurgical sample preparation.
Key Features
- Infinitely variable flow rate control (0–35 mL/min) via analog voltage-adjusted DC motor drive, enabling fine-tuned slurry dosing aligned with process-specific material removal requirements.
- Integrated dual-function agitator: stainless-steel paddle rotates at 30–120 rpm to suppress particle settling without inducing foaming or air entrainment—optimized for aqueous-based slurries with densities up to 1.8 g/cm³.
- Compact footprint (170 × 290 × 350 mm) and modular mounting design allow direct placement atop UNIPOL series polishers, eliminating need for external stands or tubing manifolds.
- Chemically resistant 1.5 L polypropylene reservoir with calibrated sight gauge and quick-release cap for rapid slurry replenishment and cleaning.
- Low-noise operation (<45 dB(A)) achieved via brushless DC motor and vibration-damped housing—compliant with ISO 14040 environmental noise guidelines for shared lab spaces.
- DC 24 V power architecture enhances electrical safety and enables seamless integration with industrial PLC-controlled polishing workflows.
Sample Compatibility & Compliance
The SKZD-2 is validated for use with water-based abrasive suspensions commonly employed in ASTM E3-22 (Standard Guide for Preparation of Metallographic Specimens) and ISO 1638-2:2020 (Particle contamination analysis—Part 2: Liquid samples). It supports slurries containing particles ranging from 0.05 µm (colloidal silica) to 15 µm (fused alumina), provided density remains within operational limits. The unit complies with IEC 61000-6-3 (EMC emission standards) and meets CE marking requirements for laboratory equipment under Directive 2014/30/EU. While not certified for GMP or FDA 21 CFR Part 11 environments, its repeatable dispensing performance supports GLP-aligned documentation when paired with external audit-trail-capable data loggers.
Software & Data Management
The SKZD-2 operates as a standalone analog-controlled device with no embedded firmware or digital interface. Flow calibration is performed manually using the front-panel potentiometer; users may record setpoints and corresponding measured flow rates (via gravimetric or volumetric verification) in external laboratory notebooks or LIMS platforms. For automated process integration, the 0–10 V analog input can be driven by programmable logic controllers (PLCs) or third-party motion controllers supporting standard industrial I/O protocols (e.g., Modbus RTU over RS-485 via optional adapter). No proprietary software or drivers are required.
Applications
- Automated slurry delivery in metallographic specimen preparation for optical microscopy and SEM cross-section analysis.
- Controlled abrasive feed in silicon wafer back-grinding and compound semiconductor substrate thinning.
- Consistent coolant-lubricant dosing in precision ceramic grinding where thermal stability and surface integrity are paramount.
- Research-scale tribological testing requiring repeatable particulate loading in pin-on-disk or ball-on-flat configurations.
- Education labs performing hands-on materials processing experiments under standardized ASTM E112 or ISO 643 protocols.
FAQ
Can the SKZD-2 dispense organic solvents such as ethanol or acetone?
No—the reservoir and wetted components are rated only for aqueous and mildly alkaline/acidic slurries (pH 4–10); exposure to organic solvents may compromise polypropylene integrity.
Is the flow rate linearly proportional to the adjustment knob position?
Flow exhibits near-linear response across 20–90% of full-scale setting; below 20%, minor hysteresis may occur due to static friction in the agitator shaft seal.
Does the unit include tubing or connectors for connection to the polisher?
No—standard 6 mm OD silicone or Tygon® tubing and barbed fittings must be sourced separately per user’s UNIPOL model configuration.
What maintenance is required to ensure long-term accuracy?
Monthly cleaning of the agitator shaft and reservoir interior with deionized water; annual inspection of motor brush life (if applicable) and seal compression.
Can multiple SKZD-2 units be synchronized for multi-slurry processes?
Yes—when driven by a common analog signal source or synchronized PLC outputs, units maintain ±2% inter-unit flow deviation under identical settings.
