KJ GROUP UNIPOL-1203 Chemical Mechanical Polishing and Grinding System

Overview

The KJ GROUP UNIPOL-1203 Chemical Mechanical Polishing and Grinding System is an engineered platform for precision surface planarization and finishing of hard and brittle materials—including silicon wafers, sapphire substrates, ceramic components, optical crystals, and compound semiconductors. It implements controlled chemical mechanical polishing (CMP), a process that combines mechanical abrasion with chemically reactive slurries to achieve sub-micron surface flatness and nanoscale roughness (Ra < 0.5 nm typical). The system integrates dual independent processing stations, enabling parallel or sequential operation under identical or differentiated process parameters—critical for comparative studies, process development, and qualification of new slurry formulations or pad conditioning strategies. Its structural architecture features corrosion-resistant wet-zone materials (e.g., 316 stainless steel platters, PTFE-coated fluid pathways), ensuring long-term stability in acidic, alkaline, or oxidizing environments common in semiconductor and optoelectronic fabrication.

Key Features

• Dual-station configuration with fully independent control of rotational speed (10–240 rpm), arm oscillation (15 adjustable positions), and dwell time—enabling side-by-side optimization of CMP protocols.
• High-precision stainless-steel polishing platter (φ300 mm) with certified flatness ≤0.0025 mm over any 25 mm × 25 mm zone, verified via optical interferometry per ISO 10110-7.
• Low-runout spindle assembly with ≤0.008 mm total indicated runout (TIR) at 250 mm radius—minimizing harmonic vibration and ensuring uniform material removal rate (MRR) across the wafer surface.
• GPC-100A precision polishing controller featuring vacuum-assisted sample mounting (Ø103 mm chuck), digitally adjustable downforce (0.1–2.1 kg range), and axial stroke adjustment (12 mm travel) for controlled pad conformity and pressure profiling.
• SKZD-4 programmable multi-channel dosing system with four independent peristaltic pumps, timer-based dispensing (1–999 min), and fine-resolution flow control (0.1–10 mL/min)—supporting multi-step slurry delivery, rinse sequences, and endpoint detection integration.
• Full-touch HMI interface with real-time parameter logging, recipe storage (≥100 presets), and password-protected user levels—designed for traceability in GLP-compliant laboratories and R&D environments.

Sample Compatibility & Compliance

The UNIPOL-1203 accommodates rigid planar samples up to Ø103 mm diameter and 12 mm thickness, secured via vacuum suction on ceramic or metal-backed carriers. Compatible substrate classes include single-crystal Si, GaN, SiC, fused silica, BK7 glass, alumina, zirconia, and lithium niobate. All wetted components meet ASTM F2217 (Standard Guide for Cleaning and Sterilization of Semiconductor Manufacturing Equipment) material compatibility requirements. The system supports method validation per SEMI S2/S8 safety guidelines and can be configured for audit-ready data capture aligned with FDA 21 CFR Part 11 when paired with optional electronic signature modules and external LIMS integration.

Software & Data Management

The embedded control firmware provides synchronized acquisition of rotational speed, applied load, elapsed time, and dosing volume—exportable as CSV or Excel-compatible files via USB 2.0. Optional PC-based software (KJ-CMP Suite v3.2) enables advanced statistical process control (SPC), trend analysis of removal rate linearity, and cross-platform comparison of Ra/Rq values from profilometer-integrated workflows. Audit trails record operator ID, timestamp, parameter changes, and emergency stop events—retained for ≥18 months without manual intervention. Data encryption and role-based access controls comply with ISO/IEC 27001 information security baseline requirements.

Applications

• Pre-epitaxial wafer conditioning for III–V and wide-bandgap semiconductor epitaxy.
• Final finish polishing of optical lens blanks and laser cavity mirrors requiring λ/20 surface figure tolerance.
• Surface preparation of MEMS inertial sensors prior to thin-film deposition.
• Research-scale evaluation of novel abrasive particles (e.g., ceria, colloidal silica, diamond nanocomposites) and pH-responsive slurries.
• Failure analysis sample preparation—cross-sectioning and beveling of packaged ICs with minimal smearing or delamination.
• Calibration standard generation for atomic force microscopy (AFM) and white-light interferometry (WLI) metrology systems.

FAQ

What types of slurries are compatible with the SKZD-4 dosing system?
The SKZD-4 supports aqueous, glycol-based, and low-viscosity organic slurries with particle concentrations up to 30 wt% and maximum suspended particle size of 5 µm. Abrasive-free chemical etchants (e.g., HF/NH₄F mixtures) require optional chemically resistant pump tubing.
Can the UNIPOL-1203 be integrated into a cleanroom environment?
Yes—the unit meets ISO Class 5 particulate emission limits when operated with HEPA-filtered exhaust ducting and grounded anti-static flooring. Optional laminar flow hoods and solvent-resistant enclosures are available.
Is GPC-100A pressure calibration traceable to national standards?
Each GPC-100A unit ships with a factory calibration certificate referenced to NIST-traceable deadweight testers (Class M1, uncertainty ±0.05 % FS), valid for 12 months under normal use conditions.
Does the system support automated endpoint detection?
While the base configuration does not include in-situ optical monitoring, the control interface provides TTL-level trigger outputs compatible with third-party eddy-current, interferometric, or motor-current signature sensors for closed-loop endpoint control.
What maintenance intervals are recommended for long-term reliability?
Platter surface reconditioning every 200 operational hours; pump tubing replacement every 6 months or 1000 cycles; vacuum filter cleaning after each 50 runs; annual verification of spindle runout and load cell linearity by authorized service personnel.