KJ GROUP UNIPOL-1502AT Automatic Precision Lapping and Polishing System
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Direct Manufacturer |
| Model | UNIPOL-1502AT |
| Spindle Speed | 10–125 rpm (infinitely variable) |
| Platen Diameter | Ø381 mm |
| Dimensions (L×W×H) | 620 × 740 × 440 mm |
Overview
The KJ GROUP UNIPOL-1502AT Automatic Precision Lapping and Polishing System is an engineered solution for high-fidelity planar surface preparation of rigid solid specimens across materials science, semiconductor, metallurgy, geology, and ceramic research laboratories. It operates on a dual-motion kinematic principle—combining controlled rotation of the specimen carrier (spindle-driven self-rotation) with synchronized orbital motion (planetary revolution) and low-frequency lateral oscillation (pendulum-style arm sweep)—to eliminate center-high topography and edge over-grinding commonly observed in single-axis systems. This three-degree-of-freedom motion architecture ensures uniform material removal rate across the entire specimen surface (up to Ø110 mm), delivering exceptional flatness, parallelism, and edge integrity without chamfering. The system is designed for reproducible, operator-independent sample preparation prior to optical microscopy, electron backscatter diffraction (EBSD), focused ion beam (FIB), or X-ray diffraction (XRD) analysis.
Key Features
- Triple-station planetary lapping & polishing platform with independent pendulum-arm oscillation (0–9 cycles/min, infinitely variable)
- High-precision platen with flatness ≤0.0025 mm per 25 mm × 25 mm zone, certified via optical interferometry
- Spindle assembly featuring axial runout <0.012 mm at carrier interface, ensuring minimal eccentric loading during polishing
- DC motor-driven main spindle (110 V DC, 375 W) enabling stable, low-vibration operation across full speed range (10–125 rpm)
- Digital RPM display and programmable timer (0–300 h countdown) for fully traceable process control
- Carrier plates fabricated from hardened stainless steel with certified parallelism (<0.003 mm) and surface finish Ra ≤0.05 µm
- Integrated water inlet/outlet ports compatible with standard laboratory tap water supply and gravity drainage systems
- Modular accessory interface supporting optional automated slurry delivery (SKZD-series drip dispensers), recirculating coolant pumps (YJXZ-12), and robotic precision control units (GPC-50A)
Sample Compatibility & Compliance
The UNIPOL-1502AT accommodates specimens up to Ø110 mm in diameter and ≤30 mm thickness—including silicon wafers (2″, 4″, 6″), sapphire substrates, metallographic mounts, geological thin sections, and ceramic tiles. Its mechanical design conforms to ISO 14644-1 Class 8 cleanroom compatibility when operated with filtered coolant and non-particulating consumables. While not intrinsically certified for GMP environments, the system supports GLP-compliant documentation workflows when used with external audit-trail-capable timers and calibrated RPM loggers. All electrical components meet IEC 61000-6-3 EMC emission standards and IEC 61000-6-2 immunity requirements. The unit is CE-marked for export configurations (AC 110/240 V, 50/60 Hz); domestic Chinese configurations comply with GB 4793.1–2007 safety standards.
Software & Data Management
The UNIPOL-1502AT is hardware-controlled via front-panel digital interface—no embedded firmware or proprietary software is required. Process parameters (speed, time, oscillation frequency) are set manually and retained only during active operation. For laboratories requiring electronic recordkeeping, integration with external data acquisition systems is supported via TTL-level pulse output (RPM monitoring) and dry-contact relay signals (start/stop status). When paired with optional GPC-50A robotic control modules, the system supports ASTM E3–22 compliant procedural logging, including timestamped parameter changes, cycle completion flags, and operator ID entry via external keypad interface. All accessories—including SKZD-4 automatic dispensers and YJXZ-12 recirculation pumps—are designed to operate within FDA 21 CFR Part 11–aligned validation frameworks when deployed with qualified third-party LIMS or ELN platforms.
Applications
- Preparation of cross-sectional TEM lamellae and EBSD-ready surfaces for crystallographic orientation mapping
- Final-stage polishing of metallographic samples (e.g., aluminum alloys, titanium, stainless steels) to sub-micron roughness (Ra < 0.02 µm)
- Planarization of semiconductor wafers prior to epitaxial growth or metrology calibration
- Surface conditioning of geological thin sections for quantitative petrographic analysis
- Edge-preserving flattening of brittle ceramics (Al₂O₃, SiC, ZrO₂) and optical glasses without microcracking
- Reproducible thickness reduction of battery electrode coatings and solid-state electrolyte discs
FAQ
What is the maximum specimen size supported by the UNIPOL-1502AT?
Specimens up to Ø110 mm in diameter and ≤30 mm in thickness can be mounted on the standard carrier plates.
Does the system require compressed air or vacuum?
No—UNIPOL-1502AT operates without pneumatic or vacuum support; only electrical power and liquid coolant are required.
Can the oscillation frequency be synchronized with platen rotation?
No—the pendulum-arm oscillation (0–9 cycles/min) and platen rotation (10–125 rpm) are independently adjustable but not phase-locked.
Is the platen removable for cleaning or replacement?
Yes—the Ø381 mm platen is secured via threaded fasteners and can be removed using standard hex tools; alignment dowels ensure repeatable reinstallation.
What certifications apply to the electrical safety design?
Export models carry CE marking per EN 61010-1:2010; domestic units comply with GB 4793.1–2007 and are inspected under CNAS-accredited factory quality protocols.
