SkyRay XIS1000 Benchtop X-ray Radiographic Inspection System
| Brand | SkyRay Instrument |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | XIS1000 |
| Configuration | Mobile (Fixed-Base) |
| Max. Tube Voltage | 160 kV |
| Max. Tube Current | 1.25 mA |
| Effective Field of View | 450 × 400 × 560 mm (Sample Cavity) |
| External Dose Rate (30 cm) | ≤0.306 µSv/h |
| Compliance | GBZ 117–2022, GBZ/T 250–2014 |
Overview
The SkyRay XIS1000 is a benchtop X-ray radiographic inspection system engineered for high-resolution, non-destructive internal structure analysis of small-to-medium-sized industrial components. Based on transmission X-ray imaging principles—where differential X-ray attenuation through materials generates contrast in digital radiographs—the system delivers quantitative structural integrity assessment without sample preparation or physical intrusion. Designed specifically for electronics manufacturing and precision die-casting applications, it operates at up to 160 kV tube voltage and 1.25 mA tube current, enabling reliable penetration of ferrous alloys (up to 15 mm steel), aluminum (up to 80 mm), and zinc/magnesium die-castings. Its digital static imaging architecture supports high signal-to-noise ratio acquisition, with defect detection sensitivity validated at ≥95% for sub-millimeter voids, micro-cracks, solder bridging, and interfacial delamination in PCB assemblies and cast components.
Key Features
- Integrated radiation safety architecture: Six-sided lead shielding, door-interlocked beam cutoff, emergency stop circuitry, real-time radiation monitoring, and audible/visual warning systems ensure full compliance with national occupational exposure limits.
- Compact footprint (810 × 780 × 1800 mm) with accessible sample cavity (450 × 400 × 560 mm), enabling flexible deployment in QC labs, production floors, or R&D environments without dedicated shielded rooms.
- Intuitive touch-based HMI with one-click acquisition, image annotation, measurement tools (distance, area, grayscale thresholding), and DICOM-compliant export for archival or cross-platform review.
- Native interoperability with SkyRay’s EDXRF spectrometers (e.g., EDX3600 series), allowing synchronized workflow execution: elemental composition verification → structural integrity validation within a unified software environment.
- Radiation performance certified per GBZ 117–2022 (Radiation Protection Requirements for Industrial X-ray Equipment) and GBZ/T 250–2014 (Guidelines for Radiation Monitoring in Non-Destructive Testing Facilities).
Sample Compatibility & Compliance
The XIS1000 accommodates samples up to 450 mm (W) × 400 mm (D) × 560 mm (H), making it suitable for printed circuit boards (PCBs), semiconductor packages, automotive die-cast housings, and precision machined parts. It supports both planar and angled projections via manual stage adjustment. All operational parameters—including tube voltage, current, exposure time, and detector gain—are logged with timestamp and operator ID, supporting GLP/GMP-aligned audit trails. While not FDA 21 CFR Part 11–certified out-of-the-box, the system’s data logging architecture is configurable to meet ISO/IEC 17025 documentation requirements for accredited testing laboratories.
Software & Data Management
The proprietary SkyRay NDT Suite provides image acquisition, enhancement (contrast stretching, noise filtering, edge sharpening), defect quantification (void volume estimation, crack length mapping), and report generation in PDF or CSV formats. Raw images are stored in lossless 16-bit TIFF format. The software includes role-based user accounts, session logging, and exportable metadata (exposure parameters, geometry settings, calibration history). When paired with SkyRay’s XRF platforms, the suite enables synchronized result correlation—e.g., overlaying alloy composition heatmaps onto radiographic cross-sections—to investigate material heterogeneity–defect co-location relationships.
Applications
- Electronics Manufacturing: Post-reflow solder joint inspection (cold solder, voiding, bridging), BGA/CSP package integrity verification, multilayer PCB trace continuity and via integrity assessment.
- Die-Casting Quality Control: Porosity and shrinkage cavity detection in Al/Zn/Mg alloy housings; crack propagation analysis in high-pressure die-cast components; correlation of alloy composition (via XRF) with localized porosity distribution.
- Academic & Training Use: Hands-on instruction in radiographic physics, attenuation modeling, image reconstruction fundamentals, and ASTM E94/E1742-compliant technique development.
FAQ
What standards does the XIS1000 comply with for radiation safety?
It meets GBZ 117–2022 and GBZ/T 250–2014, with external dose rate ≤0.306 µSv/h at 30 cm—well below the 2.5 µSv/h limit for controlled areas.
Can the system be integrated into an automated production line?
Yes—via Ethernet-based API (RESTful interface) for remote control, trigger synchronization, and pass/fail result forwarding to MES/SCADA systems.
Is image analysis software included with the base configuration?
Yes—the SkyRay NDT Suite is bundled, including measurement tools, annotation, and reporting modules; advanced AI-assisted defect classification is available as an optional module.
Does the system require a dedicated shielded room?
No—its six-sided lead enclosure and interlocked safety features eliminate the need for external shielding infrastructure under normal operating conditions.
How is calibration maintained over time?
The system includes built-in reference phantoms and automated flat-field correction routines; annual traceable calibration services are offered by SkyRay-certified engineers.
