Vacuum Drying Oven DP01/02/003
| Origin | China |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | DP003 / DP01 / DP02 |
| Chamber Volume | 27 L / 90 L / 216 L |
| External Dimensions (D×W×H, cm) | 66×48×72 / 67×67×152 / 82×82×167 |
| Internal Chamber Dimensions (D×W×H, cm) | 30×30×30 / 45×45×45 / 60×60×60 |
| Temperature Range | Ambient +20 °C to 200 °C |
| Temperature Uniformity | ±0.5 °C |
| Ultimate Vacuum | ≤ −1.0 kPa (absolute) |
| Heating Power | 1.5 kW / 2.5 kW / 3.5 kW |
| Control System | Microprocessor-based digital display with programmable setpoint |
| Safety Features | Over-temperature cutoff, vacuum pump overload protection, earth leakage circuit breaker |
Overview
The Vacuum Drying Oven DP01/02/003 is an engineered thermal processing system designed for controlled dehydration, solvent removal, and heat treatment under reduced pressure. Operating on the principle of lowering the boiling point of volatile substances via vacuum application—thereby enabling gentle, low-temperature drying of thermally sensitive materials—the oven integrates precise temperature regulation with robust vacuum integrity. It complies with JB/T 9505–1999, the Chinese national standard for vacuum drying equipment, and meets fundamental requirements for laboratory-grade thermal stability and pressure control in regulated environments. Its architecture supports applications where oxidation inhibition, moisture-sensitive sample integrity, or residual solvent elimination is critical—common in electronics component conditioning, aerospace material pre-treatment, pharmaceutical excipient drying, and polymer film annealing.
Key Features
- Microprocessor-controlled digital temperature interface with real-time setpoint adjustment and visual feedback; resolution: 0.1 °C, accuracy: ±0.3 °C at setpoint
- Stainless steel inner chamber (SUS304) with seamless welded corners and double-layer insulation for uniform thermal distribution and minimized energy loss
- Integrated vacuum monitoring port compatible with external analog or digital vacuum gauges (e.g., Pirani or capacitance manometers)
- Three-tier safety architecture: independent over-temperature cut-off relay (mechanical backup), vacuum pump motor overload detection, and Class I earth leakage protection per IEC 61000-4-5
- Front-mounted silicone-sealed observation window with anti-fog coating for continuous process visibility without vacuum break
- Modular design allowing optional integration of inert gas purge (N₂ or Ar) via standardized inlet/outlet ports (M12 threaded)
Sample Compatibility & Compliance
The DP series accommodates a broad range of sample forms—including PCB assemblies, ceramic substrates, lyophilized powders, coated optical filters, and elastomeric gaskets—without risk of surface oxidation or structural deformation. Chamber geometry ensures unobstructed airflow (via passive convection) and uniform pressure distribution across all volume tiers. All models are certified to JB/T 9505–1999 and conform to essential electromagnetic compatibility (EMC) and electrical safety clauses of GB 4793.1–2007 (equivalent to IEC 61010-1). While not intrinsically rated for hazardous area use, the ovens support GLP-compliant workflows when paired with validated vacuum pumps and calibrated temperature sensors traceable to NIM (National Institute of Metrology, China).
Software & Data Management
Standard configuration includes standalone operation with local data logging (optional RS485 Modbus RTU output for SCADA integration). When connected to third-party DAQ systems, time-stamped temperature and vacuum readings can be archived with audit-trail capability—supporting 21 CFR Part 11 readiness when implemented with electronic signature protocols and user-access controls. Firmware supports up to 10 programmable ramp-soak cycles, with automatic shutdown upon reaching final dwell time or vacuum breach. Calibration records (per ISO/IEC 17025 guidelines) may be stored externally using CSV export functionality.
Applications
- Pre-baking of printed circuit boards prior to conformal coating or solder reflow
- Drying of hygroscopic reference standards (e.g., potassium hydrogen phthalate, USP Grade) for gravimetric analysis
- Outgassing of space-grade adhesives and encapsulants per ECSS-Q-ST-70-02C
- Thermal stabilization of MEMS devices and piezoelectric ceramics
- Residual solvent removal from thin-film coatings in R&D photovoltaic labs
- Moisture content verification in battery electrode slurries (ASTM D2297–16)
FAQ
What vacuum level can the DP02 achieve, and how is it verified?
The DP02 reaches ≤ −1.0 kPa (absolute) under standard operating conditions, measured using a calibrated Pirani gauge referenced to atmospheric pressure. Verification requires periodic calibration against a primary standard manometer per ISO 2533.
Is the temperature uniformity validated across the full working volume?
Yes—uniformity is confirmed per JB/T 9505–1999 Annex B: nine-point mapping (3×3 grid) at mid-height yields ≤ ±0.5 °C deviation at 105 °C and 150 °C.
Can this oven be used for ASTM E145-compliant drying procedures?
It satisfies the thermal performance criteria of ASTM E145–22 (Section 7.2) for gravity-convection ovens, provided vacuum is maintained below 1.33 kPa and temperature stability is independently verified with NIST-traceable probes.
Does the unit include vacuum pump and tubing?
No—vacuum pumps, hoses, and trap assemblies are supplied separately based on required ultimate pressure and chemical compatibility (e.g., oil-free diaphragm vs. two-stage rotary vane).
