YANRUN YXQ-100 Intelligent Automatic Hot Mounting Press
| Brand | YANRUN |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | YXQ-100 |
| Instrument Type | Hot Mounting Press |
| Sample Diameter Options | Φ25 mm, Φ30 mm, Φ40 mm, Φ45 mm |
| Temperature Range | 0–300 °C |
| Heating Power | 2 × 1000 W |
| Heating Time Range | 0–99 min (adjustable) |
| Cooling Time Range | 0–99 min (adjustable) |
| Cooling Method | Automated Recirculating Water Cooling |
| Mounting Mode | Fully Automatic (PLC-Controlled) |
| Pressurization | Hydraulic |
| System Architecture | Floor-Standing Dual-Station Integrated Unit |
| Dimensions (W×D×H) | 700 × 560 × 1250 mm |
| Weight | 100 kg |
Overview
The YANRUN YXQ-100 Intelligent Automatic Hot Mounting Press is a floor-standing, dual-station, fully automated thermosetting embedding system engineered for high-throughput, repeatable, and dimensionally stable metallographic specimen preparation. It operates on the principle of hot compression molding—applying controlled heat and hydraulic pressure to consolidate thermosetting resins (e.g., phenolic, epoxy, or acrylic) around small, irregular, or fragile samples, thereby forming rigid, geometrically uniform mounts compatible with subsequent grinding, polishing, and microscopic analysis. Designed specifically for laboratories requiring GLP-compliant, traceable, and operator-independent mounting workflows, the YXQ-100 eliminates manual intervention in temperature ramping, dwell time, pressure application, and active cooling—critical parameters influencing mount integrity, edge retention, and void formation. Its dual-station architecture enables parallel processing of two specimens under identical or independently programmed conditions, significantly reducing cycle time per batch without compromising thermal or mechanical reproducibility.
Key Features
- PLC-based intelligent control system with 7-inch color touchscreen interface, supporting intuitive menu navigation, multi-step program storage (≥20 user-defined protocols), and real-time parameter monitoring (temperature, pressure, time, coolant flow status)
- Hydraulic pressurization system delivering consistent axial force across full stroke, minimizing sample distortion and ensuring uniform resin flow into micro-voids at the sample-resin interface
- Integrated recirculating water cooling circuit with adjustable flow rate and temperature setpoint (5–25 °C), enabling rapid post-cure quenching to suppress thermal degradation and minimize shrinkage-induced delamination
- Dual independent mounting stations with interchangeable steel mold sleeves—standard configurations support Φ25 mm, Φ30 mm, Φ40 mm, and Φ45 mm specimen diameters; optional quick-change tooling allows seamless transition between sizes without recalibration
- Programmable thermal profile control: independent adjustment of heating rate (°C/min), target temperature (0–300 °C), dwell duration (0–99 min), and cooling initiation threshold
- Self-diagnostic firmware with fault logging, emergency stop interlock, over-temperature cutoff, and low-coolant-level alarm—designed to meet IEC 61000-6-2 electromagnetic compatibility and IEC 61010-1 safety requirements
Sample Compatibility & Compliance
The YXQ-100 accommodates all thermosetting embedding media—including phenolic (high hardness, low shrinkage), epoxy (excellent edge retention, minimal porosity), and acrylic (fast cure, optical clarity)—and is compatible with metallic alloys, ceramics, composites, geological specimens, and electronic packaging materials. It does not support thermoplastic resins due to inherent creep under sustained load at elevated temperatures. The system supports ISO 14577 (metallic materials — instrumented indentation test), ASTM E3 (Standard Guide for Preparation of Metallographic Specimens), and ISO 643 (steels — micrographic determination of ferrite or austenite content) by ensuring dimensional stability, isotropic shrinkage <0.3%, and absence of interfacial gaps exceeding 5 µm. All operational parameters are timestamped and stored in non-volatile memory, satisfying audit-trail requirements under FDA 21 CFR Part 11 when paired with validated software export functionality.
Software & Data Management
The embedded HMI stores up to 20 customizable mounting protocols, each with full thermal-pressure-cooling sequence definition. Parameter logs—including actual vs. setpoint temperature curves, hydraulic pressure profiles, and coolant inlet/outlet temperatures—are exportable via USB to CSV format for integration into LIMS or QA documentation systems. Optional Ethernet/IP connectivity enables remote monitoring and centralized fleet management in multi-instrument labs. Firmware updates are performed offline via SD card, preserving data integrity during maintenance cycles. Audit trails include operator ID (optional RFID badge integration), start/stop timestamps, parameter modifications, and system error codes—all retained for ≥12 months.
Applications
- Routine quality control of castings, welds, and additive-manufactured components in aerospace and automotive foundries
- Failure analysis of fractured surfaces and interfacial layers in semiconductor packaging and PCB assemblies
- Microstructural evaluation of grain size, phase distribution, and inclusion morphology per ASTM E112 and ISO 643
- Preparation of cross-sections for FIB-SEM site-specific analysis where dimensional fidelity and edge protection are critical
- High-volume production labs performing >50 mounts/day with strict repeatability requirements (RSD <1.8% for mount height variation across 30 consecutive runs)
FAQ
What types of embedding resins are compatible with the YXQ-100?
Thermosetting resins only—including phenolic, epoxy, and acrylic formulations. Thermoplastic resins (e.g., polyethylene, polystyrene) are incompatible due to viscoelastic deformation under sustained pressure at elevated temperatures.
Is the cooling system self-contained, or does it require external chiller connection?
The unit includes an integrated recirculating water chiller with reservoir, pump, and heat exchanger; no external chiller is required. Tap-water supply is not recommended due to scaling and temperature instability.
Can the YXQ-100 be validated for GMP-regulated environments?
Yes—the system supports IQ/OQ documentation packages, configurable electronic signatures, and 21 CFR Part 11–compliant data export when used with validated reporting software. Calibration certificates for temperature and pressure sensors are available upon request.
What maintenance intervals are recommended for hydraulic and cooling subsystems?
Hydraulic oil replacement every 24 months; coolant solution refresh every 12 months or after 500 operating hours; mold sleeve inspection for wear or carbon buildup after every 200 cycles.
Does the YXQ-100 support automatic mold ejection?
No—ejection is manual via ergonomic lever mechanism after cooling completion. Automated ejection is available in the YXQ-200 series upgrade path.


