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YBCO Superconducting Thin Film on Substrate with Gold Top Electrode

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Brand Hefei Kejing
Origin Anhui, China
Manufacturer Type Authorized Distributor
Country of Origin China
Model YBCO/Au Bilayer Thin Film
Microwave Surface Resistance (Rs) < 0.5 mΩ @ 77 K, 10 GHz
Critical Current Density (Jc) > 2 MA/cm² @ 77 K, 0 T
Film Thickness 100–1000 nm (typical 300 nm), double-sided deposition
Thickness Uniformity ±4%
Substrate Diameter 2" or 3", single-side or double-side polished
Packaging Vacuum-sealed in Class 100 cleanroom bags within Class 1000 cleanroom environment, or individual wafer cassette

Overview

The YBCO/Au bilayer thin film is a high-performance superconducting material system engineered for cryogenic microwave and quantum electronic applications. It consists of a high-quality epitaxial Yttrium Barium Copper Oxide (YBCO, YBa₂Cu₃O₇₋δ) superconducting layer deposited on single-crystal substrates—typically LaAlO₃ (LAO), SrTiO₃ (STO), or MgO—and capped with a sputtered or evaporated gold (Au) top electrode. This architecture leverages the intrinsic high critical temperature (Tc ≈ 90 K) and exceptional microwave surface impedance characteristics of YBCO while enabling reliable electrical contact, solderability, and integration into planar microfabrication processes. The film operates in liquid nitrogen (77 K) environments, eliminating the need for expensive liquid helium cooling in many device configurations. Its low microwave surface resistance ( 2 MA/cm² at zero field and 77 K) make it suitable for high-Q passive components and sensitive active elements where minimal dissipative loss and strong nonlinearity are required.

Key Features

  • Epitaxial YBCO layer with sharp superconducting transition (ΔTc < 0.5 K) and high crystalline quality, verified by XRD θ–2θ and φ-scans
  • Gold capping layer (5–50 nm thick) providing stable, low-contact-resistance interface for wire bonding, flip-chip assembly, or photolithographic patterning
  • Double-sided deposition option ensures symmetric thermal and mechanical behavior—critical for resonator symmetry and stress management in multilayer circuits
  • Tight thickness uniformity (±4%) across 2-inch and 3-inch wafers, validated via spectroscopic ellipsometry and cross-sectional TEM
  • Available on standard polished substrates: single-side polished (SSP) or double-side polished (DSP) LaAlO₃ (001), SrTiO₃ (001), or MgO (001)
  • Processed and packaged in ISO Class 6 (1000) cleanroom; final vacuum sealing performed in ISO Class 5 (100) laminar flow hoods to prevent particulate contamination and surface oxidation

Sample Compatibility & Compliance

This YBCO/Au bilayer is compatible with standard microfabrication toolsets—including photolithography (UV and DUV), ion milling, reactive ion etching (RIE), and lift-off processing—enabling direct integration into RF/microwave circuit fabrication flows. All wafers undergo post-deposition annealing in controlled oxygen partial pressure to optimize stoichiometry and oxygen vacancy ordering, ensuring reproducible Tc and Jc. While not certified to specific ISO/IEC 17025 testing standards as a finished device, the manufacturing and handling protocols adhere to semiconductor-grade cleanliness and traceability requirements. Batch records include substrate lot ID, deposition date, Rs mapping data, and Jc verification points. The material meets baseline qualification criteria for use in research-grade superconducting quantum interference devices (SQUIDs), kinetic inductance detectors (KIDs), and filter banks compliant with IEEE Std 1118™ for cryogenic electronics.

Software & Data Management

Each wafer shipment includes a digital Certificate of Conformance (CoC) containing metrology summaries: Rs spatial maps (measured via microwave cavity perturbation or stripline resonator techniques), four-point probe Jc scans, AFM surface roughness (Rq < 0.4 nm over 5 × 5 µm), and XRD rocking curve full-width-at-half-maximum (FWHM < 0.2°). Raw data files (CSV, HDF5) are provided upon request for integration into laboratory information management systems (LIMS) or automated QC pipelines. No proprietary software is required; measurement metadata conforms to the ISA-88/ISA-95-aligned naming convention for materials traceability in GxP-aligned R&D environments.

Applications

  • High-Q superconducting microwave resonators and bandpass/bandstop filters for radio astronomy receivers (e.g., ALMA, SKA front-end modules)
  • Cryogenic low-noise amplifiers and passive limiters in satellite communication ground stations
  • Josephson junction arrays and rapid-single-flux-quantum (RSFQ) logic circuits operating above 40 K
  • Transition-edge sensor (TES) and kinetic inductance detector (KID) absorbers for far-infrared and THz astrophysics instrumentation
  • On-wafer calibration standards for cryogenic vector network analyzer (VNA) characterization up to 50 GHz
  • Test vehicles for evaluating interfacial degradation mechanisms under thermal cycling (4 K ↔ 77 K) and magnetic field exposure

FAQ

What substrate options are available for the YBCO/Au bilayer?
Standard substrates include LaAlO₃ (001), SrTiO₃ (001), and MgO (001), all available in 2-inch and 3-inch diameters with single-side or double-side polish. Custom orientations or alternative dielectrics (e.g., NdGaO₃) can be quoted upon request.

Is the gold layer pre-patterned or blanket-deposited?
The Au layer is deposited uniformly across the entire wafer surface. Patterning must be performed by the end user using standard lithographic and etch processes.

Can these films be used in magnetic fields?
Yes—YBCO retains substantial Jc up to ~1 T at 77 K, though Rs increases with applied DC or AC field amplitude. Performance under field is characterized per batch and documented in the CoC.

How is film quality verified prior to shipment?
Every lot undergoes non-destructive Rs mapping, Tc transition width measurement, and spot Jc validation. A representative sample from each batch is cross-sectioned and analyzed via TEM for interfacial integrity and grain structure.

Do you provide wafer-level process documentation for GLP/GMP alignment?
While supplied as a research-grade material component, full process logs—including chamber base pressure, O₂ partial pressure during anneal, target power densities, and cooldown profiles—are available under NDA for customers implementing internal quality systems aligned with ISO 9001 or FDA 21 CFR Part 11 audit requirements.

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