Zhengye X-ray Non-Destructive Testing System for Semiconductor and Battery Inspection

Overview

The Zhengye X-ray Non-Destructive Testing (NDT) System is an industrial-grade real-time radiographic inspection platform engineered for high-precision internal defect analysis in semiconductor packaging, lithium-ion battery cells, PCB assemblies, and other microelectronic components. Utilizing digital X-ray transmission imaging based on differential absorption principles, the system generates high-contrast grayscale projections of internal structures without physical contact or sample preparation. Unlike conventional destructive cross-sectioning or time-intensive CT reconstruction, this 2.5D inline inspection solution delivers rapid, repeatable, and quantitative assessment of voids, delaminations, solder bridging, electrode misalignment, foreign material inclusions, and weld integrity — all critical failure modes defined in IPC-A-610, JEDEC J-STD-020, and IEC 62133 standards.

Key Features

• 2.5D Metrology Engine: Supports calibrated geometric measurements including linear distance, circle diameter, concentricity of nested circles, and point-to-center offset — traceable to NIST-traceable calibration standards via embedded reference targets.
• CNC Path Programming: Enables memory-based motion scripting for repeatable multi-point inspection sequences; ideal for low-volume, high-mix production environments where manual repositioning introduces variability.
• Intelligent Navigation Interface: Features a large-field-of-view live preview window with mouse-driven auto-positioning; click any region in the radiograph to command the X-ray source and image intensifier to move synchronously to that coordinate with sub-pixel accuracy.
• Triaxial Precision Motion: Independent X-, Y-, and Z-axis movement of both X-ray tube and image intensifier — driven by stepper motors coupled with ground-precision ball screws and synchronous timing belts for vibration-damped, micron-level repeatability.
• Digital Image Processing Pipeline: Real-time histogram equalization, noise suppression (non-local means filtering), edge enhancement, and contrast optimization; supports DICOM, TIFF, PNG, and proprietary binary formats for archival and audit trail compliance.

Sample Compatibility & Compliance

The system accommodates samples up to 300 mm × 300 mm × 150 mm (W × D × H) with maximum weight capacity of 5 kg. It complies with GB/T 19001–2016 (ISO 9001:2015), GB 4793.1–2007 (safety requirements for electrical equipment), and meets electromagnetic compatibility per GB/T 18268.1–2010. While not certified for medical use, its radiation shielding design conforms to national occupational exposure limits (GBZ 126–2011) and includes interlocked door safety circuits, dose rate monitoring, and automatic beam cutoff during emergency stop activation. Software architecture supports GLP/GMP-aligned data integrity protocols including user access control, electronic signatures, and audit-ready event logs.

Software & Data Management

The proprietary Zhengye VisionInsight™ software provides a unified interface for acquisition, measurement, reporting, and data export. All measurement operations are timestamped and associated with operator ID, sample ID, and inspection program version. Raw images and processed results are stored in hierarchical folders with SHA-256 checksum validation. Export options include CSV for SPC integration, PDF reports with annotated images and pass/fail flags, and XML metadata compliant with ASTM E2698–21 (Standard Practice for Digital Radiographic System Qualification). Optional FDA 21 CFR Part 11 add-on enables role-based permissions, electronic signature workflows, and immutable audit trails required for regulated battery manufacturing facilities.

Applications

• Quality assurance of pouch, prismatic, and cylindrical Li-ion battery cells — detecting anode/cathode foil wrinkles, separator displacement, tab weld cracks, and electrolyte fill level inconsistencies.
• Semiconductor package inspection — identifying die attach voids, wire bond lift-off, mold compound delamination, and lead frame warpage in QFN, BGA, and SiP modules.
• Automotive electronics — verifying solder joint integrity in ADAS ECUs, power modules, and sensor housings prior to thermal cycling or humidity testing.
• Failure analysis labs — guiding targeted cross-sectioning by pre-locating subsurface anomalies identified via radiographic contrast deviation thresholds.
• Supplier qualification audits — generating objective, quantifiable evidence of internal conformity against engineering drawings and GD&T specifications.

FAQ

What is the minimum detectable feature size under standard operating conditions?
Feature resolution depends on focal spot size, source-to-object distance, and detector pixel pitch. With default configuration (microfocus X-ray tube, 5 µm focal spot, 1:1 magnification), the system resolves features ≥25 µm with ≥5% contrast difference.
Does the system support automated pass/fail decision logic?
Yes — users define measurement tolerances and logical rules (e.g., “circle diameter > 2.1 mm AND concentricity error < 0.05 mm → PASS”) within VisionInsight™; results are color-coded and exported to MES/SPC systems via OPC UA or TCP/IP.
Can the software integrate with existing factory automation infrastructure?
The system offers native Modbus TCP, Ethernet/IP, and RESTful API interfaces for bidirectional communication with PLCs, SCADA platforms, and cloud-based quality analytics suites.
Is remote diagnostics and software update capability available?
Yes — secure TLS-encrypted remote access is enabled via optional Zhengye RemoteCare™ module, supporting firmware updates, log retrieval, and real-time collaborative troubleshooting with technical support engineers.
What training and documentation are provided upon installation?
Includes on-site operator certification (8 hours), administrator workshop (4 hours), ISO/IEC 17025-aligned system validation protocol, and full electronic documentation suite (user manual, service manual, calibration certificate, and regulatory compliance dossier).