Zhengye XG5010 Semiconductor & Lithium Battery X-ray Non-Destructive Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG5010 |
| X-ray Tube Voltage | 90–130 kV (configurable) |
| X-ray Tube Current | 89–455 µA (configurable) |
| Focal Spot Size | 5–15 µm |
| Cooling Method | Forced Air Cooling |
| Detector Type | Image Intensifier / Flat Panel Detector |
| Field of View | Φ100 mm or 114.9 mm × 64.6 mm (configurable) |
| Detector Resolution | 1392 × 1040 or 1536 × 864 pixels (configurable) |
| Geometric Magnification | 12×–48× |
| Repeatability Accuracy | ±60 µm |
| Inspection Speed | ≥1.5 pts/sec (excluding loading/unloading and stage motion) |
| Stage Dimensions | 515 mm × 460 mm |
| Effective Inspection Area | 450 mm × 410 mm |
| Max Load Capacity | ≤5 kg |
| Radiation Safety | ≤1 µSv/hr (compliant with IEC 61331-1 and GBZ 138-2019) |
| Computer | 22" touchscreen LCD, Intel Core i5, 4 GB RAM, 500 GB HDD |
| System Dimensions | 1136 mm × 1076 mm × 1730 mm |
| Weight | ~750 kg |
| Power Supply | AC 220 V, 10 A |
| Operating Environment | 25 °C ± 3 °C, RH 50% ± 10% |
Overview
The Zhengye XG5010 is a high-precision, industrial-grade X-ray non-destructive inspection (NDI) system engineered specifically for semiconductor packaging validation and lithium-ion battery cell/module quality assurance. It operates on the principle of transmission radiography: X-rays generated by a microfocus tube penetrate the sample, and differential attenuation—governed by material density, thickness, and atomic number—is captured by a high-sensitivity digital detector. The resulting 2D projection image enables real-time visualization of internal structural features—including electrode alignment, weld integrity, tab placement, voids, foreign particles, separator wrinkles, and anode/cathode delamination—without physical contact or sample destruction. Designed for integration into production line environments or QC laboratories, the XG5010 delivers consistent sub-100 µm spatial resolution under geometric magnification, supporting both offline failure analysis (FA) and inline process monitoring workflows.
Key Features
- Configurable Microfocus X-ray Source: Adjustable tube voltage (90–130 kV) and current (89–455 µA) enable optimized contrast and penetration for diverse battery formats (cylindrical, prismatic, pouch) and semiconductor packages (QFN, BGA, SiP).
- Multi-Modal Imaging Platform: Supports interchangeable detectors—including image intensifiers and flat-panel detectors—with selectable field-of-view (Φ100 mm or 114.9 mm × 64.6 mm) and resolutions up to 1536 × 864 pixels—ensuring adaptability across resolution-versus-speed trade-offs.
- 2.5D Metrology Suite: Integrated measurement engine supports calibrated linear distance, circle diameter, concentricity, point-to-center offset, and gap analysis—all traceable to NIST-traceable standards and exportable in CSV/PDF format.
- CNC Path Programming: Enables repeatable, automated inspection sequences for small-batch or prototype validation; motion paths are recorded, edited, and replayed with sub-10 µm positional repeatability.
- Intuitive Navigation Interface: Large-scale live navigation window allows direct mouse-click targeting on the radiograph; the system automatically commands the XYZ stage to move and refocus at the selected coordinate within <1.2 seconds.
- Real-Time Image Processing: On-the-fly enhancement including contrast stretching, noise suppression (non-local means), edge sharpening, and dynamic range compression—preserving quantitative fidelity while improving visual interpretability.
Sample Compatibility & Compliance
The XG5010 accommodates standard lithium battery cells (up to 450 mm × 410 mm footprint, ≤5 kg), wafer-level packages, power modules, and PCB assemblies. Its open-stage architecture permits custom fixturing for irregular geometries. All radiation shielding meets IEC 61331-1:2014 and Chinese national standard GBZ 138-2019 for occupational exposure limits (≤1 µSv/hr at 5 cm from enclosure surface). Mechanical design complies with ISO 13857 (safety distances) and EN 61000-6-2/6-4 (EMC immunity/emission). Optional documentation packages support GLP/GMP audit readiness, including IQ/OQ protocols, calibration certificates (traceable to CNAS-accredited labs), and radiation safety logbooks.
Software & Data Management
The proprietary Zhengye VisionInspect™ software provides a unified interface for acquisition, analysis, reporting, and data governance. It supports DICOM, TIFF, PNG, and RAW image formats, with metadata embedding (operator ID, timestamp, exposure parameters, stage coordinates). Automated pass/fail classification uses configurable threshold-based rules or optional AI-assisted defect pattern recognition (trained on user-supplied datasets). Audit trails record all user actions—including parameter changes, measurements, and report exports—in accordance with FDA 21 CFR Part 11 requirements (electronic signatures, role-based access control, immutable logs). Data export includes XML-based structured reports compatible with MES/QMS platforms such as Siemens Opcenter, Rockwell FactoryTalk, or ETQ Reliance.
Applications
- Li-ion battery: Detection of electrode misalignment, tab welding defects (cracks, voids, insufficient fusion), jelly-roll deformation, separator folding, and foreign metallic contaminants.
- Semiconductor: Bond wire integrity assessment, die attach voiding, mold compound delamination, leadframe warpage, and solder bump bridging in advanced packaging.
- Power electronics: IGBT module solder joint inspection, copper layer integrity in DCB substrates, and thermal interface material distribution uniformity.
- R&D labs: Cross-sectional correlation of X-ray findings with cross-section SEM/EDS, enabling root-cause analysis of manufacturing-induced failures.
- Process validation: Quantitative tracking of defect frequency and morphology shifts across process parameter variations (e.g., laser welding energy, hot-press temperature, lamination pressure).
FAQ
Is the XG5010 compliant with international radiation safety regulations?
Yes—the system conforms to IEC 61331-1:2014 and incorporates redundant interlock circuits, lead-equivalent shielding (≥2.5 mm Pb), and real-time dose monitoring. Radiation surveys are provided with each installation.
Can the system be integrated into an automated production line?
Yes—RS-232, Ethernet/IP, and Modbus TCP interfaces enable PLC synchronization for trigger-based acquisition, conveyor handshaking, and reject signal output.
What level of training and technical support is offered?
Zhengye provides on-site installation commissioning, 3-day operator/software training, and remote diagnostics via TeamViewer. Standard warranty covers parts and labor for 24 months; extended service plans include annual preventive maintenance and software updates.
Does the software support multi-user permission levels?
Yes—administrator, engineer, and operator roles are enforced with password protection, session logging, and granular control over calibration access, report generation, and parameter modification.
Are calibration standards and traceability documentation included?
Yes—each system ships with a certified resolution test pattern (ISO 16234-1), step wedge phantom, and calibration certificate issued by a CNAS-accredited metrology lab, valid for 12 months.
