ZYJK5200 PCB Online X-ray Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Producer |
| Country of Origin | China |
| Model | ZYJK5200 |
| Pricing | Available Upon Request |
Overview
The ZYJK5200 PCB Online X-ray Inspection System is an industrial-grade, real-time non-destructive testing (NDT) platform engineered for high-throughput inline quality assurance in printed circuit board (PCB) and lithium-ion battery manufacturing environments. Utilizing microfocus X-ray transmission imaging with digital image intensifier detection, the system captures high-contrast radiographic projections of internal structural features—including solder joint integrity, via fill quality, void distribution, component placement accuracy, and internal delamination or foreign object debris (FOD). Designed for integration into automated production lines, the ZYJK5200 operates under continuous conveyor-fed or indexed station configurations, enabling 100% in-process inspection without disrupting cycle time. Its measurement architecture conforms to the principles of geometric magnification radiography, where source-to-object and object-to-detector distances are precisely controlled to ensure sub-pixel spatial resolution and dimensional repeatability across repeated scans.
Key Features
- Real-time 2.5D Metrology Engine: Supports calibrated linear distance, circle diameter, concentricity, point-to-center offset, and angular deviation measurements—each traceable to NIST-traceable reference standards via on-system calibration routines.
- CNC Path Programming: Enables full motion path recording and playback; users define inspection waypoints (X/Y/Z coordinates + exposure parameters), allowing repeatable, operator-independent evaluation of low-volume or multi-layer assemblies.
- Intelligent Navigation Interface: Features a dual-display workflow: a large overview map showing full-field-of-view (FOV) radiograph with interactive zoom/pan, and a synchronized high-magnification inspection window that auto-centers upon mouse-click selection—reducing operator fatigue and positioning error.
- Modular Motion Architecture: Employs precision-ground ball screws, timing belt-driven stepper motors, and closed-loop position feedback for X-ray tube and image intensifier axes (X, Y, Z), ensuring ±2 µm positional reproducibility over >10⁶ operational cycles.
- Digital Image Processing Suite: Native support for DICOM, TIFF, BMP, and PNG formats; includes real-time contrast enhancement, edge sharpening, noise suppression (non-local means filtering), histogram equalization, and ROI-based dynamic range optimization.
Sample Compatibility & Compliance
The ZYJK5200 accommodates PCB substrates up to 520 mm × 420 mm and thicknesses ranging from 0.2 mm to 6.0 mm—including rigid FR-4, flex-rigid hybrids, ceramic substrates, and pouch-cell battery laminates. It complies with IEC 61340-5-1 (ESD control), GB/T 19001–2016 (ISO 9001 equivalent), and meets electromagnetic compatibility requirements per GB/T 18268.1–2010 (IEC 61326-1). While not certified for medical use, its radiation shielding design satisfies national occupational safety limits (GBZ 138–2002) for industrial X-ray equipment. All measurement algorithms are validated per ISO/IEC 17025–2017 guidelines for testing laboratories, supporting GLP/GMP-aligned audit trails when paired with optional software modules.
Software & Data Management
The proprietary Zhengye VisionInsight™ software provides a unified interface for acquisition, analysis, reporting, and data archiving. Measurement results are timestamped and logged with full metadata (operator ID, job number, machine ID, exposure kV/mA, FOV, pixel size). Audit trail functionality records all user actions—including parameter edits, pass/fail overrides, and report exports—in immutable binary logs compliant with FDA 21 CFR Part 11 requirements (when configured with electronic signature and role-based access controls). Raw images and processed datasets export directly to SQL databases or network file shares; configurable SPC dashboards generate Cp/Cpk metrics, defect Pareto charts, and trend analysis for process capability monitoring.
Applications
- Automated detection of BGA solder bridging, voiding (>15% threshold), and head-in-pillow defects
- Quantitative assessment of copper pillar height variation and planarity in fan-out wafer-level packaging (FOWLP)
- In-line verification of laser-drilled microvia aspect ratios and plating uniformity
- Failure analysis of electrode lamination misalignment and separator wrinkles in prismatic and pouch Li-ion cells
- Post-reflow inspection of embedded passive components (e.g., resistors, capacitors) within HDI multilayer boards
FAQ
What is the minimum detectable feature size under standard operating conditions?
Under nominal magnification (geometric gain = 12×) and optimal kV settings (90–110 kV), the system resolves features ≥25 µm with ≥95% confidence using edge gradient analysis.
Does the system support automated pass/fail classification with custom rule sets?
Yes—VisionInsight™ allows rule-based logic trees defining tolerance bands, logical AND/OR conditions across multiple measurements, and conditional pass/fail flagging with visual overlay annotations.
Can the ZYJK5200 be integrated into a factory MES or SCADA environment?
It supports OPC UA and Modbus TCP protocols for bidirectional communication; RESTful API endpoints enable direct integration with SAP QM, Siemens Opcenter, or Rockwell FactoryTalk.
Is radiation safety training required for operators?
Per local regulatory requirements (e.g., NRC or provincial radiation safety authorities), personnel must complete certified industrial radiography safety training prior to system commissioning.
What maintenance intervals are recommended for long-term stability?
X-ray tube lifetime is rated at ≥8,000 hours; annual calibration of geometry and grayscale linearity is advised, with quarterly verification of mechanical repeatability using certified gauge blocks and step wedges.
