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| Brand | 4D TECHNOLOGY |
|---|---|
| Origin | USA |
| Model | 280SI |
| Automation Level | Fully Automatic |
| Sheet Resistance Range | 0.001 Ω/□ to 8×10⁵ Ω/□ (Standard) |
| Sheet Resistance Accuracy | <0.1% |
| Resistivity Range | 0.001 Ω·cm to 8×10⁵ Ω·cm (derived from sheet resistance and user-input film thickness) |
| Resistivity Accuracy | <0.1% |
| Substrate Size Support | 2–8 inch wafers (333-series supports up to 12 inch |
| Test Current Accuracy | <0.1% |
| Probe Force Adjustment Range | 90–200 g |
| Probe Tip Material | Tungsten carbide with sapphire bushings |
| Edge Correction Capability | Yes, within 3 mm from wafer edge |
| Measurement Speed | >45 points/min |
| Repeatability | <0.2% (per substrate) |
| Data Output | 2D/3D contour maps, statistical summaries, Excel-compatible reports |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-COA-001 |
| Rotation Accuracy | ±1 RPM |
| Max Adjustable Acceleration | 500–3000 RPM/s |
| Speed Range | 500–8000 RPM |
| Time Setting | 1–999 s |
| Max Substrate Size | 400 mm × 400 mm (customizable) |
| Power Supply | 220 V ±10%, 50/60 Hz |
| Power Consumption | ~100 W |
| Dimensions | 300 mm × 300 mm × 200 mm |
| Weight | ~10 kg |
| Vacuum Chuck | Standard |
| Liquid Dispense Control | Microliter-scale precision (µL-level) |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-MLM-001 |
| Resolution | 0.3 µm |
| Light Source Wavelength | 405 nm |
| Maximum Optical Power | 300 mW |
| Alignment Accuracy (Frontside) | ±0.1 µm (within 1 mm) |
| Alignment Accuracy (Backside) | ±1 µm (within 2.5 mm) |
| Writing Speed | 3–150 mm²/min |
| Substrate Compatibility | 2″–8″ wafers, glass, flexible substrates |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-MLM-002 |
| Light Source | High-intensity Hg lamp / 365 nm i-line / Optional 405 nm UV LED |
| Illumination Uniformity | ≥90% |
| Intensity Stability | ±2% |
| Intensity Density | ≥50 mW/cm² (at wafer plane) |
| Optical Resolution | ≤2 µm (contact mode), ≤5 µm (proximity mode) |
| Exposure Area | 25 mm × 25 mm (customizable) |
| Exposure Time Range | 0.01–60 s (0.01 s step) |
| Alignment Accuracy | ≤2 µm |
| Stage Repeatability | ≤1 µm |
| Substrate Compatibility | 2″–6″ Si, glass, quartz, flexible substrates |
| Power Supply | AC 220 V / 50 Hz / ≤300 W |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-MPS-001 |
| Type | Temperature-Controlled Manual Probe Station |
| Operation | Manual |
| XY Travel Range | 70 mm × 70 mm (with 360° rotation) |
| Z-Axis Stroke | 65 mm |
| Sample Stage Dimensions | 600 mm × 600 mm × 200 mm |
| Max Load Capacity | 10 kg |
| Microscope Compatibility | Stereo or Metallurgical Microscope with C-mount interface |
| Eyepiece Magnification | 20× |
| Working Distance | 18.9–33.61 mm |
| Optical Magnification Options | 5×/10×/20×/50×/100× |
| Imaging Resolution | ≤1.2 µm |
| CCD Camera | 640×480 resolution |
| Vertical Lift Range | 0–50 mm (motorized, speed 0.02–4 mm/s) |
| Electrical Rating | 220 V AC, max 1 A |
| Max Bias Voltage Support | ±1500 V |
| Control PC | Intel i7-7500T, 16 GB DDR4, 256 GB SSD, Windows 10 OS |
| Display | 1920×1080 Full HD |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-PRO-001 |
| Operation Type | Fully Automatic |
| Platform Size | 60 cm × 60 cm |
| XY Travel Range | 50 mm × 50 mm |
| Z Travel | 200 mm |
| Max Sample Size | 65 mm × 65 mm |
| Max Sample Weight | 4 kg |
| CCD Magnification Options | 5×, 10×, 20×, 50× (long-working-distance objective) |
| Vertical Speed Range | 0.02–4 mm/s |
| Rotation | 360° motorized |
| Illumination | Coaxial ring + transmitted backlight |
| Control Interface | Integrated touchscreen (780 mm × 600 mm display), software-driven with manual override capability |
| Environmental Operating Range | 0–40 °C, ≤80% RH |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-PRO-002 |
| Operation Type | Fully Automatic |
| Probe Positioning Resolution | 1 µm |
| Integrated Vacuum Pump | Yes |
| Display | 27-inch 2K Full HD Monitor |
| Motorized Axes | X-Y-Z with Sample Stage Heating & Vacuum Chuck Control |
| Optical Imaging | Nikon CCD Camera (Visible to Near-IR) |
| RF Connectivity | Supported with Multiple RF Connector Types (SMA, K, V) |
| Probe Compatibility | GGB (USA), Korean OEM, and Domestic Probes |
| External Instrument Integration | Picosecond/Femtosecond Lasers, Raman, SHG, Photoconductivity Systems |
| Brand | Abner |
|---|---|
| Model | ABN-VPS-001 |
| Temperature Range | −190 °C to +300 °C |
| Environment Options | Ambient, Vacuum, Inert Gas (N₂/Ar) |
| Operation Mode | Fully Automatic |
| Probe Station Type | Vacuum-Compatible Thermal Probe Station |
| Motion System | Precision XYZ Motorized Stage with Thermal Drift Compensation |
| Microscope Compatibility | Stereo and Metallurgical Microscope Mounting Interface |
| Safety Features | Dual-Stage Over-Temperature Protection, Interlocked Vacuum & Cooling System |
| Compliance | Designed for GLP-compliant lab environments |
| Brand | Accretech |
|---|---|
| Origin | Japan |
| Model | AD2000TS |
| Equipment Type | Semiconductor Wafer Slicing System |
| Application Domain | Silicon Wafer Dicing & Kerfless Slice Separation |
| Compliance Context | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Architecture | CNC-based Closed-loop Motion Control with Real-time Vibration Damping |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | AD3000T-PLUS |
| Pricing | Upon Request |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | AP3000 / AP3000e |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Compliance | ISO Class 4 Cleanroom-Compatible Design |
| Structural Rigidity | High-stiffness granite base with active/passive vibration isolation |
| Alignment System | Integrated ITV (Image Tile Vision) for sub-micron probe-to-pad registration |
| Probe Capacity | Multi-site parallel probing capability |
| Brand | Accretech |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | ChaMP-211 / ChaMP-232 / ChaMP-332 |
| Wafer Sizes Supported | 100 mm, 150 mm, 200 mm, and 300 mm |
| Head Configurations | 2–8 inch carrier compatibility |
| Footprint | Compact design optimized for R&D, pilot-line, and high-mix production environments |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Model | ChaMP-211 |
| Wafer Sizes Supported | 100 mm, 150 mm, 200 mm |
| Polishing Head Configurations | 2–8 inch |
| Automation Options | Optional auto-loader integration |
| Cleaning System | Integrated post-polish cleaning module |
| Endpoint Detection | Optional optical endpoint monitoring |
| Air-bearing Carrier Design | Yes |
| Edge Control | Ring-type independent pressure zones |
| Quick-change Retainer/Retaining Ring | <60-second swap time |
| Footprint | Compact design for R&D and pilot-line integration |
| Compliance | Designed to meet semiconductor cleanroom requirements (ISO Class 5 compatible), supports GLP/GMP-aligned process documentation workflows |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | ChaMP-232 |
| Wafer Compatibility | Φ100 mm, Φ150 mm, Φ200 mm |
| Polishing Head Type | Pneumatic Floating Head with Zonal Pressure Control |
| Endpoint Detection | Integrated Optical End-Point Monitoring System |
| Cleaning Module | Integrated ChaMP Wet Cleaning System |
| Compliance | Designed for Semiconductor Front-End Manufacturing Environments |
| Vendor Status | Authorized Distributor (Non-OEM) |
| Import Category | Imported Equipment |
| Brand | Accretech |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor CMP Equipment |
| Model | ChaMP-332 |
| Wafer Compatibility | Φ300 mm and Φ200 mm |
| Polishing Head Type | Pneumatic Floating Carrier with Zonal Pressure Control |
| Endpoint Detection | Integrated Optical End-Point Monitoring System |
| Cleaning System | Integrated ChaMP Wet-Cleaning Module |
| Edge Exclusion | ≤1.0 mm |
| Carrier Change Time | <60 seconds (ring-only replacement) |
| Compliance | Designed for ISO 14644-1 Class 5 cleanroom integration |
| Software Architecture | Windows-based control with audit trail and user access levels |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Model | Fortia |
| Wafer Size Support | Φ200 mm |
| Application Focus | DC High-Current/High-Voltage, Avalanche (L-Load), and Wide-Temperature Range Characterization of Power Devices |
| Temperature Range | -65 °C to +300 °C (configurable) |
| Probe Card Compatibility | Up to 330 mm² PLP (Probe Landing Pad) |
| Interface Standards | GEM/SECS-II, TCP/IP, GB-IB, VegaNet |
| Motion Control | Integrated ATi Unit (ACCRETECH TESEC Interface) with DARUMA Stage and Pressurized Chuck |
| Safety Features | Fast Path Interruption during Avalanche Testing, Fault-Triggered Electrical Isolation |
| Brand | Accretech |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor Processing Equipment |
| Model | HRG3000RMX |
| Pricing | Available Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | PG3000RMX |
| Type | Integrated Backside Grinding & CMP Stress-Relief System for Ultra-Thin Wafer Processing |
| Application | Front-End Wafer Preparation for 15 µm Final Thickness Production |
| Brand | ACCRETECH |
|---|---|
| Origin | Japan |
| Model | SS20 |
| Type | Semi-Automatic Diamond Blade Dicing Saw |
| Cutting Method | Wet/Dry Compatible Blade Dicing |
| Blade Diameter | Standard 6-inch (152 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Z-Axis Travel | ≥30 mm |
| Spindle Speed Range | 1,000–45,000 rpm |
| Coolant System | Integrated Deionized Water Delivery with Filtration |
| Machine Dimensions (W×D×H) | 1,200 × 950 × 1,700 mm |
| Weight | ≈ 1,200 kg |
| Compliance | CE Marked, ISO 9001 Certified Manufacturing Process |
| Control Interface | Touchscreen HMI with Programmable Motion Axes (X/Y/Z/θ) |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | FP-2000 |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Sample Types | Bare Wafers, Thin Wafers, Singulated Dies, CSP Substrates on Dicing Frames |
| Alignment Capability | Auto-Wafer Alignment, Auto-Probe-to-Pad Alignment, Die-Level Position Correction Software |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | UF200R |
| Wafer Size Capacity | 200 mm (8-inch) |
| Automation Level | Fully Automatic |
| Probe Station Type | RF Probe Station |
| Compliance | Designed for ISO Class 5 cleanroom environments |
| Structural Rigidity | High-stiffness chuck with ITV fine alignment system |
| Thermal Operation Range | Up to +150 °C |
| Key Software Capabilities | Inkless wafer mapping, multisite parallel probing, OTS optical auto-alignment |
| Motion Control | Upgraded servo-driven XYZθ stage with sub-micron repeatability |
| Application Domain | LSI/VLSI wafer-level parametric testing, RF device characterization, high-reliability IC qualification |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | UF190R / UF200R |
| Automation Level | Fully Automatic |
| Wafer Size Compatibility | 200 mm (8″) and 300 mm (12″) |
| Control Interface | Full-color TFT touchscreen HMI |
| Alignment System | Motorized auto-probe alignment with sub-micron repeatability |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 |
| Configuration | Dual-Sided, Closed-Loop, Up to 22 Probes |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Programmable Probe Tilt | ±6° |
| Max PCB Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Tip Radius | 50–500 µm |
| Analog Measurement Speed | Up to 1000 measurements/sec |
| 4-Wire Capability | Full per probe |
| Test Channel Count | Up to 128 non-multiplexed channels |
| Warpage Compensation | LaserScan + High-Resolution Vision |
| Compliance | Supports GLP/GMP audit trails, ASTM F2622 (for electronic assembly test systems), ISO/IEC 17025 traceability frameworks |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | Acculogic FLS980 |
| Type | Flying Probe Tester for PCBs |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Programmable Probe Angle | ±6° |
| Max. Configurable Probes | 22 (dual-side) |
| Max. PCB Size | 813 × 965 mm (32″ × 38″) |
| Max. Component Height | 85 mm |
| Max. Probe Tip Radius Range | 50–500 µm |
| Measurement Speed | Up to 1000 measurements/sec |
| Electrical Test Capability | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), Powered Functional Test up to GHz range |
| Compliance | Supports GLP/GMP audit trails, ASTM F2413-18 (PCB test methodology reference), ISO/IEC 17025 traceability framework (via software logging) |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | ACCULOGIC FLS980 Series |
| Pricing | Upon Request |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series |
| Configuration | Dual-Sided, Closed-Loop System |
| Maximum Probe Modules | 22 (top + bottom) |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Programmable Probe Angle | ±6° |
| Max PCB Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Tip Height | 45 mm |
| Tip Radius Range | 50–500 µm |
| Tip Profiles | Needle, Cup, Dome |
| Measurement Speed | Up to 1000 measurements/sec |
| Analog Test Capability | 4-wire per probe |
| Supported Test Modes | 2-wire, 4-wire, Quasi-4-wire, Powered Functional Test, Boundary Scan (JTAG), NetScan™ |
| Laser-Based Board Warpage Compensation | Yes |
| Vision System | High-Resolution Reference Camera with Advanced Image Processing |
| Motion Architecture | Frictionless Air-Gap Linear Shuttles |
| Compliance Framework | Supports GLP/GMP audit trails, ISO/IEC 17025 traceability workflows, and FDA 21 CFR Part 11–ready software logging (via Integrator™) |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series III |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Maximum PCB Size | 813 × 965 mm (32" × 38") |
| Programmable Probe Angle | ±6° |
| Max. Probe Count (Top + Bottom) | 22 |
| Measurement Speed | Up to 1000 measurements/sec |
| Electrical Test Capabilities | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), Powered Functional Test (up to GHz range) |
| Warpage Compensation | LaserScan-enabled Z-axis mapping |
| Vision System | High-resolution fiducial camera with advanced image processing |
| Compliance Support | ASTM F2413-18 (for test system validation), ISO/IEC 17025 traceability framework, GLP/GMP-aligned audit trail in Integrator™ software |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series III |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Max. Configurable Probes | 22 (dual-sided) |
| Programmable Probe Tilt Angle | ±6° |
| Max. PCB Size | 813 × 965 mm (32″ × 38″) |
| Max. Component Height | 85 mm |
| Max. Probe Tip Radius Range | 50–500 µm |
| Analog Measurement Speed | up to 1000 measurements/sec |
| Test Channel Count (non-multiplexed) | up to 128 |
| Laser-Based Board Warpage Compensation | Yes |
| Vision System | High-resolution fiducial camera with advanced image processing |
| Compliance | Designed for GLP/GMP-aligned test environments |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980Dxi |
| Motion Control | Closed-loop linear motor shuttles |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Maximum Probes | 22 (top + bottom) |
| Programmable Probe Tilt | ±6° |
| PCB Max Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Height | 45 mm |
| Tip Radius Range | 50–500 µm |
| Tip Geometry Options | Needle, Cup, Dome |
| Analog Measurement Speed | Up to 1000 measurements/sec |
| Measurement Modes | 2-wire, 4-wire, quasi-4-wire |
| Stimulus/Measurement Resources | Dual independent channels |
| Supported Test Types | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), NetScan™ |
| Warpage Compensation | Integrated LaserScan™ and high-res fiducial camera |
| Software Platform | Integrator™ with motion control & measurement algorithms |
| Compliance Framework | Supports GLP/GMP audit trails, ASTM F2627 (for PCB test system validation), ISO/IEC 17025 traceability workflows |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | SCORPION FiS 640 |
| Maximum Test Points | 1024 |
| Board Size Capacity | 350 mm × 400 mm |
| Fixture Change Time | < 60 s |
| Operating System | Windows-based |
| Embedded Network Analyzer | Yes |
| Software Compatibility | Compatible with Acculogic Flying Probe Test (FPT) platforms |
| Footprint | 1050 mm × 1050 mm |
| Fixture Reusability | Supports legacy SCORPION iCT7000 fixtures |
| Programmable Power Supply Integration | Up to 4 external iTH 7000-grade units (optional) |