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| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q150, Q235, Q240, Q310 |
| Type | Microwave-excited Capacitively Coupled Plasma (CCP) Resist Stripping System |
| Application Domain | Semiconductor Front-End-of-Line (FEOL) & Back-End-of-Line (BEOL) Processing, MEMS Fabrication, Advanced Packaging |
| Compliance | CE Marked, SEMI S2-0216 Certified, ISO 9001:2015 Quality Management System |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q235 (Q-Series) |
| Type | Benchtop Microwave Plasma Asher/Stripper |
| Application Domain | Semiconductor Fabrication, MEMS Processing, R&D Cleanroom Environments |
| Compliance | CE-marked, ISO 14644-1 Class 5 compatible installation, ESD-safe chamber design |
| Power Supply | 230 V AC, 50/60 Hz, 16 A |
| Microwave Frequency | 2.45 GHz |
| Max Chamber Volume | 12 L |
| Process Gas Compatibility | O₂, CF₄, SF₆, Ar/O₂ mixtures |
| Vacuum System | Integrated dry scroll pump (base pressure < 5 × 10⁻² mbar) |
| RF/Plasma Monitoring | Real-time forward/reflected power metering with auto-tuning impedance matching network |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q235/Q240 |
| Plasma Source | 2.45 GHz microwave, 600 W |
| Chamber Material | Quartz |
| Chamber Dimensions | Ø235 mm × 260 mm L |
| Maximum Wafer Size | 200 mm (8") |
| Footprint | 460 mm × 590 mm × 550 mm H |
| Gas Inlets | Standard 2-channel with digital MKS mass flow controllers |
| Chamber Door | Drawer-type with UV- and microwave-shielded viewport |
| Human-Machine Interface | 7" resistive touchscreen GUI running Windows CE |
| Optional | Dry pump package (with foreline trap & vibration isolation), Faraday cage, quartz boat, tri-color status beacon, up to 4 gas lines, export-grade crating and freight logistics |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q235/Q240 |
| Plasma Source | 2.45 GHz microwave, 600 W |
| Chamber | Quartz, Ø235 mm × 260 mm L |
| Max Wafer Size | 200 mm (8″) |
| Dimensions (L×W×H) | 460 × 590 × 550 mm |
| Gas Inlets | 2 standard + optional up to 4 |
| Mass Flow Controllers | Digital MKS type |
| Chamber Door | Drawer-type with UV/microwave-shielded viewport |
| Substrate Holder | Temperature-controlled wafer chuck |
| Control Interface | 7″ GUI touchscreen, Windows CE OS |
| Optional | Dry vacuum pump system, Faraday cage, quartz boat, tri-color status beacon |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q240 |
| Plasma Source | 2.45 GHz, 1200 W |
| Chamber | Quartz, Ø240 mm × 460 mm (21 L), accommodates up to 200 mm wafers |
| Dimensions (L×W×H) | 760 × 775 × 775 mm |
| Gas Lines | 3 standard + optional 4th line |
| Mass Flow Controllers | Digital MKS |
| Vacuum Door | Drawer-type with UV/microwave-shielded viewport |
| Wafer Chuck | Temperature-controlled |
| HMI | 10.4" touchscreen, Windows CE OS |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q240 |
| Plasma Source | 2.45 GHz microwave, 1200 W |
| Chamber | Quartz, Ø240 mm × 460 mm (21 L), max. 200 mm wafer capacity |
| Dimensions (L×W×H) | 760 × 775 × 775 mm |
| Gas Control | 3-channel digital MKS mass flow controllers |
| Vacuum Door | Drawer-type with UV/microwave-shielded viewport |
| Human-Machine Interface | 10.4" touchscreen GUI, Windows CE OS |
| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Equipment |
| Model | Refurbished Stepper Photolithography System |
| Pricing | Available Upon Request |
| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor & Service Provider |
| Equipment Origin | Imported |
| Model | Stepper Photolithography System – Technical Support & Refurbishment Package |
| Pricing | Available Upon Request |
| Brand | Amadyne |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Fab1 / catAP / EMU |
| Pricing | Upon Request |
| Brand | Ambrell |
|---|---|
| Origin | USA |
| Model | EASYHEAT 0112 |
| Maximum Power | 1.2 kW |
| Operating Frequency | 150–400 kHz |
| Input Voltage | 105–129 V / 198–250 V, Single-Phase |
| Input Apparent Power | 1.6 kVA |
| Heating Method | Non-contact electromagnetic induction |
| Application Type | Atmospheric (non-vacuum), rapid thermal annealing for conductive materials |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Application | In-situ alignment, surface activation, wafer bonding, and nanoimprint lithography (NIL) |
| Compliance | Designed for Class 100 cleanroom integration |
| Control Architecture | Motorized precision stages with sub-micron alignment repeatability |
| Vacuum Compatibility | <5×10⁻⁶ mbar base pressure |
| Thermal Bonding Range | Ambient to 500 °C |
| Alignment Accuracy | ≤±25 nm (3σ, optical auto-alignment mode) |
| NIL Capability | Compatible with rigid and soft stamps |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04 & AWB-08 Platform |
| Vacuum Base Pressure | ≤1×10⁻⁶ mbar |
| Maximum Bonding Force | 40 kN |
| Maximum Temperature | 560 °C |
| Anodic Bonding Voltage | 0–2.5 kV DC (up to 40 mA) |
| Alignment Accuracy | ±1 µm (in-situ, hot or cold) |
| Compatible Wafer Sizes | 2″, 3″, 4″, 5″, 6″, and 8″ |
| Bonding Environments | High vacuum, UHV (optional), controlled process gas (e.g., forming gas), or atmospheric inert gas |
| Optical System | Dual CCD microscope with through-the-lens illumination, visible + infrared imaging, real-time side-by-side wafer alignment display |
| Control Architecture | Fully automated PC-based system with recipe-driven operation, full parameter logging (voltage, current, integrated charge, temperature, pressure, force, separation, event timestamps), SPC-compliant data export, and remote diagnostic capability via secure network interface |
| Brand | Analysis |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 1300CSX |
| Price Range | USD $26,000–$39,000 (FOB US Port) |
| Max Substrate Diameter | 300 mm |
| Max Operating Temperature | 300 °C |
| Force Range | 0–445 N (0–100 lbf) |
| Speed Limit | 100 mm/s |
| Vacuum Level | −63.5 to −68.6 kPa (−25 to −27 inHg) |
| Nitrogen/CDA Supply | 689 kPa (100 psi), 28.3 L/min |
| Footprint | 1245 mm × 1003 mm × 1334 mm (W×D×H) |
| Weight | 187 kg (operational), 581 kg (shipping) |
| MTBF | >600 h / >6000 cycles |
| Uptime | >99% over 12 months |
| MTTR | <24 h |
| Throughput | 8–14 WPH (<150 mm), 4–8 WPH (200–300 mm) |
| Brand | Analysis |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Bonder300 |
| Pricing | Available Upon Request |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC120SE |
| Max. Rotation Speed | 12000 rpm |
| Speed Accuracy | ±1 rpm |
| Acceleration Range | 100–30000 rpm/s (no-load) |
| Substrate Diameter | 5–120 mm |
| Chamber Diameter | 200 mm |
| Programmable Steps per Recipe | 10 |
| Total Recipes Storage | 100 |
| Time Resolution | 0.1 s (max. step duration: 3000 s) |
| Display | 4.3-inch full-color TFT touchscreen GUI |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC150PE |
| Rotation Speed | 100–12,000 rpm |
| Rotation Time Resolution | 0.1 s |
| Max Acceleration | 30,000 rpm/s |
| Substrate Diameter | 5–150 mm |
| Chamber Diameter | 212 mm |
| Programmable Steps | 10 programs × 10 steps each |
| Power Input | AC 200–230 V |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC150PE |
| Max. Rotation Speed | 12000 rpm |
| Speed Resolution | 1 rpm |
| Max. Acceleration | 30000 rpm/s |
| Wafer Diameter Capacity | 150 mm |
| Chamber Diameter | 212 mm |
| Touchscreen Interface | 4.3-inch Color LCD |
| Programmable Steps | 100 Programs × 10 Steps Each |
| Spin Time Range | 0.1–3000 s |
| Time Resolution | 0.1 s |
| Chamber Material | CNC-Machined HDPE |
| Lid Material | Transparent Polycarbonate |
| Vacuum Interlock | Yes |
| User Password Protection | Yes |
| Leveling Adjustable Base | Yes |
| Auto-Dispense Interface | 1 Channel |
| Dimensions (L×W×H) | 310 × 254 × 250 mm |
| Power Input | AC 200–230 V |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC150SE |
| Max. Speed | 12000 rpm |
| Speed Accuracy | ±1 rpm |
| Speed Stability | <1 rpm |
| Max. Acceleration | 30000 rpm/s |
| Substrate Diameter | 5–150 mm (up to 6-inch wafers) |
| Chamber Diameter | 212 mm |
| Programmable Steps | 10 programs × 10 steps each |
| Touchscreen | 4.3″ color LCD |
| Control System | Industrial-grade PLC |
| Vacuum Interlock | Yes |
| Leveling Feet | Adjustable |
| Chamber Material | HDPE (chemically resistant) |
| Dimensions (L×W×H) | 310 × 254 × 254 mm |
| Power Input | AC 200–230 V |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC150SE |
| Rotation Speed | 100–12,000 rpm |
| Rotation Time Resolution | 0.1 s |
| Max Acceleration | 30,000 rpm/s |
| Substrate Diameter | 5–150 mm |
| Chamber Diameter | 212 mm |
| Speed Resolution | 1 rpm |
| Max Spin Duration | 3000 s |
| Programmable Steps | 10 programs × 10 steps each |
| Control Interface | 4.3-inch color touchscreen |
| Chamber Material | CNC-machined HDPE |
| Vacuum Pump | Integrated oil-free vacuum pump |
| Power Input | AC 200–230 V |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC160PE |
| Rotation Speed | 100–12,000 rpm |
| Speed Resolution | 1 rpm |
| Max. Acceleration (no-load) | 30,000 rpm/s |
| Substrate Diameter Range | 5–160 mm |
| Chamber Diameter | 220 mm |
| Control Interface | 4.3″ color touchscreen |
| Programmability | 100 user-defined programs, up to 10 steps per program |
| Spin Time Range | 0.1–3000 s (resolution: 0.1 s) |
| Vacuum Interlock | yes |
| Lid Safety Interlock | yes |
| Motorized Dispense Interface | 1 channel (optional auto-dispense upgrade) |
| Leveling Base | adjustable |
| Construction | 一体 molded HDPE chamber with concave splash-resistant interior walls |
| Included | oil-free vacuum pump, three standard chucks (customizable) |
| Brand | ANALYSIS |
|---|---|
| Origin | Beijing, China |
| Model | HC160SE |
| Rotation Speed | 100–12,000 rpm |
| Speed Resolution & Accuracy | ±1 rpm |
| Max Acceleration | 30,000 rpm/s |
| Maximum Substrate Diameter | 160 mm (6″ wafer) |
| Chamber Diameter | 220 mm |
| Programmable Steps | 100 programs × 10 steps each |
| Input Voltage | AC 100–230 V |
| Dimensions (L×W×H) | 358 × 250 × 255 mm |
| Chamber Material | HDPE |
| Housing Material | Stainless Steel (SUS) |
| Lid | Solvent-resistant polycarbonate (PC) |
| Safety Interlocks | Vacuum interlock + lid switch interlock |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC160SE |
| Rotation Speed | 100–12,000 rpm |
| Rotation Time Resolution | 0.1 s |
| Max Acceleration | 30,000 rpm/s |
| Substrate Diameter Range | 5–160 mm |
| Chamber Diameter | 220 mm |
| Speed Resolution | 1 rpm |
| Max Spin Duration | 3000 s |
| Programmable Steps | 10 programs × 10 steps each |
| Vacuum Interlock | Yes |
| Lid Safety Interlock | Yes |
| Motorized Dispense Protection | Yes |
| Waste Exhaust Port | Yes |
| User Password Protection | Yes |
| Adjustable Leveling Base | Yes |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Product Category | Domestic |
| Model | HC160SE |
| Price | Upon Request |
| Max. Rotation Speed | 12,000 rpm |
| Speed Resolution | 1 rpm |
| Max. Acceleration | 30,000 rpm/s |
| Maximum Substrate Diameter | 160 mm |
| Chamber Diameter | 220 mm |
| Programmable Programs | 100 × 10 steps |
| Touchscreen Interface | 4.3″ Color LCD |
| Vacuum & Lid Interlock Safety | Yes |
| Waste Exhaust Port | Yes |
| Auto-Dispense Interface | Standard (upgradable) |
| Power Input | AC 200–230 V |
| Dimensions (L×W×H) | 358 × 250 × 255 mm |
| Substrate Compatibility | Ø10–160 mm |
| Spin Time Range | 0.1–3000 s |
| Time Resolution | 0.1 s |
| Chamber Material | CNC-machined HDPE |
| Housing Material | Stainless Steel |
| Enclosure | Transparent Polycarbonate Lid |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC220PE |
| Maximum Rotation Speed | 0–10,000 rpm |
| Speed Resolution | 0.1 rpm |
| Acceleration Rate | up to 50,000 rpm/s (no-load) |
| Maximum Substrate Diameter | 220 mm |
| Chamber Diameter | 252 mm |
| Programmable Steps | 100 programs × 100 steps each |
| Time Resolution | 0.1 s per step |
| Uniformity | < ±3% (measured over central 150 mm of 150 mm Si wafer, edge exclusion 3 mm) |
| Motor Type | Industrial-grade 400 W servo motor with sealed rotor architecture |
| Chamber Material | HDPE (high-density polyethylene) |
| Enclosure Material | Electropolished stainless steel (316L-grade compatible) |
| Control Interface | 7-inch capacitive touchscreen HMI with embedded real-time OS |
| Exhaust Port Location | Bottom-mounted beneath chuck for laminar airflow optimization |
| Lid | Chemically resistant transparent polycarbonate with dual-seal gasket |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC220SE |
| Max Speed | 0–10000 rpm |
| Speed Resolution | 0.1 rpm |
| Speed Stability | < ±0.1 rpm |
| Acceleration | 0–50000 rpm/s (no-load) |
| Substrate Diameter Range | 5–220 mm |
| Chamber Diameter | 252 mm |
| Programmable Steps | 100 programs × 100 steps each |
| Touchscreen Interface | 8-inch color HMI |
| Vacuum Interlock | Yes |
| Lid Safety Interlock | Yes |
| Waste Drain Port | Yes |
| Leveling Adjustable Feet | Yes |
| Chamber Material | CNC-machined corrosion-resistant HDPE |
| Anti-splash Cavity Design | Concave inner wall geometry |
| Spin Direction | Reversible (CW/CCW) |
| Time Resolution | 0.1 s |
| Maximum Spin Duration | 3000 s |
| Uniformity | < ±3% (edge-excluded, 3 mm border) |
| Power Input | AC 200–230 V |
| Brand | ANALYSIS |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Product Origin | Domestic (China) |
| Model | HC300SE |
| Rotation Speed | 5000 rpm |
| Rotation Accuracy | ±50 rpm |
| Maximum Acceleration | 30,000 rpm/s |
| Substrate Diameter | 300 mm (12") |
| Chamber Diameter | 427 mm |
| Control Interface | Touchscreen + RS-232/USB/Ethernet |
| Process Memory | ≥200 user-defined programs |
| Vacuum Chuck Type | Pneumatic or electrostatic (configurable) |
| Power Supply | 220 V AC, 50/60 Hz |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HCH300P |
| Temperature Range | Ambient to 300 °C |
| Temperature Resolution | 0.1 °C |
| Temperature Uniformity | <1% across surface |
| Temperature Accuracy | ±0.5 °C |
| Ramp Rate | 0.1–15 °C/min (10-segment programmable) |
| Lift Stroke | 30 mm |
| Lift Resolution | 0.1 mm |
| Lift Steps | 5 per program |
| Program Storage | 100 user-defined lift + thermal profiles |
| Heating Power | 1000 W |
| Platen Size | 220 mm × 220 mm |
| Weight | 25 kg |
| Dimensions (D×W×H) | 450 × 300 × 295 mm |
| Control Interface | 7-inch full-color capacitive touchscreen |
| Surface Options | Anodized aluminum or PTFE-coated corrosion-resistant platen |
| Vacuum Adsorption | Integrated, triggered automatically during pin lift engagement |
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HCH300P |
| Maximum Substrate Size | 220 × 220 mm (compatible with ≤8-inch wafers) |
| Temperature Range | Ambient to 300 °C |
| Temperature Resolution | 0.1 °C |
| Temperature Uniformity | <1% across surface |
| Temperature Accuracy | ±0.5 °C |
| Timer Range | 0.1–100,000 s |
| Timer Resolution | 0.1 s |
| Pin-Lift Stroke | 0–30 mm |
| Pin-Lift Resolution | 0.1 mm |
| Heating Power | 1000 W |
| Weight | 25 kg |
| Dimensions (L×W×H) | 450 × 300 × 295 mm |
| Control Interface | 7-inch full-color capacitive touchscreen |
| Heating Plate Material | Anodized aluminum or PTFE-coated corrosion-resistant surface |
| Programmable Lift Steps | 5 per recipe |
| Stored Recipes | 100 user-defined programs |
| Safety Features | Radiant heat shielding cover, stainless steel chassis, thermal insulation design |
| Brand | Analysis |
|---|---|
| Model | HDJS10 |
| Type | Bottle-Top Dispenser-Based Manual Quantitative Dispensing System |
| Construction Materials | PTFE, FEP, BSG, PP |
| Max Operating Pressure | 500 mbar |
| Max Kinematic Viscosity Handling | 500 mm²/s |
| Max Liquid Temperature | 40 °C |
| Max Liquid Density | 2.2 g/cm³ |
| Volume Ranges | 0.5–5 mL (0.1 mL graduation), 1–10 mL (0.2 mL graduation), 2.5–25 mL (0.5 mL graduation), 5–50 mL (1 mL graduation) |
| Includes | Five Universal Bottle Adapters |
| Sterilization | Autoclavable (121 °C, 20 min) |
| Chemical Resistance | Broad-spectrum (acids, bases, solvents, photoresists) |