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| Brand | Annealsys |
|---|---|
| Origin | France |
| Product Type | Rapid Thermal Processing (RTP) Furnace |
| Temperature Range | Up to 2000°C (Zenith series) |
| Heating Rate | >250°C/s (AS-Micro) |
| Vacuum Capability | Down to 10⁻⁶ Torr (AS-Master) |
| Sample Diameter Support | 2 mm to 200 mm |
| Chamber Type | Cold-wall stainless steel or quartz tube |
| Heating Source | Halogen lamp array or tungsten filament |
| Temperature Measurement | Dual-sensor (pyrometer + thermocouple) |
| Control System | Digital PID with auto-tuning |
| Compliance | Designed for GLP/GMP-aligned lab environments, compatible with ASTM F1531 (RTP process validation), ISO 14644-1 Class 5 cleanroom integration |
| Brand | Annealsys |
|---|---|
| Origin | France |
| Model Series | RTP/RTCVD, DLI-CVD, DLI-ALD |
| Temperature Range | 0–2000 °C |
| Max. Ramp Rate | 250 °C/s |
| Cool-down Rate | 250 °C/s |
| Vacuum Capability | Down to 10⁻⁶ Torr |
| Heating Technology | Halogen Lamp (RTP), Tungsten Heater (Zenith), Dual-Side IR (AS-Premium) |
| Chamber Type | Cold-wall stainless steel or quartz tube |
| Substrate Compatibility | 2″ to 200 mm wafers, custom substrates, compound semiconductors |
| Compliance | Designed for GLP/GMP-aligned labs |
| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | EPS-300 / EPS-500 / EPS-1000 |
| Type | Manual probe station |
| Category | Temperature-controlled probe station |
| Compliance | Designed for ISO/IEC 17025-compliant lab environments, compatible with ASTM F1768 and SEMI S2/S8 safety standards |
| Software Interface | Analog signal output (BNC), optional digital I/O for external controller integration |
| Stage Travel | X/Y fine adjustment via micrometer drives (10 µm resolution), Z-axis manual lift with locking mechanism |
| Maximum Wafer Size | EPS-300: up to 4″ |
| EPS-500 | up to 6″ |
| EPS-1000 | up to 8″ |
| Thermal Options | Optional heated chuck (−40 °C to +200 °C) available on EPS-500 and EPS-1000 |
| Vacuum Compatibility | Standard vacuum-compatible baseplate (10⁻³ mbar) for glovebox or controlled-atmosphere integration |
| Brand | Amadyne |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Fab1 / catAP / EMU |
| Pricing | Upon Request |
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