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| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | Amadyne |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Fab1 / catAP / EMU |
| Pricing | Upon Request |
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