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| Key | Brand: Anritsu |
|---|---|
| Model | AF4B116AA75L |
| Wavelength | 1475 ± 15 nm |
| Output Power | Up to 650 mW |
| Fiber Type | SMF or PMF |
| Package | 14-pin butterfly with TEC and monitor PD |
| Compliance | Telcordia GR-468-CORE, RoHS |
| Application | EDFA pumping |
| Origin | Japan |
| Core Technology | FP-LD (Fabry–Pérot Laser Diode) |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | AP3000 / AP3000e |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Compliance | ISO Class 4 Cleanroom-Compatible Design |
| Structural Rigidity | High-stiffness granite base with active/passive vibration isolation |
| Alignment System | Integrated ITV (Image Tile Vision) for sub-micron probe-to-pad registration |
| Probe Capacity | Multi-site parallel probing capability |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | UF190R / UF200R |
| Automation Level | Fully Automatic |
| Wafer Size Compatibility | 200 mm (8″) and 300 mm (12″) |
| Control Interface | Full-color TFT touchscreen HMI |
| Alignment System | Motorized auto-probe alignment with sub-micron repeatability |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | FP-2000 |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Sample Types | Bare Wafers, Thin Wafers, Singulated Dies, CSP Substrates on Dicing Frames |
| Alignment Capability | Auto-Wafer Alignment, Auto-Probe-to-Pad Alignment, Die-Level Position Correction Software |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | UF200R |
| Wafer Size Capacity | 200 mm (8-inch) |
| Automation Level | Fully Automatic |
| Probe Station Type | RF Probe Station |
| Compliance | Designed for ISO Class 5 cleanroom environments |
| Structural Rigidity | High-stiffness chuck with ITV fine alignment system |
| Thermal Operation Range | Up to +150 °C |
| Key Software Capabilities | Inkless wafer mapping, multisite parallel probing, OTS optical auto-alignment |
| Motion Control | Upgraded servo-driven XYZθ stage with sub-micron repeatability |
| Application Domain | LSI/VLSI wafer-level parametric testing, RF device characterization, high-reliability IC qualification |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | N9040B UXA X-Series |
| Pricing | Available Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | PG3000RMX |
| Type | Integrated Backside Grinding & CMP Stress-Relief System for Ultra-Thin Wafer Processing |
| Application | Front-End Wafer Preparation for 15 µm Final Thickness Production |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | E5071C / E5092A ENA |
| Quotation | Available Upon Request |
| Frequency Range | 9 kHz to 4.5 GHz / 6.5 GHz / 8.5 GHz (DC-blocked) |
| Output Power | –55 dBm to +10 dBm |
| Display | 10.4-inch color touchscreen |
| Interface | Windows-based GUI with pull-down menus and softkey navigation |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | N5245A |
| Pricing | Upon Request |
| Brand | GBITEST |
|---|---|
| Model | GCP-CPX |
| Cooling Options | Liquid Nitrogen (LN₂) or Liquid Helium (LHe) |
| Base Temperature | <5 K (with LHe) |
| Sample Stage Diameter | Standard 2-inch, Optional up to 4-inch |
| Cooling Method | Direct cryogen immersion with multi-layer radiation shields |
| Temperature Monitoring | Multiple calibrated Pt sensors with ±10 mK stability |
| Operation Mode | Manual probe positioning |
| Construction | Stainless steel vacuum chamber with optical access windows |
| Vacuum Compatibility | <1×10⁻⁶ Torr typical base pressure |
| Radiation Shield Configuration | Dual-layer (LN₂ and LHe optimized) |
| Visual Access | Integrated quartz viewport on radiation shield |
| Mounting Interface | Standard SM1 (1.035"-40) and kinematic optical breadboard compatibility |
| Electrical Feedthroughs | 24-channel low-noise coaxial + 4-channel triaxial (optional) |
| Compliance | Designed per ISO 14644-1 Class 5 cleanroom handling guidelines for semiconductor lab use |
| Brand | ACCRETECH |
|---|---|
| Origin | Japan |
| Model | SS20 |
| Type | Semi-Automatic Diamond Blade Dicing Saw |
| Cutting Method | Wet/Dry Compatible Blade Dicing |
| Blade Diameter | Standard 6-inch (152 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Z-Axis Travel | ≥30 mm |
| Spindle Speed Range | 1,000–45,000 rpm |
| Coolant System | Integrated Deionized Water Delivery with Filtration |
| Machine Dimensions (W×D×H) | 1,200 × 950 × 1,700 mm |
| Weight | ≈ 1,200 kg |
| Compliance | CE Marked, ISO 9001 Certified Manufacturing Process |
| Control Interface | Touchscreen HMI with Programmable Motion Axes (X/Y/Z/θ) |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | N5193A UXG |
| Pricing | Available Upon Request |
| Brand | Accretech |
|---|---|
| Origin | Japan |
| Model | AD2000TS |
| Equipment Type | Semiconductor Wafer Slicing System |
| Application Domain | Silicon Wafer Dicing & Kerfless Slice Separation |
| Compliance Context | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Architecture | CNC-based Closed-loop Motion Control with Real-time Vibration Damping |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | GB-EFA1 |
| Pricing | Available Upon Request |
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