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| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | AP3000 / AP3000e |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Compliance | ISO Class 4 Cleanroom-Compatible Design |
| Structural Rigidity | High-stiffness granite base with active/passive vibration isolation |
| Alignment System | Integrated ITV (Image Tile Vision) for sub-micron probe-to-pad registration |
| Probe Capacity | Multi-site parallel probing capability |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | UF190R / UF200R |
| Automation Level | Fully Automatic |
| Wafer Size Compatibility | 200 mm (8″) and 300 mm (12″) |
| Control Interface | Full-color TFT touchscreen HMI |
| Alignment System | Motorized auto-probe alignment with sub-micron repeatability |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | FP-2000 |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Sample Types | Bare Wafers, Thin Wafers, Singulated Dies, CSP Substrates on Dicing Frames |
| Alignment Capability | Auto-Wafer Alignment, Auto-Probe-to-Pad Alignment, Die-Level Position Correction Software |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | UF200R |
| Wafer Size Capacity | 200 mm (8-inch) |
| Automation Level | Fully Automatic |
| Probe Station Type | RF Probe Station |
| Compliance | Designed for ISO Class 5 cleanroom environments |
| Structural Rigidity | High-stiffness chuck with ITV fine alignment system |
| Thermal Operation Range | Up to +150 °C |
| Key Software Capabilities | Inkless wafer mapping, multisite parallel probing, OTS optical auto-alignment |
| Motion Control | Upgraded servo-driven XYZθ stage with sub-micron repeatability |
| Application Domain | LSI/VLSI wafer-level parametric testing, RF device characterization, high-reliability IC qualification |
| Brand | GBITEST |
|---|---|
| Model | GCP-CPX |
| Cooling Options | Liquid Nitrogen (LN₂) or Liquid Helium (LHe) |
| Base Temperature | <5 K (with LHe) |
| Sample Stage Diameter | Standard 2-inch, Optional up to 4-inch |
| Cooling Method | Direct cryogen immersion with multi-layer radiation shields |
| Temperature Monitoring | Multiple calibrated Pt sensors with ±10 mK stability |
| Operation Mode | Manual probe positioning |
| Construction | Stainless steel vacuum chamber with optical access windows |
| Vacuum Compatibility | <1×10⁻⁶ Torr typical base pressure |
| Radiation Shield Configuration | Dual-layer (LN₂ and LHe optimized) |
| Visual Access | Integrated quartz viewport on radiation shield |
| Mounting Interface | Standard SM1 (1.035"-40) and kinematic optical breadboard compatibility |
| Electrical Feedthroughs | 24-channel low-noise coaxial + 4-channel triaxial (optional) |
| Compliance | Designed per ISO 14644-1 Class 5 cleanroom handling guidelines for semiconductor lab use |
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