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| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | PG3000RMX |
| Type | Integrated Backside Grinding & CMP Stress-Relief System for Ultra-Thin Wafer Processing |
| Application | Front-End Wafer Preparation for 15 µm Final Thickness Production |
| Brand | ACCRETECH |
|---|---|
| Origin | Japan |
| Model | SS20 |
| Type | Semi-Automatic Diamond Blade Dicing Saw |
| Cutting Method | Wet/Dry Compatible Blade Dicing |
| Blade Diameter | Standard 6-inch (152 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Z-Axis Travel | ≥30 mm |
| Spindle Speed Range | 1,000–45,000 rpm |
| Coolant System | Integrated Deionized Water Delivery with Filtration |
| Machine Dimensions (W×D×H) | 1,200 × 950 × 1,700 mm |
| Weight | ≈ 1,200 kg |
| Compliance | CE Marked, ISO 9001 Certified Manufacturing Process |
| Control Interface | Touchscreen HMI with Programmable Motion Axes (X/Y/Z/θ) |
| Brand | Accretech |
|---|---|
| Origin | Japan |
| Model | AD2000TS |
| Equipment Type | Semiconductor Wafer Slicing System |
| Application Domain | Silicon Wafer Dicing & Kerfless Slice Separation |
| Compliance Context | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Architecture | CNC-based Closed-loop Motion Control with Real-time Vibration Damping |
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