Empowering Scientific Discovery

Yixinkechuang Technology Group Co., Ltd.

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BrandLightFab
OriginGermany
ModelLightFab 3D
TechnologySelective Laser-Induced Etching (SLE)
Primary SubstrateFused Silica / Borosilicate Glass
Process TypeTwo-Step Direct-Write 3D Micromachining (Laser Modification + Wet Chemical Etching)
Feature ResolutionSub-µm Structural Detail
Etch Selectivity (Quartz)>500:1
Application DomainIntegrated Photonics, Microfluidics, MEMS-on-Glass, 3D Waveguide Writing, Hermetic Glass Packaging
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BrandYi Xin Technology
OriginBeijing, China
Manufacturer TypeAuthorized Distributor
Country of OriginChina
ModelAerosol Printing
PricingAvailable Upon Request
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BrandExaddon
OriginSwitzerland
ModelCERES
Printing ResolutionUp to 1 µm (typical)
Printable MaterialsCopper, Gold, Silver, Platinum, Nickel, and other electrodepositable metals
Operating EnvironmentAmbient laboratory conditions (no vacuum or inert gas required)
Technology PrincipleLocalized electrochemical deposition (LECD) with microfluidic ion delivery and nanoscale electrode positioning
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BrandNoivion
OriginCzech Republic
ModelAtOx
Operating PrinciplePulsed high-voltage dielectric barrier discharge (DBD) in pure oxygen gas
Max Pulse Voltage≤25 kV
Pulse Width<1 µs
Adjustable Pulse Frequency1–100 Hz
Typical Atomic Oxygen Flux Range5–6 × 10¹⁵ atoms/(s·cm²)
Estimated AO Kinetic Energy1–5 eV (corresponding to 4–8 km/s)
ComplianceASTM E2089, QJ 20422-2-2016
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BrandLPKF
OriginGermany
ModelLPKF ProtoLaser H4 / S4 / U4 / R4
Laser TypesNanosecond Green (532 nm), Nanosecond UV (355 nm), Picosecond Green (515 nm), Mechanical + Laser Hybrid
Max. Processing Accuracy100 µm line width / 50 µm spacing
Safety ClassClass 1 Laser System
Footprint< 1 m²
Power SupplyStandard AC Outlet + Compressed Air (6 bar)
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BrandCressington
OriginUnited Kingdom
Model208HR
Target MaterialsAu, Pt, Pt/Pd, AgI, Ir
Target Diameter57 mm
Control ModeAutomatic
Chamber Diameter150 mm
Sample Stage100 mm diameter, rotatable and tilt-adjustable
Sputtering GasArgon
Vacuum SystemIntegrated turbomolecular pumping (implied by HR designation and industry standard)
CoolingCold-stage sputtering architecture
ComplianceDesigned for SEM/EPMA sample preparation per ISO 16700 and ASTM E1558 practices
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