OK Instruments OK-TH-2 Semiconductor Live-Bias Temperature and Humidity Chamber
| Brand | OK Instruments |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Origin Category | Domestic (China) |
| Model | OK-TH-2 |
| Instrument Type | Benchtop |
| Condensation Method | Air-Cooled |
| Temperature Range | −40 °C to +150 °C |
| Humidity Range | 30–98 % RH |
| Temperature Uniformity | ≤ ±2 °C |
| Temperature Fluctuation | ±1 °C (high-temp), ±2 °C (low-temp) |
| Humidity Uniformity | ≤ ±3 % RH |
| Humidity Fluctuation | ±3 % RH |
| Heating Rate | 1.0–3.0 °C/min |
| Internal Chamber Dimensions (W×D×H) | 600 × 500 × 400 mm |
Overview
The OK Instruments OK-TH-2 Semiconductor Live-Bias Temperature and Humidity Chamber is an engineered environmental test system designed specifically for reliability validation of integrated circuits under powered operational conditions. Unlike standard climate chambers, the OK-TH-2 integrates precision thermal-hygrometric control with electrical signal integrity infrastructure—enabling real-time electrical testing of semiconductor devices (e.g., CPUs, memory ICs, power modules, automotive SoCs) while subjected to accelerated stress profiles per JEDEC JESD22-A101 (THB), JESD22-A110 (HAST), JESD22-A104 (TCT), and AEC-Q100 qualification requirements. Its core measurement architecture employs dual-loop PID-controlled refrigeration and steam-based humidification systems, coupled with a low-turbulence, laminar airflow distribution manifold calibrated for spatial uniformity across the full working volume. The chamber operates on a forced-air convection principle with optimized duct geometry and thermally balanced internal surfaces to minimize thermal gradients and condensation risk during dynamic transitions.
Key Features
- Benchtop form factor with compact 600 × 500 × 400 mm internal workspace—optimized for load board integration and probe station compatibility.
- Dual-stage air-cooled refrigeration system delivering stable operation from −40 °C to +150 °C, with programmable heating ramp rates of 1.0–3.0 °C/min.
- Steam-type humidification and desiccant-assisted dehumidification enabling precise RH control from 30–98 % RH at all temperature setpoints.
- Integrated high-density feedthrough panel (optional configuration) supporting up to 256-pin low-noise, shielded coaxial or triaxial connectors rated for DC–100 MHz bandwidth and <1 nA leakage current at 150 °C.
- Electromagnetic noise suppression design: grounded copper-shielded cavity walls, filtered AC power inputs, and vibration-isolated compressor mounting to maintain signal integrity during nanoscale current/voltage measurements.
- Real-time dew point monitoring and anti-condensation logic—automatically adjusting cavity wall temperature and local heater activation near DUT interfaces to prevent moisture accumulation on test sockets or bond pads.
Sample Compatibility & Compliance
The OK-TH-2 accommodates standard semiconductor test configurations including burn-in boards, socketed load boards, and direct-probe setups compatible with automated test equipment (ATE) platforms such as Teradyne UltraFLEX, Advantest V93000, and Chroma 3380 series. It supports device-level testing of bare die, packaged ICs (QFN, BGA, LGA), and multi-chip modules. All control algorithms and sensor calibrations conform to ISO/IEC 17025 traceability standards; temperature and humidity sensors are NIST-traceable platinum RTDs and capacitive hygrometers. The system meets mechanical and safety requirements of IEC 61000-6-2 (immunity) and IEC 61000-6-4 (emission), and its operational protocols align with GLP-compliant data integrity practices—including audit trail logging, user access controls, and electronic signature support when paired with optional OK-Link software.
Software & Data Management
The embedded OK-TH Control Suite provides intuitive touchscreen HMI with multi-segment profile programming, real-time graphing of up to eight channels (temperature, humidity, DUT voltage/current, dew point, chamber pressure), and CSV export of time-stamped datasets. Optional OK-Link PC software enables remote supervision via Ethernet/IP, SCPI command interface, and seamless integration with LabVIEW, Python (PyVISA), or TestStand environments. All test logs include metadata (operator ID, calibration status, firmware version) and support 21 CFR Part 11-compliant electronic records when deployed with validated user authentication and change-control workflows. Data encryption (AES-256) and automatic backup to network drives ensure long-term archival integrity for regulatory submissions.
Applications
- Accelerated reliability testing: THB (85 °C/85 % RH), unbiased HAST (130 °C/85 % RH), temperature cycling (−40 °C ↔ +125 °C), and high-temperature operating life (HTOL) per JEDEC and AEC-Q100 Rev H specifications.
- Dynamic parametric characterization: leakage current (IDDQ, IOFF), timing margin analysis, jitter evaluation, and thermal derating curves under bias.
- Fault injection for failure mechanism identification: electrochemical migration, corrosion-induced opens/shorts, intermetallic growth, and TDDB (time-dependent dielectric breakdown).
- Process qualification in OSAT and foundry environments: lot acceptance testing, wafer-level reliability screening, and post-reflow moisture sensitivity level (MSL) verification.
- Automotive electronics validation: pre-qualification of ADAS SoCs, power management ICs, and radar MMICs against AEC-Q100 stress test conditions.
FAQ
Does the OK-TH-2 support true live-bias operation with external ATE synchronization?
Yes—the chamber includes TTL-triggered start/stop I/O and IEEE-488 (GPIB) or Ethernet-based SCPI command support for synchronized test sequencing with industry-standard ATE platforms.
What is the typical calibration interval and traceability documentation provided?
Factory calibration is performed per ISO/IEC 17025 with NIST-traceable references; recommended recalibration interval is 12 months, with full calibration certificates and uncertainty budgets supplied.
Can the feedthrough panel be customized for non-standard connector types or higher channel counts?
Yes—OK Instruments offers configurable feedthrough solutions including SMPM, MMCX, and custom PCB-mount variants, with signal integrity validation reports available upon request.
Is the chamber suitable for testing ultra-low-power IoT chips (<1 µA standby current)?
Yes—its shielded architecture, low-leakage feedthroughs, and EMI-filtered internal power distribution enable stable measurement of sub-microamp currents without baseline drift or noise coupling.
How is condensation prevented during rapid transitions from low-temperature to high-humidity conditions?
The system implements adaptive dew point control, localized surface heating near DUT interfaces, and staged humidity ramping—all governed by real-time psychrometric feedback to maintain cavity relative saturation below 90 % at all times.
