OK-TS-80.120 Thermal Shock Test Chamber
| Brand | OK Instruments |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Product Origin | Domestic (China) |
| Model | OK-TS-80.120 |
| High-Temperature Range | +150 °C |
| Low-Temperature Range | −50 °C |
| Thermal Shock Range | −50 °C to +150 °C |
| Temperature Stability | ±2 °C |
| Heating Rate | 10 °C/min |
| Cooling Rate | 10 °C/min |
Overview
The OK-TS-80.120 Thermal Shock Test Chamber is a two-zone, mechanical transfer-type environmental test system engineered for accelerated reliability assessment under extreme thermal transients. It operates on the principle of rapid physical relocation of test specimens between independently controlled high-temperature and low-temperature chambers—enabling true step-change thermal stress application. Unlike gradual temperature cycling systems, this chamber subjects components and assemblies to abrupt thermal gradients that replicate real-world operational extremes encountered during aerospace ascent/descent, automotive under-hood thermal cycling, or outdoor electronics deployment across seasonal boundaries. The core objective is failure mode acceleration: revealing latent defects arising from coefficient-of-thermal-expansion (CTE) mismatches, interfacial delamination, solder joint fatigue, hermetic seal leakage, or microcrack propagation in dielectric layers.
Key Features
- Two-chamber architecture with fully independent temperature control loops: one high-temperature zone (up to +150 °C) and one low-temperature zone (down to −50 °C), eliminating cross-contamination and ensuring stable setpoint maintenance during transfer cycles.
- Motorized vertical transfer mechanism with ≤10-second transition time between zones—meeting IEC 60068-2-14 requirement thresholds for severe thermal shock severity levels.
- Robust stainless-steel internal construction with multi-layer insulation and optimized airflow design to minimize thermal lag and support reproducible ramp rates of 10 °C/min (heating) and 10 °C/min (cooling) under standard load conditions.
- Integrated over-temperature, over-pressure, and door interlock safety circuits compliant with IEC 61000-6-2 and EN 61000-6-3 electromagnetic compatibility requirements.
- Programmable dwell time per zone (1 min to 999 min), cycle count (1 to 9999), and total test duration—supporting both single-step and multi-segment thermal shock profiles.
Sample Compatibility & Compliance
The OK-TS-80.120 accommodates specimens up to 80 L internal volume (W × D × H: 400 × 400 × 500 mm) with a maximum payload of 15 kg on its motorized transfer basket. It supports standardized mounting fixtures for PCBs, ECUs, sensors, battery modules, and encapsulated semiconductor packages. The system conforms to key international test standards including IEC 60068-2-14 (Test Nb: Change of temperature), MIL-STD-202G Method 107, MIL-STD-883K Method 1010.8, JESD22-A104D, and GB/T 2423.22–2012. All temperature measurements are traceable to NIST-certified reference probes, and chamber uniformity is validated per ASTM E742-18 at ±2 °C across the working volume.
Software & Data Management
Equipped with OK-TCM v3.2 embedded controller firmware and optional PC-based OK-TestSuite software, the system provides full logging of chamber temperatures, transfer timing, cycle progression, and alarm events. Data export is supported in CSV and XML formats for integration into LIMS or quality management systems. Audit trail functionality meets GLP/GMP documentation requirements, with user access levels, electronic signatures, and 21 CFR Part 11-compliant data integrity controls available upon configuration. Real-time remote monitoring via Ethernet (Modbus TCP/IP) enables centralized lab fleet management.
Applications
- Aerospace & Defense: Qualification testing of avionics enclosures, radar transceivers, and flight-critical sensors exposed to stratospheric cooling followed by rapid re-entry heating.
- Automotive Electronics: Validation of ADAS controllers, power inverters, and battery management systems operating in engine bays or exterior mounting locations.
- Semiconductor Packaging: Assessment of wire bond integrity, mold compound adhesion, and die attach reliability for QFN, BGA, and SiP assemblies.
- Photovoltaic Modules: Accelerated evaluation of encapsulant delamination, solder joint degradation, and backsheet cracking under diurnal thermal cycling stress.
- Medical Devices: Environmental qualification of implantable electronics and diagnostic analyzers per ISO 13485 and IEC 60601-1-11 requirements.
FAQ
What distinguishes thermal shock testing from temperature cycling?
Thermal shock applies instantaneous temperature transitions between discrete extremes (e.g., −50 °C ↔ +150 °C), inducing high-magnitude thermal strain rates. Temperature cycling modulates temperature gradually within a single chamber, simulating slower environmental aging.
Does the OK-TS-80.120 support custom test profiles beyond standard specifications?
Yes—the controller allows user-defined multi-step sequences with variable dwell times, ramp rates, and zone selection, enabling simulation of non-standard operational envelopes such as asymmetric shock intervals or hold-at-extreme protocols.
Is calibration documentation included with shipment?
Each unit ships with a factory calibration certificate covering chamber temperature sensors and transfer timing verification, traceable to national metrology institutes per ISO/IEC 17025 guidelines.
Can the chamber be integrated into an automated test cell?
Yes—digital I/O ports and Modbus TCP/IP interface enable seamless synchronization with robotic handlers, data acquisition systems, and MES platforms for unattended batch testing.
What maintenance intervals are recommended for long-term stability?
Compressor oil and refrigerant filters require replacement every 2,000 operating hours; chamber door gaskets and sensor calibration should be verified annually or after 500 thermal shock cycles, whichever occurs first.
