English Product Name

Overview

The OK-TH Series Rapid Temperature Change Environmental Test Chamber is an engineered thermal stress screening system designed for accelerated reliability validation of electronic components, automotive modules, aerospace subsystems, and industrial control hardware. It operates on the principle of controlled thermal cycling—inducing repeated expansion and contraction in materials through precisely programmed transitions between extreme temperature limits. This mechanical fatigue mechanism accelerates the manifestation of latent defects including interfacial delamination, solder joint microcracking, coefficient-of-thermal-expansion (CTE) mismatch failures, and encapsulant voiding. Unlike standard thermal chambers, the OK-TH series delivers programmable ramp rates up to 25 °C/min across a full operational range of −70 °C to +150 °C, enabling compliance with stringent thermal shock and temperature change test protocols defined in IEC 60068-2-14, MIL-STD-810H Method 503.5, and JEDEC JESD22-A106B. Its dual-zone humidity control (20–98 %RH, optional down to 5 %RH) further supports combined environmental stress testing per IEC 60068-2-30 and GB/T 2423.22.

Key Features

• High-fidelity thermal ramping: Selectable linear rates from 5 to 25 °C/min, verified per ASTM E2047 calibration methodology using NIST-traceable Pt100 sensors
• Dual-stage refrigeration architecture with cascade R404A/R23 refrigerant circuitry—optimized for rapid pull-down below −40 °C without compressor overload or oil carryover
• SUS304 stainless steel chamber interior and insulated double-wall construction ensure long-term corrosion resistance and thermal integrity
• Intelligent touchscreen controller with real-time data logging, alarm history, and user-defined profile segmentation (up to 99 segments per cycle)
• Compliance-ready design: Built-in test record timestamping, password-protected parameter locking, and audit trail export (CSV/Excel) supporting GLP/GMP documentation requirements
• Modular internal dimensions (225 L to 1000 L) accommodate PCB assemblies, ECUs, battery packs, and small enclosures—custom configurations available for non-standard DUT footprints

Sample Compatibility & Compliance

The OK-TH chamber accommodates devices under test (DUTs) up to 100 cm × 100 cm × 100 cm, with standardized mounting rails and optional load-bearing shelves rated for 50 kg static capacity. Chamber airflow is optimized via adjustable vane diffusers to maintain uniform thermal distribution (±2 °C) and minimize localized stagnation—critical for validating thermally sensitive MEMS sensors and optoelectronic packages. The system meets structural and safety requirements per IEC 61000-6-2 (EMC immunity) and IEC 61010-1 (electrical safety). All test profiles are fully traceable to national standards including GB/T 2423.1 (cold), GB/T 2423.2 (dry heat), GB/T 2423.22 (temperature change), and GJB 150.5 (military temperature shock). Optional IQ/OQ documentation packages support FDA 21 CFR Part 11–compliant validation in regulated manufacturing environments.

Software & Data Management

The embedded controller firmware includes built-in data acquisition at 1-second intervals, with onboard storage for ≥30 days of continuous cycle logs. Exported datasets include chamber setpoint, actual temperature/humidity, ramp rate deviation, and alarm event timestamps—all time-synchronized to UTC. Optional PC-based software (OK-TestSuite Pro) enables remote monitoring via Ethernet, automated report generation (PDF/HTML), statistical process control (SPC) charting, and integration with enterprise MES/QMS platforms via Modbus TCP or OPC UA. Audit trails comply with ALCOA+ principles (Attributable, Legible, Contemporaneous, Original, Accurate, Complete, Consistent, Enduring, Available) for regulatory submissions.

Applications

• Pre-production HALT/HASS screening for consumer electronics and IoT edge devices
• Qualification testing of automotive ADAS modules per ISO 16750-4 and AEC-Q200
• Thermal aging studies of lithium-ion battery cells and BMS hardware
• Reliability assessment of avionics cooling systems under rapid ambient transition scenarios
• Validation of conformal coating adhesion and PCB laminate stability under cyclic humidity-temperature stress
• Material compatibility testing for medical device housings exposed to sterilization and storage environments

FAQ

What is the minimum dwell time between temperature extremes during a rapid cycle?

Dwell time is fully programmable—from zero seconds (true ramp-to-ramp transition) to 999 minutes—enabling both thermal shock and temperature change test methodologies.

Does the chamber support dew point control for low-humidity cycling?

Yes; optional desiccant-based dehumidification module achieves stable operation down to 5 %RH with ±1.5 %RH repeatability at 25 °C ambient.

Can the system be integrated into an existing factory automation network?

Standard Ethernet port supports Modbus TCP communication; optional OPC UA server license enables direct SCADA/MES integration.

Is third-party calibration certification included with delivery?

Factory calibration certificate (traceable to CNAS-accredited lab) is provided; on-site ISO/IEC 17025 calibration services are available upon request.

What maintenance intervals are recommended for the refrigeration system?

Compressor oil analysis and filter dryer replacement every 24 months; annual inspection of refrigerant charge and condenser coil cleanliness per manufacturer’s technical bulletin TB-OK-TH-07.