YANRUN AXQ-5Y Intelligent Automatic Hot Mounting Press

Overview

The YANRUN AXQ-5Y Intelligent Automatic Hot Mounting Press is a precision-engineered thermal compression mounting system designed for reproducible, high-integrity specimen encapsulation in metallurgical, ceramic, polymer, geological, and electronic materials laboratories. It operates on the principle of thermosetting resin consolidation under controlled heat and hydraulic pressure—enabling uniform cross-linking of phenolic, epoxy, or acrylic resins around irregular or fragile samples. Unlike manual or semi-automatic presses, the AXQ-5Y integrates closed-loop PID temperature regulation, programmable cycle timing, and synchronized hydraulic actuation to eliminate operator-induced variability. Its robust cast-aluminum frame and sealed heating chamber ensure thermal stability and long-term dimensional repeatability—critical for serial sample preparation in ISO/IEC 17025-accredited labs and GLP-compliant quality control environments.

Key Features

• Fully automatic hot mounting cycle with integrated PLC logic and 7-inch color touchscreen HMI for intuitive parameter entry, real-time status monitoring, and cycle history logging.
• Hydraulic pressure system delivering consistent, adjustable force (up to 12 MPa nominal) with automatic pressurization and depressurization—minimizing resin flash and edge deformation.
• PID-controlled heating element (1600 W) maintaining ±1.5 °C accuracy across the full 25–210 °C operating range; ramp rate configurable in 1 °C/min increments.
• Motor-driven vertical specimen elevator enabling precise positioning during resin flow and curing—critical for void-free embedding of porous or layered specimens.
• Integrated external chiller interface supporting continuous coolant circulation for rapid post-cure cooling (down to ambient +5 °C), reducing cycle time by up to 40% versus passive air cooling.
• Modular die cavity design accommodating standard specimen diameters (25/30/40/45 mm); custom inserts available for non-standard geometries including rectangular or multi-specimen arrays.

Sample Compatibility & Compliance

The AXQ-5Y supports a broad spectrum of specimen types—including ferrous and non-ferrous metals, sintered ceramics, PCB substrates, composite laminates, mineral thin sections, and elastomeric components—without compromising microstructural integrity. Its low-thermal-gradient chamber minimizes thermal shock during resin curing, preserving interfacial boundaries in multi-phase systems. The system complies with ASTM E3-22 (Standard Guide for Preparation of Metallographic Specimens) and ISO 15510:2021 (Metallographic specimen mounting—Requirements for hot mounting equipment). All electrical components meet CE and RoHS directives; optional audit-trail firmware enables compliance with FDA 21 CFR Part 11 for regulated pharmaceutical or medical device QA/QC workflows.

Software & Data Management

The embedded control firmware records each mounting cycle—including setpoint temperature, actual chamber temperature profile, applied pressure curve, dwell time, and cooling duration—in timestamped CSV format. Data export is supported via USB 2.0 port; no proprietary software installation is required. Optional Ethernet module enables remote monitoring and integration into LIMS platforms via Modbus TCP. Cycle logs include operator ID field (with optional RFID badge reader integration) to satisfy traceability requirements per ISO/IEC 17025 Clause 7.8.1.

Applications

• Metallurgical R&D: Encapsulation of as-cast, heat-treated, or welded metallographic sections for grain size analysis (ASTM E112), inclusion rating (ASTM E45), and phase quantification.
• Ceramic & Composite QA: Stabilization of brittle oxide or carbide specimens prior to precision sectioning and SEM-EDS cross-sectioning.
• Electronics Failure Analysis: Mounting of BGA solder joints, die-attach interfaces, and flex circuit traces without delamination or thermal artifact formation.
• Geological Petrography: Embedding of friable sedimentary or metamorphic rock chips for polished thin-section preparation and quantitative mineral mapping.
• Polymer Morphology Studies: Cold-mount-compatible mode (via external chiller bypass) enables low-temperature epoxy embedding of TPEs, hydrogels, or bio-based polymers.
• Automotive & Aerospace QC: High-throughput mounting of fatigue-tested coupons, turbine blade coatings, and additive-manufactured alloy builds for porosity and defect assessment per AMS 2300.

FAQ

What resin types are compatible with the AXQ-5Y?
Phenolic, epoxy, and acrylic thermosetting resins—both standard and low-viscosity formulations—are fully supported. Resin selection must align with specimen thermal sensitivity and final application (e.g., conductive epoxy for EBSD, transparent acrylic for optical clarity).
Can the AXQ-5Y perform cold mounting?
Yes—by disabling heating and utilizing the external chiller interface with ambient-temperature circulating coolant, the system functions as a precision cold-mount press using two-part epoxies or fast-cure acrylics.
Is calibration documentation provided?
Each unit ships with factory calibration certificates for temperature sensor (NIST-traceable Pt100) and pressure transducer (EN 61326-1 compliant), valid for 12 months from date of shipment.
What maintenance intervals are recommended?
Hydraulic oil replacement every 24 months; touchscreen calibration annually; chamber gasket inspection before each 100-cycle batch; full preventive maintenance (including PID tuning verification) recommended biannually.
Does the system support GMP/GLP audit trails?
With optional firmware upgrade (AXQ-5Y-ATL), full electronic signature capability, user-level access controls, and immutable cycle logs meeting ALCOA+ data integrity principles are enabled.