Kashiyama MU Series Oil-Free Diaphragm Vacuum Pump
| Brand | Kashiyama |
|---|---|
| Origin | Japan |
| Pump Type | Oil-Free Diaphragm Vacuum Pump |
| Model Series | MU (MUP600E / MUP1200E / MUP1800E / MUH3000) |
| Ultimate Pressure | 0.5 Pa |
| Maximum Pumping Speed | 10,000–50,000 L/min (depending on model) |
| Power Supply | 3-Phase AC 200–220 V, 50/60 Hz |
| Motor Power | 0.8–1.6 kW |
| Cooling Requirement | 2 L/min water or optional N₂ purge (0–60 L/min) |
| Dimensions (L×W×H) | 695×285×655 mm (MUP600E) to 910×420×900 mm (MUP1800E/MUH3000) |
Overview
The Kashiyama MU Series represents a generation of high-efficiency, oil-free diaphragm vacuum pumps engineered for continuous operation in semiconductor fabrication, plasma etching, thin-film deposition, and analytical instrumentation environments. Unlike rotary vane or scroll pumps requiring lubrication and periodic oil changes, the MU Series employs a robust multi-stage diaphragm architecture with PTFE-coated stainless-steel valves and reinforced elastomeric membranes—ensuring zero hydrocarbon contamination and long-term vacuum integrity. Its core design leverages optimized cam-driven diaphragm displacement and low-inertia valve actuation to deliver stable pumping performance across variable process loads, particularly under medium-duty cyclic conditions typical of reactive ion etching (RIE) and sputtering chambers. The series is rated for ultimate pressures down to 0.5 Pa (3.75 × 10⁻³ Torr), making it suitable for rough-to-medium vacuum applications where clean, dry, and chemically inert evacuation is mandatory.
Key Features
- Oil-free operation with fully sealed diaphragm stages—eliminates risk of backstreaming, particulate generation, or solvent interaction
- Energy-optimized motor and drive train delivering up to 35% smaller footprint vs. conventional 20,000 L/min mechanical pumps of comparable throughput
- Modular cooling interface supporting either recirculated water (2 L/min) or nitrogen purge (0–60 L/min) for thermal management in high-duty-cycle processes
- IP54-rated enclosure with vibration-damped mounting base and integrated exhaust silencing for laboratory and cleanroom integration
- Standardized electrical interface compliant with IEC 60034 and JIS C 4001 for seamless integration into OEM tool platforms and factory automation systems
- Extended service intervals (>8,000 operating hours between membrane replacements) enabled by fatigue-resistant diaphragm materials and precision-machined cam profiles
Sample Compatibility & Compliance
The MU Series is compatible with aggressive process gases including Cl₂, SF₆, CF₄, O₂, and Ar—commonly used in plasma etch and chamber cleaning cycles. All wetted surfaces are constructed from 316L stainless steel, PTFE, and FKM elastomers, ensuring resistance to halogen-based chemistries and oxidation. The pump meets ISO 8573-1 Class 0 (oil-free air standard) and complies with JIS B 8341-1 for vacuum pump performance testing. It supports GLP/GMP-aligned operational documentation through optional analog 4–20 mA vacuum feedback output and digital RS-485 Modbus RTU interface. While not certified to ATEX or IECEx for explosive atmospheres, its design conforms to SEMI S2-0217 safety guidelines for semiconductor manufacturing equipment.
Software & Data Management
The MU Series operates as a standalone vacuum source but integrates natively with host tool controllers via industry-standard protocols. Optional digital modules provide real-time monitoring of motor current, exhaust temperature, and pressure differential across stages—data logged at user-configurable intervals (1–60 sec) for trend analysis and predictive maintenance. Firmware supports firmware-over-the-air (FOTA) updates and includes audit-trail functionality for critical parameter changes, aligning with FDA 21 CFR Part 11 requirements when deployed in regulated QC/QA laboratories. No proprietary software license is required; configuration and diagnostics are accessible via web-based HMI (HTTP/HTTPS) or terminal command-line interface (CLI).
Applications
- Plasma etching and ashing systems requiring stable, hydrocarbon-free vacuum below 1 Pa
- Roughing pumps for turbo-molecular and cryogenic high-vacuum systems in surface science and electron microscopy
- Gas sampling and pre-concentration modules in GC-MS and residual gas analyzers (RGA)
- Vacuum drying ovens and lyophilizers in pharmaceutical R&D labs where solvent compatibility and sterility are critical
- OEM integration into automated material testing rigs, environmental simulation chambers, and vacuum packaging lines
FAQ
Is the MU Series suitable for use with corrosive process gases?
Yes—the pump’s wetted path is constructed from corrosion-resistant alloys and fluoropolymers, validated for continuous exposure to Cl₂, NF₃, and O₂ plasmas per JIS Z 8801 accelerated testing protocols.
What is the expected mean time between failures (MTBF) under typical semiconductor fab conditions?
Based on field data from Tier-1 equipment manufacturers, MTBF exceeds 12,000 hours at 70% duty cycle with scheduled membrane replacement every 8,000 hours.
Can the MU Series be operated in a vertical orientation?
No—it must be installed in the horizontal orientation specified in the mechanical installation manual to ensure proper diaphragm travel alignment and cooling fluid distribution.
Does the pump include built-in pressure regulation or automatic load balancing?
The MU Series does not incorporate active pressure control; however, its inherent flow-pressure curve provides stable performance across 10%–100% conductance range, and external PID-controlled throttle valves are recommended for precise chamber pressure management.
Are spare parts and service kits available globally?
Yes—Kashiyama maintains authorized distributor networks across North America, EMEA, and APAC, with diaphragm kits, valve assemblies, and calibration certificates available with ≤5 business day lead time.
