NILT
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| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | BEAM |
| Exposure Mode | Proximity-style Direct Write |
| Resolution | ≤500 nm (line width) |
| Light Source | UV Diode Lasers |
| Wavelengths | 365 nm, 385 nm, 405 nm |
| Illumination Uniformity | Optimized via Dynamic Beam Shaping & Real-time Power Calibration |
| Exposure Field | 106 mm × 106 mm or 150 mm × 150 mm (tileable) |
| Autofocus Speed | <1 s (piezo-driven closed-loop Z-control) |
| Pattern Writing Speed | <2 s per 10 mm × 10 mm field (at 500 nm resolution, AZ5214E resist) |
| Maximum Substrate Size | 6-inch (150 mm) wafers or square substrates up to 150 mm × 150 mm |
| Alignment Accuracy | <±200 nm (multi-layer, vision-based auto-alignment) |
| Software Interface | GDSII-native workflow with real-time pattern preview, tile stitching, and wafer-level navigation |
| Brand | NILT |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Exposure Mode | Proximity |
| Resolution | 500 nm |
| Light Source | UV Laser |
| Wavelengths | 405 nm, 365 nm, 385 nm |
| Illumination Uniformity | Direct-write scanning mode |
| Maximum Exposure Area | 150 mm × 150 mm |
| Compatible Substrate Sizes | Up to 6-inch wafers |
| Autofocus Speed | <1 s (piezo-driven closed-loop optical focus control) |
| Pattern Writing Speed | <2 s per defined exposure field |
| Alignment Method | Semi-automated multi-layer alignment with real-time image recognition |
| Software Interface | GDSII-compatible, CNC-style navigation (WASD), on-the-fly pattern placement, wafer-level map visualization |
| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CN1 |
| Price Range | USD 7,000 – 14,000 (FOB Copenhagen) |
| Minimum Feature Size | 20 nm |
| Thermal Imprint Temperature | 200 °C (upgradable to 240 °C) |
| UV Wavelength | 365 nm |
| Pressure Range | 0.3–11 bar |
| Vacuum Level | down to 0.1 mbar |
| Substrate/Template Max Diameter | 100 mm (4-inch), upgradable to 200 mm (8-inch) |
| Control | Fully computer-programmed, GUI-driven operation |
| Brand | NILT |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | CNI |
| Price Range | USD 42,000–70,000 (FOB) |
| Minimum Feature Size | <20 nm |
| Imprint Area Compatibility | 2-inch to 4-inch wafers (customizable) |
| Heating/Cooling Rate | Rapid thermal cycling (<60 s ramp-up/down) |
| Vacuum Requirement | 0.4–0.8 bar (vacuum flow ≥1 mL/min) |
| Pneumatic Supply | Compressed air or N₂ at 6–10 bar |
| Electrical Input | 110–240 V AC, 50–60 Hz, ≥200 W |
| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CNI V4.0 PV |
| Pricing | Upon Request |
| Imprint Area | Up to Ø210 mm (8″) |
| Chamber Height | 20 mm |
| Thermal NIL Max Temp | 200 °C (optional 250 °C module) |
| UV-NIL Wavelength | 365 nm (optional 405 nm module) |
| Vacuum Level | ≤0.1 mbar |
| Maximum Imprint Pressure | 11 bar |
| Control Interface | Laptop-based with dedicated software |
| Automation Level | Fully automated process execution (manual stamp/substrate loading) |
| Form Factor | Benchtop, modular, plug-and-play |