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Core Equipment Co., Ltd.

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BrandKorea Vacuum
OriginSouth Korea
ModelPECVD/RIE
Heating MethodHot-Wall
Application DomainSemiconductor Fabrication
Gas Channels8 (4 for PECVD, 4 for RIE)
Deposited FilmsSiOₓ, SiNₓ
Base Pressure1×10⁻⁷ Torr
Operating Pressure Range (PECVD)1×10⁻³ Torr
Operating Pressure Range (RIE)0.02–500 mTorr
Maximum Substrate Size8-inch (200 mm)
RF Source Power600 W, 13.56 MHz
RF Bias Power300 W, 13.56 MHz
Platen TemperatureUp to 400 °C
Pumping System200 L/sec corrosion-resistant turbomolecular pump (Pfeiffer TPH261PC) + BOC Edwards RV12 roughing pump
Gas DistributionShowerhead-type for both PECVD and RIE
Substrate HandlingManual loading with pneumatic top-hinged lid
Vacuum GaugesBaratron capacitance manometer (RIE), BOC Edwards wide-range gauge (PECVD & RIE)
MFC Count4 (PECVD), 3 (RIE)
CoolingWater-cooled platen and electrodes
Control InterfaceLabVIEW-based PC control with automated pressure regulation and process sequencing
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