Empowering Scientific Discovery

Core Equipment Co., Ltd.

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BrandEMU
OriginUK
Manufacturer TypeAuthorized Distributor
Import StatusImported
ModelSPPE
Throughput400 WPH
Wafer Diameters Supported75 mm / 100 mm, 125 mm / 150 mm, and 150 mm / 200 mm
ESD ProtectionFull Integrated ESD-Safe Architecture
CompatibilitySi, SiC, GaN, and Other Semiconductor Substrates
Control SystemEmbedded PC with Touchscreen HMI
Interface OptionsSECS/GEM Compliant
Cassette HandlingAuto-mapping with Dual-Slot & Cross-Loading Detection
SafetyReal-time Wafer Presence & Edge Detection Sensors
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BrandEMU
OriginUnited Kingdom
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelBatch Aligner and Elevator
Wafer Diameters Supported75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Alignment ReferenceFlat or Notch
Lifting MechanismDual Non-Vacuum Comb Lifters
IlluminationConfigurable LED (Standard: Red or White)
Substrate CompatibilitySi, SiC, GaN, and Other Compound Semiconductors
InterfaceTouchscreen HMI with Angle Selection for Edge Alignment
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BrandEMU
OriginUnited Kingdom
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelSelective Wafer Elevator
Wafer Diameters Supported75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Operation ModeManual Actuation with Indexed Slot Selection (e.g., slots 1, 6, 11, 16, 21)
Construction MaterialsCleanroom-Compatible Organic Polymers and Non-Shedding Structural Components
ComplianceDesigned for ISO Class 1–5 Cleanroom Environments
Substrate CompatibilitySilicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Sapphire, SOI
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BrandEMU
OriginUnited Kingdom
ModelSMIF Batch ID Reader
Wafer Size200 mm
Integration InterfaceGEM300 / SEMI E84
Cycle Time< 3 minutes
System ArchitectureIntegrated KUKA robotic handler + SMIF load port + IDWR200SMIF reader module
Application ScopeAutomated wafer lot tracking, SMIF pod-to-pod transfer, front-end fab traceability
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BrandEMU
OriginUK
Manufacturer TypeAuthorized Distributor
Product CategoryImported Equipment
ModelIDWR
Price RangeUSD 14,000 – 72,000 (FOB)
Compatible Wafer Diameters75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Throughput25 wafers per batch in ≤ 120 seconds (including cassette mapping, batch alignment, and full-surface ID reading)
Imaging SystemCognex In-Sight 1741 Smart Camera
Read TargetsLaser-etched marks and Data Matrix codes on wafer frontside and backside
Interface ProtocolsRS-232, Ethernet, SECS/GEM compliant
User InterfaceIntegrated industrial touchscreen with recipe management and maintenance diagnostics
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