Kashiyama MU-X Series Oil-Free Roots Vacuum Pump

Overview

The Kashiyama MU-X Series represents a high-efficiency, oil-free dry vacuum solution engineered for demanding semiconductor, flat-panel display (FPD), and advanced thin-film coating applications. Based on optimized Roots pumping architecture with precision-machined, dynamically balanced rotors and metal-to-metal sealing, the MU-X series eliminates hydrocarbon contamination risks inherent in oil-lubricated systems. Its core design principle leverages synchronized dual-lobe rotors operating in close clearance without contact—enabling continuous, pulsation-free gas transfer from atmosphere down to ultimate pressures of ≤0.5 Pa (depending on model). Unlike conventional scroll or diaphragm pumps, the MU-X achieves high volumetric throughput at low inlet pressures, making it particularly suitable for load-lock (L/L) chambers, transfer modules, and high-throughput vacuum processing lines where cleanliness, repeatability, and minimal footprint are critical.

Key Features

• True oil-free operation: No lubricants in the vacuum path ensures zero hydrocarbon outgassing—essential for ultra-high-purity process environments including photolithography, CVD, PVD, and atomic layer deposition (ALD).
• Compact footprint engineering: The MU100X model occupies only 450 × 230 × 275 mm, delivering 1,660 L/min pumping speed—the highest speed-to-volume ratio among comparable dry Roots pumps in its class.
• Low power consumption: Optimized motor and rotor dynamics reduce operational energy demand; the MU100X draws just 0.35 kW at ultimate vacuum, supporting sustainability goals without compromising performance.
• Robust mechanical architecture: Rotor assemblies are manufactured from hardened stainless steel with micro-precision ground surfaces; all internal components comply with ISO 8573-1 Class 0 (oil-free air) standards.
• Modular scalability: Six standardized models (MU100X through MU20N18X) cover pumping speeds from 1,660 to 30,000 L/min, enabling seamless system integration across chamber sizes and evacuation duty cycles.
• Integrated thermal management: Air-cooled stator and rotor housings maintain stable operating temperatures under continuous duty—no external water cooling required for standard configurations.

Sample Compatibility & Compliance

The MU-X Series is compatible with inert, reactive, and mildly corrosive process gases (e.g., N₂, Ar, O₂, CF₄, SF₆), provided gas handling accessories (e.g., condensate traps, chemical scrubbers) are deployed per application requirements. It is not rated for solvent vapors, explosive mixtures, or highly aggressive halogens (e.g., Cl₂, Br₂) without customized corrosion-resistant coatings. All units are CE-certified and conform to IEC 61000-6-2 (immunity) and IEC 61000-6-4 (emissions). Designed for integration into ISO 14644-1 Class 1–5 cleanrooms, the pump’s external surface finish meets SEMI F24 specifications for particle shedding. While not intrinsically safe, optional ATEX-compliant variants are available upon request for Zone 2 environments.

Software & Data Management

The MU-X operates as a standalone hardware module but supports analog (0–10 V / 4–20 mA) and digital (RS-485 Modbus RTU) interfaces for integration into facility-wide SCADA or MES platforms. Real-time status monitoring—including rotational speed, motor current, bearing temperature, and vacuum setpoint deviation—is accessible via OEM-supplied configuration utility. Audit trails for operational parameters (start/stop timestamps, fault logs, runtime hours) are stored onboard for ≥30 days and exportable in CSV format—supporting GLP/GMP-aligned documentation practices. Firmware updates follow secure signed-package protocols compliant with IEC 62443-3-3 SL2 requirements.

Applications

• Load-lock and transfer chamber evacuation in semiconductor front-end fabrication lines
• Backside cooling and wafer chucking in lithography steppers and etch tools
• Vacuum pre-pumping for turbo-molecular pump (TMP) booster stages
• Clean vacuum supply for analytical instrumentation (e.g., residual gas analyzers, mass spectrometers)
• High-vacuum drying and degassing in pharmaceutical lyophilization support systems
• Research-grade vacuum environments requiring hydrocarbon-free base pressure stability (e.g., surface science UHV chambers with ion getter pumps)

FAQ

Is the MU-X Series compatible with nitrogen purge operation?
Yes—N₂ purging is supported for enhanced contaminant removal and thermal stabilization; however, ultimate vacuum specifications (e.g., 1.5 Pa) are quoted without purge gas flow.
Can the power supply voltage be modified after shipment?
No—the factory-set voltage (3-phase AC 200–220 V, 50/60 Hz) is fixed and cannot be field-adjusted; custom voltage configurations must be specified prior to order.
What maintenance intervals are recommended for continuous 24/7 operation?
Under typical cleanroom conditions, rotor alignment verification and bearing inspection are advised every 12,000 operating hours; no routine oil changes or seal replacements are required due to the dry, oil-free design.
Does the MU-X meet FDA 21 CFR Part 11 requirements for electronic records?
While the pump itself does not store regulated electronic signatures, its data logging and export capabilities—when integrated with validated third-party software—can support Part 11 compliance within a qualified system architecture.
Are S-P (speed vs. pressure) curves available for each model?
Yes—full S-P characteristic curves, along with conductance correction factors and pumping speed derating data for common process gases, are provided in the technical appendix of the official Kashiyama MU-X Engineering Manual (Rev. 4.2, 2023).