KJ GROUP RF-100-LD 100W Manual Matching RF Power Supply
| Brand | KJ GROUP |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | RF-100-LD |
| Input Voltage | AC 110–240 V, 50/60 Hz |
| Output Power Range | 5–100 W (adjustable), stability ±1% |
| RF Frequency | 13.56 MHz, stability ±0.005% |
| Matching Method | Manual impedance matching |
| Cooling | Air-cooled |
| Noise Level | <50 dB(A) |
| Dimensions | 390 × 260 × 105 mm |
Overview
The KJ GROUP RF-100-LD is a compact, benchtop 100W radio frequency (RF) power supply engineered for low-power plasma generation in vacuum thin-film deposition systems. Operating at the industrial and scientific standard frequency of 13.56 MHz—allocated globally for ISM (Industrial, Scientific, and Medical) applications—the unit delivers stable, adjustable RF power output from 5 W to 100 W with ±1% power regulation accuracy and ±0.005% frequency stability. Designed specifically for integration with KJ GROUP’s 1-inch diameter magnetron sputtering head, the RF-100-LD enables cost-effective RF sputtering of dielectric and insulating materials—including SiO₂, Al₂O₃, ITO, and polymer precursors—where DC sputtering is ineffective due to target charging. Its solid-state RF amplifier architecture ensures consistent energy delivery into reactive or capacitive plasma loads under varying vacuum conditions (typically 1–50 mTorr), supporting reproducible film nucleation and stoichiometric control in R&D-scale coating processes.
Key Features
- Stable 13.56 MHz RF output with high-frequency stability (±0.005%) and low phase noise, compliant with international ISM band regulations
- Manually tunable impedance matching network for optimized power transfer into variable plasma load impedances—ideal for iterative process development and educational labs
- Wide input voltage compatibility (AC 110–240 V, 50/60 Hz) with built-in overvoltage, overcurrent, and thermal protection circuits
- Air-cooled thermal management system maintains operational reliability during extended duty cycles; acoustic emission limited to <50 dB(A) at 1 m distance
- Compact footprint (390 × 260 × 105 mm) facilitates integration into modular vacuum systems, gloveboxes, or teaching laboratory setups
- Front-panel analog controls with calibrated power adjustment knob and LED indicators for RF enable status and fault conditions
Sample Compatibility & Compliance
The RF-100-LD is validated for use with 1-inch diameter planar magnetron sputtering targets, including ceramic oxides, nitrides, fluorides, and composite insulators. It supports both continuous-wave (CW) and pulsed RF operation (externally triggered via TTL input, optional). The unit complies with CE marking requirements for electromagnetic compatibility (EMC Directive 2014/30/EU) and low-voltage safety (LVD Directive 2014/35/EU). While not certified to IEC 61000-6-3 for radiated emissions in fully shielded environments, it is intended for use within grounded, Faraday-caged vacuum chambers where RF leakage is contained per ISO 27827:2012 guidelines for laboratory plasma equipment. No regulatory certification for medical or aerospace-grade qualification is claimed.
Software & Data Management
The RF-100-LD operates as a standalone analog-controlled instrument without embedded firmware or digital communication interfaces (e.g., RS-232, USB, or Ethernet). Power level and RF enable/disable functions are managed exclusively via front-panel hardware controls. For automated process integration, users may interface the unit with external programmable logic controllers (PLCs) or data acquisition systems using its isolated 0–10 V analog power setpoint input and TTL-compatible RF ON/OFF trigger port (available as an optional upgrade). All operational parameters—including applied forward power, reflected power (via optional directional coupler), and chamber pressure correlation—must be logged externally. The device supports GLP-compliant manual recordkeeping but does not provide audit trails, electronic signatures, or FDA 21 CFR Part 11 compliance out of the box.
Applications
- R&D-scale RF magnetron sputtering of optical coatings, barrier layers, and transparent conductive oxides on silicon wafers, glass substrates, and flexible polymers
- Plasma-enhanced physical vapor deposition (PE-PVD) studies in academic thin-film laboratories and materials science curricula
- Low-power plasma cleaning and surface activation prior to adhesion promotion or ALD seeding
- Gas-phase plasma chemistry investigations requiring precise, repeatable RF power delivery at sub-100W levels
- Custom vacuum system prototyping where space, budget, and simplicity outweigh requirements for auto-matching or remote control
FAQ
Is the RF-100-LD compatible with non-KJ GROUP magnetron heads?
Yes, provided the connected magnetron presents a nominal 50 Ω input impedance and accepts 13.56 MHz RF input within the 5–100 W range. Manual matching may require recalibration depending on cable length, connector type, and chamber geometry.
Does the unit include a directional coupler or reflected power meter?
No. Reflected power monitoring requires an external 50 Ω directional coupler and RF power meter. KJ GROUP offers compatible couplers as optional accessories.
Can this power supply be used for plasma etching?
It is not recommended for reactive ion etching (RIE) applications due to insufficient power headroom and lack of impedance auto-tuning required for dynamic load shifts during etch chemistry transitions.
What vacuum feedthrough connector is recommended?
A standard SMA-F or N-type vacuum feedthrough rated for ≥2 kW peak power and UHV-compatible (≤1×10⁻⁹ mbar) is advised. KJ GROUP supplies a 0.75-inch inner-diameter quick-connect flange for direct mounting to 1-inch CF ports.
Is water cooling supported?
The base model is air-cooled. A separate recirculating chiller (16 L/min flow, 6 L reservoir) is available as an accessory for extended high-duty-cycle operation—but no internal liquid cooling channels are integrated into the RF-100-LD chassis.
